Patent Grant
8952774
The present disclosure relates to heat exchange systems and more particularly to a cooling system for modular components such as electrical components.
Electronic systems often include components, including for example high power amplifiers, which generate significant amounts of heat. These components may be modular and may be mounted in a rack or chassis, and may be cooled by heat exchangers. With the ability to remove and replace components within the rack or chassis, it may be desirable to have an improved interface between the components and the heat exchangers.
According to one embodiment is a magnetic lock system for releasably securing a heat exchanger with a component. The system includes: an electromagnet on one of the heat exchanger or the component and a magnetic region on the other of the heat exchanger or the component; the electromagnet being energizable to attract the magnetic region to secure the component and the heat exchanger in a thermally coupled position; and the electromagnet being de-energizable to release the component and the heat exchanger from the thermally coupled position.
According to one embodiment is a component mounting system, including a support structure, a heat exchanger mounted to the support structure, a component adapted to be removably mounted to the support structure, an electromagnet on one of the heat exchanger or the component and a magnetic region on the other of the heat exchanger or the component. The electromagnet is energizable to attract the magnetic region to secure the component and the heat exchanger in a thermally coupled position when the heat exchanger and the component are located adjacent each other in the support structure. The electromagnet is de-energizable to release the component and the heat exchanger from the thermally coupled position to allow the component to be removed independently of the heat exchanger from the support structure.
According to one embodiment is a method of releasably securing an electronic component to a heat exchanger, the heat exchanger defining an internal fluid flow path for a heat exchanger fluid flowing therethrough. The method includes: providing one or more electromagnets on one of the heat exchanger or the component and one or more magnetic regions on the other of the heat exchanger or the component; energizing the one or more electromagnets to attract the one or more magnetic regions to secure the component and the heat exchanger in a thermally coupled position; and de-energizing the one or more electromagnets to release the component and the heat exchanger from the thermally coupled position.
According to one example is a cooling system for an electrical component mounted in a support structure. The cooling system includes a heat exchanger; a cooling module in fluid communication with the heat exchanger; and an electromagnet on one of the heat exchanger or the electrical component. When the electromagnet is energized, the electromagnet secures the electrical component mounted in the support structure and the heat exchanger in a thermally coupled position; and when the electromagnet is de-energized, the electrical component can be removed from the support structure.
According to another example is a heat exchanger. The heat exchanger includes a thermally couplable portion for coupling with an electrical component; and an electromagnet for magnetically attracting a magnet or ferromagnetic portion of the electrical component to secure the heat exchanger and the electrical component in a thermally coupled position.
According to another example is an electrical component. The electrical component includes a thermally couplable portion for coupling with a heat exchanger; and an electromagnet for magnetically attracting a magnet or ferromagnetic portion of the heat exchanger to secure the electrical component and the heat exchanger in a thermally coupled position.
According to another example is a method of cooling an electrical component. The method includes detecting the electrical component is in a couplable position; and upon detecting the electrical component is in a couplable position, energizing an electromagnet to secure the electrical component and a heat exchanger in a thermally coupled position. In some examples, the method also includes receiving a disengagement signal; and upon receiving the disengagement signal, de-energizing the electromagnet.
A magnetic lock system for releasably securing a heat exchanger with a component, the system including: an electromagnet on one of the heat exchanger or the component and a magnet on the other of the heat exchanger or the component; magnetic attraction between the magnet and the electromagnet securing the component and the heat exchanger in a thermally coupled position when the electromagnet is not energized, the electromagnet being energizable to repel the magnet to release the component and the heat exchanger from the thermally coupled position.
A method of releasably securing an electronic component to a heat exchanger, the heat exchanger defining an internal fluid flow path for a heat exchanger fluid flowing therethrough, the method including: providing one or more electromagnets on one of the heat exchanger or the component and one or more magnets on the other of the heat exchanger or the component; positioning the component and the heat exchanger adjacent each other so that magnetic attraction between the one or more electromagnets and the one or more magnets secure the component and the heat exchanger in a thermally coupled position; and energizing the one or more electromagnets to release the component and the heat exchanger from the thermally coupled position.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the attached figures, wherein:
It will be appreciated that for simplicity and clarity of illustration, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the example embodiments described herein. However, it will be understood by those of ordinary skill in the art that the example embodiments described herein may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to obscure the example embodiments described herein. Also, the description is not to be considered as limited to the scope of the example embodiments described herein.
