Claims
- 1. A method of building one or more passive components into an existing chip scale package comprising the steps of:
selecting a passive component having a terminal pitch that is a multiple of the package ball pitch of a chip scale package; and mounting the selected passive component terminals to ball sites of the package.
- 2. The method of claim 1 further comprising the step of selecting a passive component wherein the terminal pitch multiple of the package ball pitch is one.
- 3. The method of claim 1 further comprising the step of selecting a passive component wherein the terminal pitch multiple of the package ball pitch is two.
- 4. The method of claim 1 further comprising the step of selecting a package having a ball pitch of 0.50 millimeters.
- 5. The method of claim 1 further comprising the step of selecting a package having a ball pitch of 1.0 millimeters.
- 6. The method of claim 1 further comprising the step of selecting a 0402 passive component.
- 7. The method of claim 1 further comprising the step of selecting a 0603 passive component.
- 8. The method of claim 1 further comprising the step of using a single conductive layer tape as the substrate of the package.
- 9. The method of claim 1 further comprising the step of using a single metal layer polyimide tape as the substrate of the package.
- 10. A chip scale package device having at least one IC and at least one passive component comprising:
a package having a preselected ball pitch; an IC having terminals coupled directly to ball sites of the package; and a passive component having a terminal pitch that is a multiple of the package ball pitch, the passive component terminals being coupled directly to ball sites of the package.
- 11. The device of claim 10 wherein the terminal pitch multiple of the package ball pitch is one.
- 12. The method of claim 10 wherein the terminal pitch multiple of the package ball pitch is two.
- 13. The device of claim 10 wherein the package comprises a ball pitch of 0.50 millimeters.
- 14. The device of claim 10 wherein the package comprises a ball pitch of 1.0 millimeters.
- 15. The device of claim 10 wherein the passive component comprises a 0402 passive component.
- 16. The device of claim 10 wherein the passive component comprises a 0603 passive component.
- 17. The device of claim 10 wherein the package comprises a single conductive layer tape.
- 18. The device of claim 10 wherein the package comprises a single metal layer polyimide tape.
PRIORITY DATE
[0001] This application claims the benefit of U.S. Provisional Application No. 60/344,200, filed Dec. 28, 2001.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60344200 |
Dec 2001 |
US |