consisting of thin flexible metallic tape with or without a film carrier

Industry

CPC
H01L23/49572

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49572consisting of thin flexible metallic tape with or without a film carrier

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stretchable circuit substrate
- Patent number 11,877,393
- Issue date Jan 16, 2024
- LG Innotek Co., Ltd
- Duck Hoon Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,696,402
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex-foil package with coplanar topology for high-frequency signals
- Patent number 11,521,919
- Issue date Dec 6, 2022
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,457,531
- Issue date Sep 27, 2022
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with selective corrosion protection of electric connection...
- Patent number 11,410,942
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film and display device
- Patent number 11,355,425
- Issue date Jun 7, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Kaiwen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked die package with flexible interconnect
- Patent number 10,892,248
- Issue date Jan 12, 2021
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and heat-dissipation structure for a chip package
- Patent number 10,770,368
- Issue date Sep 8, 2020
- Novatek Microelectronics Corp.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,575,403
- Issue date Feb 25, 2020
- Samsung Display Co., Ltd.
- Sung-dong Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display panel and display device
- Patent number 10,409,120
- Issue date Sep 10, 2019
- Xiamen Tianma Micro-Electronics Co., Ltd.
- Guochang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaging architecture
- Patent number 10,396,038
- Issue date Aug 27, 2019
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing lead frame
- Patent number 10,381,292
- Issue date Aug 13, 2019
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display apparatus having a bending area cutout
- Patent number 10,340,326
- Issue date Jul 2, 2019
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Shipeng Yuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 10,306,763
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnect device, manufacturing method for molded interco...
- Patent number 10,304,762
- Issue date May 28, 2019
- Olympus Corporation
- Keigo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic apparatus, moving object, and method...
- Patent number 10,249,513
- Issue date Apr 2, 2019
- Seiko Epson Corporation
- Manabu Kondo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly having interconnect for stacked electronic devices...
- Patent number 10,128,221
- Issue date Nov 13, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 10,115,664
- Issue date Oct 30, 2018
- Xiamen Tianma Micro-Electronics Co., Ltd.
- Guochang Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit module
- Patent number 10,056,311
- Issue date Aug 21, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package
- Patent number 10,043,737
- Issue date Aug 7, 2018
- Novatek Microelectronics Corp.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for electronic devices with reinforced lead crack
- Patent number 10,020,248
- Issue date Jul 10, 2018
- LG Innotek Co., Ltd
- Dae Sung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 9,974,175
- Issue date May 15, 2018
- Samsung Display Co., Ltd.
- Han-Sung Bae
- G02 - OPTICS
Information Patent Grant
Plated terminals with routing interconnections semiconductor device
- Patent number 9,972,563
- Issue date May 15, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
- Publication number 20230395549
- Publication date Dec 7, 2023
- Hewlett-Packard Development Company, L.P.
- DAVID WAYNE GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE
- Publication number 20230275069
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Hiroshi YANAGIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220310494
- Publication date Sep 29, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP ON FILM AND DISPLAY DEVICE
- Publication number 20210074615
- Publication date Mar 11, 2021
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Kaiwen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SELECTIVE CORROSION PROTECTION OF ELECTRIC CONNECTION...
- Publication number 20210028125
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintered Metal Flip Chip Joints
- Publication number 20210005537
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX-FOIL PACKAGE WITH COPLANAR TOPOLOGY FOR HIGH-FREQUENCY SIGNALS
- Publication number 20200279797
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits for Flexible Electronics Applications and High-...
- Publication number 20200273719
- Publication date Aug 27, 2020
- Thin Film Electronics ASA
- Miki TRIFUNOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RFID TAG INTERFACING
- Publication number 20200082239
- Publication date Mar 12, 2020
- Philip Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067173
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND FIXTURE FOR CHIP ATTACHMENT TO PHYSICAL OBJECTS
- Publication number 20180350729
- Publication date Dec 6, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND HEAT-DISSIPATION STRUCTURE FOR A CHIP PACKAGE
- Publication number 20180342437
- Publication date Nov 29, 2018
- NOVATEK MICROELECTRONICS CORP.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20180263116
- Publication date Sep 13, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20170372988
- Publication date Dec 28, 2017
- NXP B.V.
- ROELF GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECT DEVICE, MANUFACTURING METHOD FOR MOLDED INTERCO...
- Publication number 20170358526
- Publication date Dec 14, 2017
- OLYMPUS CORPORATION
- Keigo ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20170358520
- Publication date Dec 14, 2017
- SAMSUNG DISPLAY CO., LTD.
- Sang Hyeon SONG
- G02 - OPTICS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20170358525
- Publication date Dec 14, 2017
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...
- Publication number 20170330766
- Publication date Nov 16, 2017
- SEIKO EPSON CORPORATION
- Manabu KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20170323838
- Publication date Nov 9, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170207151
- Publication date Jul 20, 2017
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20170170103
- Publication date Jun 15, 2017
- Nexperia B.V.
- SHUN TIK YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE
- Publication number 20170162487
- Publication date Jun 8, 2017
- NOVATEK MICROELECTRONICS CORP.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170103962
- Publication date Apr 13, 2017
- Denso Corporation
- Syoichirou OOMAE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20170092572
- Publication date Mar 30, 2017
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE INCLUDING ELECTRONIC COMPONENT, METAL...
- Publication number 20160351481
- Publication date Dec 1, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- KOJI KAWAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160322342
- Publication date Nov 3, 2016
- Panasonic Intellectual Property Management Co. Lt
- JUNICHI KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
- Publication number 20160300786
- Publication date Oct 13, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20160218053
- Publication date Jul 28, 2016
- Samsung Electronics Co., Ltd.
- Young-Jin CHO
- H01 - BASIC ELECTRIC ELEMENTS