In modular systems, multiple electrical components are often mounted in a support structure such as a rack or chassis. For example, high power electronics such as cellular transmitters utilize large, regulated power sources. These power sources may be modular electrical components such as power amplifier modules. To remove generated heat, heat exchangers may be coupled to the power amplifier modules, and the heat exchanger and power amplifier module combination may be mounted.
The support structure may also provide fluid conduits having a fluid interface with the heat exchanger for circuiting heat exchanger fluids (such as a liquid like oil, water or anti-freeze for example) between the heat exchanger an external cooling system. One such interface is a blind mate liquid cooling connection whereby the heat exchanger may be connected with the fluid interface on the support structure without a user being able to see the physical connection point. When connected, the connection allows coolant fluids to travel between the heat exchanger and the cooling system. When the heat exchanger is disconnected from the system, connectors on both the heat exchanger and the cooling system close to prevent fluid from escaping from the connection points. However, for various reasons including partially mated connections and wear-and-tear from the repeated mating and unmating of the connectors, fluid leaks from the connectors can be a concern.
Reference is made to
In some example embodiments, the rack 110 may include one or more rails 120 for slidably receiving one or more electrical components 130 and heat exchangers 140. In other example embodiments, the rack 110 may include shelves, rails, slots, slides, other electrical components, sub-racks or chasses, or other means for supporting the electrical components 130 and heat exchangers 140. In some example embodiments, the rack 110 may include additional means for securing an electrical component to the rack such as mounting holes 125 for receiving bolts, snaps, clips, latches, locks and the like. In some example embodiments, the rack may include latch components or mechanisms for releasing mounted electrical components 130 and heat exchangers 140.
While the electrical components 130 and heat exchangers 140 in
In some example embodiments, the rack 110 includes electrical busses or other means for providing power to mounted electrical components 130 and heat exchangers 140. In some example embodiments, the rack 110 may include busses or conductors for exchanging signals with electrical components 130 or heat exchangers 140 and providing internet or telecommunication network connections to mounted components. As will be explained in greater detail below, in the illustrated embodiment the rack 110 includes conduits or passages for providing and retrieving a heat exchange fluid such as a cooling liquid to and from locations throughout the stack 110 for heat exchangers 140.
In some example embodiments, the rack 110 may include a display for displaying status information about the mounted electrical components 130 or heat exchangers 140 or to display information provided by the mounted components. In some example embodiments, the rack 110 may include a keyboard or other input components for programming, monitoring, debugging, or otherwise controlling one or both of the mounted electrical components 130 or heat exchangers 140.
In some example embodiments, the rack 110 may include sensors, processors or circuitry for detecting the presence of one or both of mounted electrical components 130 or heat exchangers 140.
In the example configuration in
Other arrangements of electrical components 130 and heat exchangers 140 are also possible. For example, in some example embodiments, the electrical component 130 may have an upper surface which may be thermally coupled to a lower surface of the heat exchanger. In these embodiments, the electrical component would be positioned directly below the heat exchanger in the rack.
In some example embodiments, the electrical component 130 may have both upper and lower surfaces that can be thermally coupled to heat exchanger. In these embodiments, a heat exchanger may be positioned directly above or directly below the electrical component. In some examples, the electrical component may be positioned between two heat exchangers to provide cooling to two surfaces of the electrical component. Similarly, in some example embodiments, a heat exchanger, having both an upper and a lower cooling surface, may be positioned between two electrical components to provide cooling to both components.
In some example embodiments, two smaller electrical components may be positioned in a single row of the rack. In these embodiments, if properly aligned, a single heat exchanger surface may provide cooling to both electrical components. In some embodiments, the electrical components 130 and heat exchangers may be vertically oriented, with vertically oriented thermally coupled surfaces.
