HEAT DISSIPATION SYSTEM

Abstract

An exemplary heat dissipation system includes a built-in heat dissipation module for being positioned in a computer case, a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case. The built-in heat dissipation module includes cooling fluid. The add-on heat dissipation module includes a receiving frame and a heat dissipation device fixed to the receiving frame. The receiving frame engages with the heat dissipation device to receive the cooling fluid. The receiving frame communicates with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to heat dissipation systems, and particularly, to a heat dissipation system having higher heat dissipation efficiency.

2. Description of Related Art

Electronic components, such as central processing units (CPUs), video card, or audio card can general a large amount of heat when operating at high speeds or a high capacity in a computer case. To cool the electronic components, heat dissipation systems such as heat sinks, or heat pipes have been developed. Conventionally, the heat sinks or heat pipes are positioned in the computer case. Since the volumes of the heat sink or the heat pipe are limited, and heat dissipation efficiency is lower.

Therefore, what is needed is a new heat dissipation system that can overcome the described limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of a computer case having a heat dissipation system according to an exemplary embodiment.

FIG. 2 is an exploded isometric view of an add-on heat dissipation module of the heat dissipation system of FIG. 1.

FIG. 3 is an assembled isometric view of the add-on heat dissipation module of FIG. 2.

DETAILED DESCRIPTION

Embodiments will now be described in detail with reference to the drawings.

Referring to FIGS. 1, 2 and 3, a heat dissipation system 100, in accordance with an exemplary embodiment, is shown. The heat dissipation system 100 includes a built-in heat dissipation module 10, a liquid pump 20, and an add-on heat dissipation module 30.

The built-in heat dissipation module 10 is configured for being positioned in a computer case 200. The computer case 200 includes a shell 210, a motherboard 220, and a heat emitter 230. The motherboard 220 is received in the shell 210. The heat emitter 230 is an electronic element (e.g. CPU, video card, network card, etc), which generates heat in work process. The heat emitter 230 is fixed on the motherboard 220.

The built-in heat dissipation module 10 is positioned on the heat emitter 230 for dissipating heat from the heat emitter 230. The built-in heat dissipation module 10 includes a case 10a, a cooling fluid 11 received in the case 10a, a first liquid inlet 12 defined in the case 10a for the cooling fluid 11 entering into the case 10a, and a first liquid outlet 13 defined in the case 10a for the cooling fluid 11 exiting the case 10a.

The liquid pump 20 is connected to the built-in heat dissipation module 10 for circulating the cooling fluid 11 to dissipate heat.

The liquid pump 20 includes a second liquid inlet 21, and a second liquid outlet 22. The second liquid outlet 22 communicates with the first liquid inlet 12.

In other embodiments, if the heat dissipation system 100 dissipates heat from two or more heat emitter 230, there may be a plurality of built-in heat dissipation modules 10 connected in series, such that the cooling fluid 11 can be circulated in the built-in heat dissipation modules 10.

The add-on heat dissipation module 30 is configured for being fixed on the outer surface of the shell 210. In the present embodiment, the add-on heat dissipation module 30 is fixed on the top plate 211 of the shell 210 by screw 7.

The add-on heat dissipation module 30 includes a receiving frame 31, a heat dissipation device 32, and a fan 33.

The receiving frame 31 includes a bottom plate 31a, a sidewall 31b protruding from and surrounding the bottom plate 31a, and a runner 31c. In the present embodiment, the receiving frame 31a is a substantially square container having an opening.

The runner 31a is formed by a plurality of parallel and spaced strips 311 protruding from the bottom plate 31a. A first through hole 31d and a second through hole 31e are defined in the bottom plate 31a. One end of the runner 31c communicates with the first liquid outlet 13 via the first through hole 31d, and the other end of the runner 31c communicates with the second liquid inlet 21 via the second through hole 31e. In the present embodiment, the first through hole 31d communicates with the first liquid outlet 13 by one hollow tube 8, and the second through hole 31e communicates with the second liquid inlet 21 by another one hollow tube 8. The hollow tubes 8 are soft tubes.

The top plate 211 defines two third through holes 211a spatially corresponding to the first and second through holes 31d and 31e. The two third through holes 211a align with the corresponding through holes 31d and 31e, respectively, and connect to the hollow tubes 8 by two connector heads 9.

Each of the connector heads 9 includes a hollow screw 9a and a nut 9b communicating with and connected to a respective one of the hollow tubes 8. One end of one of the hollow screws 9a is connected to the first through hole 31d, and the other end of the one hollow screw 9a passes through the top plate 211 and is connected to the nut 9b. One end of the other hollow screw 9a is connected to the second through hole 31e, and the other end of the other hollow screw 9a passes through the top plate 211 and is connected to the nut 9b.