consisting of thin flexible metallic tape with or without a film carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component, electric device including the same, and bondi...

Stretchable circuit substrate

Tape carrier assemblies having an integrated adhesive film

Electronic component, electric device including the same, and bondi...

Flex-foil package with coplanar topology for high-frequency signals

Electronic component, electric device including the same, and bondi...

Method of making flexible semiconductor device with graphene tape

Package with selective corrosion protection of electric connection...

Tape carrier assemblies having an integrated adhesive film

Chip on film and display device

Multi-stacked die package with flexible interconnect

Chip on film package and heat-dissipation structure for a chip package

Flexible semiconductor device with graphene tape

Display device

Display panel and display device

Flexible packaging architecture

Lead frame and method of manufacturing lead frame

Flexible display apparatus having a bending area cutout

Electronic component, electric device including the same, and bondi...

Molded interconnect device, manufacturing method for molded interco...

Electronic device, electronic apparatus, moving object, and method...

Semiconductor device and a method of manufacturing the same

Package assembly having interconnect for stacked electronic devices...

Display panel and display device

Wafer level chip scale semiconductor package

Electronic circuit module

Chip on film package

Tape for electronic devices with reinforced lead crack

Electronic component, electric device including the same, and bondi...

Plated terminals with routing interconnections semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

CHIP ON FILM AND DISPLAY DEVICE

PACKAGE WITH SELECTIVE CORROSION PROTECTION OF ELECTRIC CONNECTION...

Sintered Metal Flip Chip Joints

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

FLEX-FOIL PACKAGE WITH COPLANAR TOPOLOGY FOR HIGH-FREQUENCY SIGNALS

Integrated Circuits for Flexible Electronics Applications and High-...

SYSTEM AND METHOD FOR RFID TAG INTERFACING

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

METHOD AND FIXTURE FOR CHIP ATTACHMENT TO PHYSICAL OBJECTS

CHIP ON FILM PACKAGE AND HEAT-DISSIPATION STRUCTURE FOR A CHIP PACKAGE

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

MOLDED INTERCONNECT DEVICE, MANUFACTURING METHOD FOR MOLDED INTERCO...

CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...

ELECTRONIC CIRCUIT MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

CHIP ON FILM PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

CHIP-ON-FILM PACKAGE

ELECTRONIC COMPONENT PACKAGE INCLUDING ELECTRONIC COMPONENT, METAL...

SEMICONDUCTOR DEVICE

PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE

CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME