The invention relates to a method and an apparatus for the wet-chemical processing of flat, thin and fracture-sensitive substrates for microelectronic, micromechanical, and optical applications.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
The wet process technique for the production of microelectronic components is presently carried out primarily in bath processes, wherein the substrates, which are accommodated in magazines, are immersed in process baths. The process is carried out discontinuously in batches of 1 to 50 substrates. The use of continuous (inline) wet process systems, for example for the production of solar cells, is on the rise, wherein the substrates located on rollers or belts are continuously conveyed into process baths or are sprayed in spray modules with media, such as process chemicals or water, and then dried with warm air or nitrogen, which may optionally be enriched with isopropanol. The presently available wet-chemical processes are limited to immersion processes and spraying processes, which were developed and optimized substantially for standard substrates in the semi-conductor industry. In modern microelectronics and thin-film technology, in the future increasingly thinner substrates will be used, for example with substrate thicknesses of less than 100 μm. These practically film-like, very fracture-sensitive substrates cannot be processed in magazines and immersion basins because on the one hand the requirements with respect to transportation stability, and on the other also the productivity criteria, are not met. Some process requirements, such as one-sided processing, are also not possible. While existing inline process systems for the simultaneous processing of a large number of such substrates in a continuous method meet the throughput criteria, they are associated with unacceptably high breakage rates and cannot be employed for all necessary process types.
The method described hereinafter, and the apparatus that is described, meet all the requirements for an inline process device for thin, fracture-sensitive substrates, both with respect to the transport (handling) within the process path and also with respect to the expanded processes for all required applications through the use of microporous, compressible rollers. By using such rollers, forces perpendicular to the transport direction are avoided, and at the same time the rollers allow uniform coverage of the substrates with the process media, either on both sides or only on the front or back of the substrate. As a result, during processing not only chemical, but also physical methods with direct cleaning contact are effective through the controlled interaction with the process media. In addition, a rinsing and drying step can be integrated in the same method.
In the present method, the substrates to be processed are guided in a continuous method via rotating, media-compatible sponge rollers that are installed on one side or both sides. Absolutely uniform movement is achieved by coupling the drives on at least one side. The media (liquid or gaseous) required for the desired process are applied directly or indirectly during the pass and are removed again in rinsing and drying steps. Depending on the embodiment, processing can be performed on one side or both sides of the substrates, and a plurality of process steps (using the same or different media) can be combined in one process line by stringing process modules together. This line can have one or more lanes. The method can end both with wet or dry substrates. The method described hereinafter, and the apparatus that is described, meet all the requirements for an inline process device for thin, fracture-sensitive substrates, both with respect to the transport (handling) within the process path and also with respect to the expanded processes for all required applications through the use of microporous, compressible rollers. By using such rollers, forces perpendicular to the transport direction are avoided, and at the same time the rollers allow uniform coverage of the substrates with the process media, either on both sides or only on the front or back of the substrate. As a result, during processing not only chemical, but also physical methods with direct cleaning contact are effective through the controlled interaction with the process media. In addition, a rinsing and drying step can be integrated in the same method.
In the present method, the substrates to be processed are guided in a continuous method via rotating, media-compatible sponge rollers that are installed on one side or both sides. Absolutely uniform movement is achieved by coupling the drives on at least one side. The media (liquid or gaseous) required for the desired process are applied directly or indirectly during the pass and are removed again in rinsing and drying steps. Depending on the embodiment, processing can be performed on one side or both sides of the substrates, and a plurality of process steps (using the same or different media) can be combined in one process line by stringing process modules together. This line can have one or more lanes. The method can end both with wet or dry substrates.
Further areas of applicability will become apparent from the description provided herein. It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.
In order that the invention may be well understood, there will now be described an embodiment thereof, given by way of example, reference being made to the accompanying drawing, in which:
The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses.
The substrates 1 (
As soon as the substrate is picked up by the porous, compressible rollers 4 and 5, the substrate is conveyed further by identical, subsequent rollers of the process module 2A. The rollers are characterized in that they absorb the process medium used in the process module 2A, wherein the medium is fed from an immersion bath 6 or spraying device 7, or directly through the core of the rollers 8, and in that they transmit the process medium to the substrate surface due to the contact of the rollers 9 and 10 (
In an alternative method, which can also be combined with that described above, the distance of the rollers 12 and 13 (
Coverage of the lower rollers 15 and 16 can optionally be achieved by the direct absorption of the process medium from the tub 17, or according to the above-described embodiment of the upper rollers via spray nozzles, and can additionally be supported by ultrasonic or megasonic excitation (18) of the process medium. The media can also be fed to the roller 19 (
Depending on the substrate type and the desired process, both the vertical distance 23 of the rollers in relation to the substrate (
Alternatively, a process wherein the rollers rotate in opposite directions, for example during cleaning processes, is possible (
Likewise, rollers having different roller diameters (
For different, consecutive processes, such as etching, rinsing, drying, the process modules can be set up successively in a line 2A, 2B, 2C (see
Drying of the substrate surface, for example after spraying processes, is likewise performed substantially by the microporous rollers. However, these rollers are not supplied a process medium. Due to the rolling motion of the dry roller across the substrate surface, the roller absorbs liquid from the surface (see
In a second embodiment, surface drying after absorption of the liquid following the rolling motion of the rollers on the substrate surface can occur in that following the last roller the substrate surface is inflated with gases, which can additionally be heated, such as heated nitrogen or hot air, and by heating the substrate, for example by means of infrared radiation or heating rods, or in a combination of the described methods.
In a further, alternative embodiment, residue-free surface drying of the substrates can be carried out by introducing a gas-steam mixture into the liquid on the substrate surface, wherein the steam can be mixed with the liquid and mixing results in reduced surface tension of the liquid on the interface between the substrate and roller surfaces compared to the liquid without admixed steam. This method, known as the Marangoni effect or surface tension gradient drying, can be applied to the present invention, as is shown in
The one-sided surface treatment of a flat substrate can occur in that the substrate 49 (
A further possibility of one-sided surface treatment can occur in that the substrate 54 (
It should be noted that the disclosure is not limited to the embodiment described and illustrated as examples. A large variety of modifications have been described and more are part of the knowledge of the person skilled in the art. These and further modifications as well as any replacement by technical equivalents may be added to the description and figures, without leaving the scope of the protection of the disclosure and of the present patent.
Number | Date | Country | Kind |
---|---|---|---|
10 2005 057 109.3 | Nov 2005 | DE | national |
This application is a continuation of U.S. patent application Ser. No. 12/126,870 filed on May 24, 2008, which is a continuation of International Application No. PCT/EP2006/011166 filed on Nov. 22, 2006, which claims the benefit of DE 10 2005 057 109.3, filed Nov. 26, 2005. The entire disclosures of the above applications are incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
Parent | 12126870 | May 2008 | US |
Child | 14570030 | US | |
Parent | PCT/EP2006/011166 | Nov 2006 | US |
Child | 12126870 | US |