Reference will now be made to the drawing figures to describe the preferred embodiment of the present invention in detail.
Referring to
The contacts 2 have lower contacts including a first row contacts 21 and a second row contacts 22, and upper contacts comprising a third row contacts 23 and a fourth row contacts 24. The fourth row contacts 24 and the third row contacts 23 are received in the upper cavities 13 and each defines a fourth row contacting portion 241 and a third row contacting portion 231, a fourth row fixing portion 242 and a third row fixing portion 232, a fourth row soldering portion 243 and a third row soldering portion 233 respectively. The fourth row contacting portions 241 and the third row contacting portions 231 are alternatively arranged and aligned with each other along a lengthwise direction of the housing 1, and extend into the central slot 12 for contacting with the memory module.
The fourth row fixing portion 242 connect the fourth row contacting portion 241 and the fourth row soldering portion 243, the third row fixing portion 232 connect the third row contacting portion 231 and the third row soldering portion 233. The fourth row fixing portions 242 and the third row fixing portions 232 interferentially engage with inner walls of the upper cavities 13. The fourth row fixing portions 242 and the third row fixing portions 232 are positioned above the central dashed line 125 along a height direction of the housing 1, and the fourth row fixing portions 242 are located above the third row fixing portions 232. The fourth row fixing portions 242 define a fourth plane, the third row fixing portions 232 define a third plane which is parallel to the fourth plane.
The second row contacts 22 and the first row contacts 21 are received in the lower cavities 14 and each defines a second row contacting portion 221 and a first row contacting portion 211, a second row fixing portion 222 and a first row fixing portion 212, a second row soldering portion 223 and a first row soldering portion 213 respectively. The second row contacting portions 221 and the first row contacting portions 211 are alternatively arranged and aligned with each other along a lengthwise direction of the housing 1, and extend into the central slot 12 for contacting with the memory module.
The second row fixing portion 222 connect the second row contacting portion 221 and the second row soldering portion 223, the first row fixing portion 212 connect the first row contacting portion 211 and the first row soldering portion 213. The second row fixing portions 222 extend into the upper cavities 13 and interferentially engage with inner walls thereof, the first row fixing portions 212 interferentially engage with inner walls of the lower cavities 14. The second row fixing portions 222 define a second plane located above the central dashed line 125 along the height direction of the housing 1, the first row fixing portions 212 define a first plane which is parallel to the second plane. The first row fixing portions 212 are positioned below the central dashed line 125 and parallel to the second row fixing portions 222. The second row fixing portions 222 are located above the central dashed line 125, that is to say, the fourth row fixing portions 242, the third row fixing portions 232 and the second row fixing portions 222 lie on an upper side of the central dashed line 125, and the first fixing portions 212 lies on a lower side of the central dashed line 125. A position wall 17 is formed between the upper cavities 13 and the lower cavities 14, the first row fixing portions 212 abuts against a lower surface of the position wall 17. In an alternative embodiment, the first row fixing portions 212 can upwardly extend beyond the central dashed line 125.
An ejector 4 is rotatably mounted on the end wall 15 of the housing 1, and includes a base portion 41, a locking portion 42 extending inwardly from an upper end of the base portion 41 for retaining the memory module, an ejecting portion 43 projecting from a bottom end of the base portion 41, a gripping portion 44 extending outwardly in a direction opposite to the locking portion 42. The end wall 15 defines a receiving room 151 communicating with the central slot 12 for accommodating the ejector 4, the ejecting portion 43 extends into the central slot 12 to eject the memory module from the central slot 12.
The housing 1 further defines a plurality of retaining blocks 18 extending from a rear face thereof, a pair of spacers 3 are sandwiched between the adjacent retaining blocks 18 and each has four rows through holes 32 for aligning respective first soldering portions 213, second soldering portions 223, third soldering portions 233, fourth soldering portions 243 of the contacts 2 therein, thereby facilitating insertion of the contacts 2 into corresponding holes on the mother printed circuit board 5. The spacer 3 has a pair of cutouts 33 for locking with tabs 181 protruding from a bottom side of the retaining blocks 18.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200620076344.1 | Sep 2006 | CN | national |