In some example embodiments, instead of quick connections which may be connected by sliding a mountable component into the rack, the mounted components may require a user to manually connect the various ports or connections. In such embodiments, the connections may be connected to the rack or to other components via a cable, tube, cord or other suitable electronic or fluid communication means.
In some example embodiments, the electrical component 130 is a high voltage power amplifier for use with high voltage equipment such as cellular transmitter. In some example embodiments, the electrical component may be a computer or server. In some example embodiments, the electrical component may be a network or telecommunication component such as a switch or router. In some embodiments, different types of electrical components 130 or other modular components can be mounted in the same rack 110, including battery modules or other rack mounted components that are to be cooled or heated. The component 130 may be any component which can be cooled or heated by thermal coupling with a heat exchanger. In the illustrated figure, the component 130 has a rigid rectangular housing 302 dimensioned to be slid into a corresponding bay in the rack 110.
The example electrical component 130 in
In some embodiments, the electrical component 140 may have a thermally couplable portion on a top or side surface for thermally coupling to a heat exchanger positioned above or to the side of the component. Accordingly, in these example embodiments, the electrical component housing may have magnetic regions positioned on or proximate to the upper surface having the thermally couplable portion. In some example embodiments, the electrical component may have thermally couplable portions on multiple sides for coupling to multiple heat exchangers, and may have multiple corresponding magnetic regions.
In some example embodiments, the heat exchanger 140 has a substantially planer upper surface 430 at least a portion of which can be thermally coupled with the lower surface 320 of its paired electrical component 130 to transfer heat between the electrical component 130 and the heat exchanger 140. In example embodiments, the heat exchanger 140 defines an internal fluid passage way, represented by dashed line 402 in
The example heat exchanger 140 includes one or more electromagnets 440 for magnetically attracting the magnetic strips 310 or other magnetic regions of its paired electrical component 130. The electromagnets 440 may be any shape or size appropriate for attracting an external magnet or ferromagnetic material on an adjacent electrical component 130. In some example embodiments, with a low voltage and low current, the electromagnets 440 provide a large holding force. In some example embodiments, with a DC voltage of around 12 V and a current of around 2 mA, the electromagnets 440 can provide a holding force of up to 1200 pounds. When electromagnets 440 are energized, the magnetic attraction between the electromagnets 440 and the magnetic strips/ferromagnetic material physically secures the electrical component 130 and the heat exchanger 140 in a thermally coupled position whereby the thermally couplable portion (for example lower surface 320) of the electrical component 130 is thermally connected to the thermally couplable portion (for example upper surface 430) of the heat exchanger 140. In some example embodiments, when in a thermally coupled position, the thermally couplable portion of the electrical component 130 is in physical contact with the thermally couplable portion of the heat exchanger 140.
In some example embodiments, the rack 110 may have mounting mechanisms which allow for some translation of mounted components to allow adjacent electrical components and heat exchangers to move into direct physical contact when electromagnets 440 are activated.
In some example embodiments, the electromagnets and magnets/ferromagnetic materials may be positioned to move the mounted components into an alignment such that there is an increased area of contact between the thermally couplable portion of the electrical component and the thermally couplable portion of the heat exchanger.
In some example embodiments, the electromagnets 440 are disposed on the upper surface 430 of the heat exchanger 140. In some example embodiments, the electromagnets 440 are positioned inside the heat exchanger 140 proximal to the upper surface 430 such that the electromagnets 440 can be magnetically attracted to an external magnet or ferromagnetic material.
In other example embodiments, the heat exchanger may have a thermally couplable portion on a bottom or side surface for thermally coupling to an electrical component positioned below or to the side of the heat exchanger. Accordingly, in these example embodiments, the heat exchanger may have electromagnets positioned on or proximate to the surface having the thermally couplable portion. In some example embodiments, the heat exchanger may have thermally couplable portions on multiple sides for coupling to multiple electrical components, and may have one or more electromagnets on or proximate to each thermally couplable side.