The receiving frame 31 replaces a traditionally water tank to receive the cooling fluid 11, and the receiving frame 31 is positioned outside of the computer case 200. Accordingly, the volume of the receiving frame 31 can be designed by the user based on need, more cooling fluid 11 can be received in the receiving frame, and the heat dissipation efficiency can be improved.

The heat dissipation device 32 includes a connecting surface 32a, a heat dissipation surface 32b opposite to the connecting surface 32a, and a plurality of heat dissipation fins 32c on the connecting surface 32a, and a sealing screw 32d. The connecting surface 32a is thermally coupled to the receiving frame 31. In detail, the connecting surface 32a is welded on the top surface of the sidewall 31b, and covers the receiving frame 31. The heat dissipation fins 32c are thermally coupled to the heat dissipation surface 32b. A liquid filling hole 32e is defined in the heat dissipation device 32, and passes through the connecting surface 32a and the heat dissipation surface 32b. The liquid filling hole 32e communicates with the receiving frame 31. After long time usage of the heat dissipation system 100, the cooling fluid 11 may decrease gradually, and the cooling fluid 11 can be added into the receiving frame 31 by the liquid filling hole 32e. The sealing screw 32d engages with the liquid filling hole 32e, such that the liquid filling hole 32e can be sealed when there is no need to add the cooling fluid 11 into the receiving frame 31. The fan 33 is fixed on the heat dissipation fins 32c for further improving heat dissipation efficiency of the heat dissipation system 100.

While certain embodiments have been described and exemplified above, various other embodiments will be apparent from the foregoing disclosure to those skilled in the art. The disclosure is not limited to the particular embodiments described and exemplified but is capable of considerable variation and modification without departure from the scope and spirit of the appended claims.

Claims

1. A heat dissipation system comprising: a built-in heat dissipation module for being positioned in a computer case, the built-in heat dissipation module comprising cooling fluid;a liquid pump communicating with the built-in heat dissipation module, andan add-on heat dissipation module for being positioned outside of the computer case, the add-on heat dissipation module comprising a receiving frame and a heat dissipation device fixed to the receiving frame, the receiving frame and the heat dissipation device cooperatively receiving the cooling fluid, the receiving frame communicating with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.

2. The heat dissipation system of claim 1, wherein the heat dissipation device comprises a plurality of heat dissipation fins, a heat dissipation surface thermally coupled to the heat dissipation fins, a connecting surface opposite to the heat dissipation surface, and the connecting surface is thermally coupled to the receiving frame, and covers the receiving frame.

3. The heat dissipation system of claim 2, wherein the heat dissipation device further comprises a liquid filling hole passing through the heat dissipation surface and the connecting surface, and a sealing screw, the liquid filling hole communicates with the receiving frame, and the sealing screw engages with the liquid filling hole to seal the liquid filling hole.

4. The heat dissipation system of claim 2, wherein the add-on dissipation module further comprises a fan fixed on the heat dissipation fins.

5. The heat dissipation system of claim 1, wherein the built-in heat dissipation module comprises a first liquid inlet and a first liquid outlet, the liquid pump comprises a second liquid inlet and a second liquid outlet, the second liquid outlet communicates with the first liquid outlet, and the receiving frame communicates with the first liquid outlet and the second liquid inlet.

6. The heat dissipation system of claim 5, wherein the receiving frame comprises a runner, one end of the runner communicates with the first liquid outlet, and the other end of the runner communicates with the second liquid inlet.

7. The heat dissipation system of claim 6, wherein the receiving frame comprises a first through hole and a second through hole, one end of the runner communicates with the first liquid outlet via the first through hole, and the other end of the runner communicates with the second liquid inlet via the second through hole.

8. The heat dissipation system of claim 6, further comprising two hollow tubes and two connector heads, the built-in heat dissipation module and the liquid pump being communicated between the first through hole and the second through hole by the two hollow tubes, the first through hole and the second through hole communicating with the respective hollow tubes by the respective connector heads, each of the connector heads comprising a hollow screw and a nut, one end of each hollow screw being connected to a respective one of the first and second through holes, and the other end of each hollow screw being connected to one of the nuts.

9. The heat dissipation system of claim 6, wherein the receiving frame comprises a bottom plate and a sidewall protruding from and surrounding the bottom plate, the first through hole and the second through hole are defined in the bottom plate.

10. The heat dissipation system of claim 9, wherein the runner comprises a plurality of parallel and spaced strips protruding from the bottom plate.