1. Technical Field
The present disclosure relates to a chassis of an electronic device.
2. Description of Related Art
Some servers can generate great heat after a certain period of time, especially if electronic elements, such as expansion cards or memory cards, are added to the servers. As a result, the original heat dissipation system may not dissipate the heat competently.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
The base 10 includes a bottom wall 12, two sidewalls 14 connected substantially perpendicularly to opposite sides of the bottom wall 12, and two end walls 16 connected substantially perpendicularly to opposite ends of the bottom wall 12.
The electronic element 30 and the fan group 40 are mounted on the bottom wall 12. In one embodiment, the electronic element 30 is a central processing unit.
The cover 20 includes a board 22 and two rectangular vent plates 24.
The board 22 defines two rectangular openings 200, adjacent to opposite ends of the board 22. Two L-shaped hooks 202 extend from the bottom surface of the board 22, at opposite sides of each opening 200 and facing toward the corresponding opening 200. A block 204 protrudes from the bottom surface of the board 22, adjacent to an end of each opening 200.
Each vent plate 24 is greater than the openings 200 in length, and defines a plurality of tapered depressed portions 240 in a center. Each depressed portion 240 includes a rectangular bottom plate 242 less than the opening 200 inside and departing from the vent plate 24, and four slanted side plates 244 slantingly connected between sidewalls bounding the opening 200 and corresponding sides of the bottom plate 242. A plurality of vents 246 is defined in side plates 244 of the depressed portions 240 facing a same side of the vent plate 24.
The cover 20 is then mounted to the base 10. The vent plates 24 are positioned at opposite sides of the fan group 40, and are respectively adjacent to the inlet and the outlet of the fan group 40. Therefore, more airflow can enter the chassis. One of the vent plates 24 is positioned above the electronic element 30. The vents 246 all face toward the fan group 40. Therefore, the cool airflow can rapidly enter the chassis through the vents 246 located at the inlet of the fan group 40. In addition, the hot airflow from the electronic component 30 can rapidly flow out of the chassis through the vents 246 located at the outlet of the fan group 40.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being exemplary embodiments.
Number | Date | Country | Kind |
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201210577922.X | Dec 2012 | CN | national |