characterised by the formation of thin functional dielectric layers

Industry

CPC
H01L21/76829

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76829characterised by the formation of thin functional dielectric layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,967,522
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor memory devices
- Patent number 11,968,824
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain structure
- Patent number 11,955,553
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,888
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer in integrated circuits
- Patent number 11,942,419
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,935,835
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,935,787
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting metal gates and structures formed thereof
- Patent number 11,923,251
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hsiu Perng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capacitor array structure and method for forming the same
- Patent number 11,925,012
- Issue date Mar 5, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaojun Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor chip, and kit
- Patent number 11,914,300
- Issue date Feb 27, 2024
- FUJIFILM Corporation
- Tetsuya Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 11,915,974
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,903,192
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hard mask structure with repeating s...
- Patent number 11,901,187
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hwanyeol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,901,228
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 11,901,238
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect strucutre with protective etch-stop
- Patent number 11,901,221
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,894,269
- Issue date Feb 6, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect
- Patent number 11,894,263
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer to reduce bond pad necking and/or redistribution la...
- Patent number 11,862,592
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,862,463
- Issue date Jan 2, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 11,854,883
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing silicon-containing films
- Patent number 11,851,756
- Issue date Dec 26, 2023
- VERSUM MATERIALS US, LLC
- Ming Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices having dipole-inducing elements
- Patent number 11,855,098
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20240096849
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...
- Publication number 20240088022
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240071818
- Publication date Feb 29, 2024
- UNITED MICROELECTRONICS CORP.
- I-Wei Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reducing Loss of Dielectric Layer in IO Silicon Oxide Re...
- Publication number 20240071760
- Publication date Feb 29, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhenquan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS
- Publication number 20240071817
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240063113
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Sanghun CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240063064
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus Including a Capacitor and a Coil, and a System Having Suc...
- Publication number 20240038696
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240030342
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Uhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240030140
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- YONG KONG SIEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION
- Publication number 20240021517
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILLING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS
- Publication number 20240006229
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME
- Publication number 20230420383
- Publication date Dec 28, 2023
- Medtronic, Inc.
- Randolph E. Crutchfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411451
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- SEUNG MO KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230411144
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230411279
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP WITH INVERTED T-SHAPED LOWER PORTION EXTENDING THROUGH AT L...
- Publication number 20230411208
- Publication date Dec 21, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wensheng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A WIRING STRUCTURE, METHOD OF MANUFACTURING A SEM...
- Publication number 20230411161
- Publication date Dec 21, 2023
- Seoul National University R&DB Foundation
- Minsik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK
- Publication number 20230402318
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner for A Bi-Layer Gate Helmet and the Fabrication Thereof
- Publication number 20230387264
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Performing Chemical-Mechanical Polishing Process in Semi...
- Publication number 20230386910
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20230386827
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT
- Publication number 20230386899
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED...
- Publication number 20230386907
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qi-Zhong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A LOGIC DEVICE AND ANOTHER DEVICE
- Publication number 20230378258
- Publication date Nov 23, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20230378255
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONECT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20230377956
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230377966
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FLUORINE-CATCHING LAYER
- Publication number 20230378070
- Publication date Nov 23, 2023
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the formation of thin functional dielectric layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Amorphous layers for reducing copper diffusion and method forming same

Method of manufacturing semiconductor device, substrate processing...

Semiconductor memory devices

Semiconductor device including a porous dielectric layer, and metho...

Source/drain structure

Reverse selective etch stop layer

Semiconductor device

Etch stop layer in integrated circuits

Methods of manufacturing semiconductor devices

Selective deposition for integrated circuit interconnect structures

Semiconductor device and a method for fabricating the same

Methods of cutting metal gates and structures formed thereof

Capacitor array structure and method for forming the same

Manufacturing method of semiconductor chip, and kit

Integrated circuitry, a memory array comprising strings of memory c...

Methods and devices for subtractive self-alignment

Semiconductor device and method of manufacturing

Semiconductor device including hard mask structure with repeating s...

Self-aligned scheme for semiconductor device and method of forming...

Semiconductor device structure

Interconnect strucutre with protective etch-stop

Integrated assemblies and methods of forming integrated assemblies

Local interconnect

Interconnect structures and methods of fabrication

Anti-fuse with laterally extended liner

Sidewall spacer to reduce bond pad necking and/or redistribution la...

Metal oxide nanoparticles as fillable hardmask materials

Interconnect structure and method for forming the same

Methods for depositing silicon-containing films

Semiconductor devices having dipole-inducing elements

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...

SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method for Reducing Loss of Dielectric Layer in IO Silicon Oxide Re...

ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS

SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME

INTEGRATED DIPOLE REGION FOR TRANSISTOR

Apparatus Including a Capacitor and a Coil, and a System Having Suc...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION

GAP FILLING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS

INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

AIR GAP WITH INVERTED T-SHAPED LOWER PORTION EXTENDING THROUGH AT L...

METHOD OF FORMING A WIRING STRUCTURE, METHOD OF MANUFACTURING A SEM...

VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK

Liner for A Bi-Layer Gate Helmet and the Fabrication Thereof

Semiconductor Package Including Step Seal Ring and Methods Forming...

Methods of Performing Chemical-Mechanical Polishing Process in Semi...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

LOCAL INTERCONNECT

DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED...

METHOD AND STRUCTURE FOR A LOGIC DEVICE AND ANOTHER DEVICE

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

METHOD OF FORMING AN INTERCONECT STRUCTURE OF A SEMICONDUCTOR DEVICE

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE STRUCTURE WITH FLUORINE-CATCHING LAYER