| Jenkins et al., “in the 300 mm Environment” Semiconductor International Test Automation, Aglient Technologies, Palo Alto, CA, Jun. 2001. |
| Gallagher et al., “Addressing the 300-mm challenge with new wafer-carrier architecture” Micro Magazine.com, http://www.micromagazine.com, p. 81, Jul. 1999. |
| Chappell “Brooks promises FOUP IP for all ” Semiconductor International, www.semiconductor.net, San Francisco, CA, Jul. 13, 2000. |
| News Release—Entegris Debuts Industry's First 300 MM Reduced-Pitch Front-Opening Shipping System FabFit™ 300 is 40 percent smaller than standard-pitch systems, http://www.mcapr.com. |
| Ottesen “Front Opening Unified Pod (FOUP) Fire Protection: A General Overview” International Sematech Technology Transfer, 2706 Montopolis Drive, Austin, TX 78741, 1999. |
| “Major North American IC Manufacture orders Entegris Cleaning System”, http://www.empak.com. Oct. 11, 2000. |
| “High-Tech public Relations: Industry Leaders”, www.mcapr.com. Oct. 11, 2000. |
| “Specific Solutions for handling of Masks and Wafers within Semiconductor Manufacturing” Dresdner Transfer Brief, http://www.tu-drwsden.de/vd51/trabrief/022000/s18.htm, Feb. 2000. |
| Fixload™ 300mm Standard Load Port for FOUPs (Front Opening Unified Pod) Bolts Compatible Interface, http://www.fastech.com/producets/FBU/fixload, Oct. 11, 2000. |
| Atmospheric Factory Interfaces Foup LPM Load Port Module/Door Opener for 300mmm FOUPs Automated or Manual Loading, http://www.brooks.com/poducts/ABU/factory—interfaces/flpml.htm, Oct. 11, 2000. |
| Brooks Automation Receives Additional Patent on Its FOUP-Opener Technology, http//:www.fatech.org/industry.news/0006/160.1, shtml, Oct. 11, 2000. |
| “300mm Pod Door Opener Opens the FOUP, indexes it, and uses non-reflective technology to scan wafers!” http://www.kensingtonlabs.com/products/300door/, Oct. 11, 2000. |