The description of the invention is fairly simple, it is based on electrochemical formation of intermetallic alloy compounds in the presence of an nonreacting metal catalysis.
The easiest example for an Practical {electrochemical} Reactor core is to take MgZn2 intermetallic alloy powder mixed with Al2 powder, ideally with powders of two entirely different sizes for convenient and even mixing stored in an inert atmosphere of ideally argon mixed with helium to keep out oxygen and hydrogen. However, it is NOT necessary to mix the intermetallic powder with an metal powder, one can in fact take the MgZn2 powder and incase it in an surface bias case entirely encapsulating the MgZn2 powder in an aluminum case. And likewise the opposite polarity bias of Fe3Al intermetallic powder can be encapsulated in an magnesium case, or mixed with magnesium powder.
The principle of each type of Ignoid part of the reactor core is that the catalysis metal changes the static voltage bias of the intermetallic component molecules making them easier to react, so that in the example of the MgZn2 ignoid, the Mg2-2{Zn2} reacts easily in the presence of the static bias of the Al2 to form MgZn2 in an reversible reaction. And in the Fe3Al ignoid, the 3{Fe2}-Al2 reacts easily to form Fe3Al in the presence of the static bias of the magnesium catalyst.
Now, according to the surface area of the catalyst metal in electrical contact with the intermetallic alloy component powder, will determine the reaction rate. As well as the temperature range of the reaction. Note that using an great deal of the ultrahigh surface area catalyst metal will bias it so that the reaction at room temperature takes place as rapidly as an capacitor discharging.
Yet another way of attaining an ultrahigh surface area and matching it to the intermetallic surface area relationship is to print ultrathin layers of the intermetallic and the catalyst in successive layers for the densest form of the {electrochemical} reactor core. This would be done using vaporplating or plasmaplating identical to microchip technology mass manufacturing. Ideally then the contacts would be gold plated for an noncorroding junction to normal copper wiring. These types of microchip {electrochemical} Reactor Core Ignoids can easily attain power densities 1000 times greater than any known battery. Note that for an microchip electrochemical reactor core, this would be an printed trimetallic circuit, having both top and bottom catalyst layers and an center alloy intermetallic layer. This would be printed on an insulator such as glass or plastic and the trimetallic plates would be stacked together for higher power density.
Number | Date | Country | |
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60595085 | Jun 2005 | US |