Claims
- 1. A method of producing a copper foil for printed circuits, comprising the steps of:
- a) providing a copper foil having a shiny side surface;
- b) treating said shiny side surface by cathode electrolysis in an alkaline solution comprising zinc and chrome ions to form a treated surface containing at least zinc or a zinc compound therein; and
- c) applying a solution to said treated surface to form a rust-preventative and heat-discoloration resistant coat,
- said solution combining effective amounts of a silane coupling agent and phosphorous or a phosphorous compound.
- 2. The method of claim 1 wherein said solution comprises a range of 0.01 to 10 g/l for said silane coupling agent and about 0.01 to 0.5 cc/l as phosphoric acid for said phosphorous or phosphorous compound.
- 3. The method of claim 1 wherein said applying step comprises immersing said copper foil in said solution.
- 4. The method of claim 1 wherein said applying step comprises spraying said solution on said treated surface.
- 5. A method of producing a copper foil for printed circuits, comprising the steps of:
- a) providing a copper foil having a shiny side surface;
- b) plating at least said shiny side surface with a thin layer of zinc or a zinc alloy;
- c) chromating said thin layer to form a layer of chromium oxide therein; and
- d) applying a solution to said chromium oxide layer to form a rust-preventative and heat-discoloration resistant coat, said solution combining effective amounts of a silane coupling agent and phosphorous or a phosphorous compound.
- 6. The method of claim 5 wherein said solution comprises a range of 0.01 to 10 g/l for said silane coupling agent and about 0.01 to 0.5 cc/l as phosphoric acid for said phosphorous or phosphorous compound.
- 7. The method of claim 5 wherein said applying step comprises immersing said copper foil in said solution.
- 8. The method of claim 5 wherein said applying step comprises immersing said copper foil in said solution.
Parent Case Info
This application is a divisional, application of application Ser. No. 07/924,527, filed Aug. 4, 1992.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
4082591 |
Morisaki et al. |
Apr 1978 |
|
4647315 |
Parthasarathi et al. |
Mar 1987 |
|
5071520 |
Lin et al. |
Dec 1991 |
|
5098796 |
Lin et al. |
Mar 1992 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
54-29187 |
Mar 1979 |
JPX |
57-152490 |
Sep 1982 |
JPX |
58-7077 |
Jan 1983 |
JPX |
58-15950 |
Jan 1983 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
924527 |
Aug 1992 |
|