When energized, electromagnets 440 provide a magnetic lock that physically secures the electrical component 130 and the heat exchanger 140 in a thermally coupled position in rack 110; when electromagnets 440 are de-energized, the magnetic lock is released. In an example embodiment, each heat exchanger 140 includes circuitry as illustrated diagrammatically in
In some example embodiments, the electromagnets 440 on a heat exchanger 140 can be manually de-energized when a manual input device 150 such as button or other switch is activated. By way of example, referring to
In some example embodiments, the electromagnets 440 for a heat exchanger 140/electronic component 130 pair is energized by control circuit 600 in response to signals received from a proximity or presence sensor 422. As shown in
The sensor 422, manual input 150 and control circuit of the circuit of
In the above example embodiments, an electromagnet on a heat exchanger is magnetically attracted to a magnet or magnetic region of an electrical component. However, in other example embodiments, the electromagnet may be on the electrical component and may be magnetically attracted to a magnet or magnetic region on a heat exchanger. In some example embodiments, both the heat exchanger and the electrical component may each have electromagnets and magnets/ferromagnetic materials for magnetically attracting corresponding magnets/ferromagnetic materials and electromagnets on the opposite component.
The circuitry of
Referring to
In some example embodiments, the electrical component 130 is detected to be in a couplable position by a sensor 422 as described above. In some example embodiments, the electrical component 130 is detected to be in a couplable position when it is mounted in a rack 110 adjacent to a heat exchanger 140. The electrical component 130 may be detected to be in a couplable position irrespective of the order in which the electrical component and heat exchanger are mounted in the rack. In some example embodiments, an electrical component mounted in a rack may be detected to be in a couplable position when a heat exchanger is subsequently mounted adjacent to the electrical component. In some example embodiments, in addition to or instead of a sensor, a manual input could be operable to energize electromagnets 440 when the electrical component and heat exchanger are located in a thermally couplable position.
In some example embodiments, the electrical component is detected to be in a couplable position when an input component 150 such as a button or switch' is activated. In some example embodiment, a user may select a menu option, click a button or otherwise execute a command from a computer user interface to send a signal indicating that the electrical component 130 is in a couplable position. In some example embodiments, a user may actuate a mouse, touchscreen, keyboard or any other input component to indicate that the electrical component is in a couplable position.
At action 530, upon detection that the electrical component 130 is in a couplable position, one or more electromagnets 440 on one or both of the heat exchanger 140 and adjacent electrical component 130 are energized to magnetically secure the electrical component 130 and the adjacent heat exchanger 140 in a thermally coupled position. The energized electromagnet 440 is attracted to a magnetic region of the housing or a magnetic strip secured to the housing of the other component. This magnetic force secures the electrical component 130 and its respective heat exchanger 140 in a thermally coupled position.
In some example embodiments, the electrical component and the heat exchanger may be in close proximity to one another but may not be in physical or thermal contact prior to energizing of electromagnets 440. In these embodiments, the energized electromagnet creates a magnetic force causing the electrical component or the heat exchanger to move into physical contact. The magnetic force locks the electrical component and the heat exchanger in this thermally coupled position. In example embodiments, a visual indicator 152 such as an LED is activated to indicate that the magnetic lock is energized.
Once thermally coupled, heat from the electrical component 130 may be transferred to the heat exchanger 140 thereby cooling the electrical component 130, with the heat exchanger fluid travelling through heat exchanger passage 402 drawing the heat off to an external cooling system 220. Alternatively, in some applications heat from the heat exchanger 140 may be transferred to the component 130 thereby heating the component 130, with the heat exchanger fluid travelling through heat exchanger passage 402 drawing heat from an external heating system 220.
At action 540, the component 130 or 140 having the electromagnet(s) 440 may receive a disengagement signal. A user wishing to uncouple the electrical component from the heat exchanger may trigger a disengagement signal. In some example embodiments, the disengagement signal may be the activation of an input component 150 such as a switch or a button.
In some example embodiments, the disengagement signal may be a signal from a processor, controller, control circuit, software module or any other electrical component. In some example embodiments, a user may select a menu option, click a button or otherwise send a disengagement command from a computer user interface to send a disengagement signal. In some example embodiments, a user may actuate a mouse, touchscreen, keyboard or any other input component to send a disengagement command.
At action 550, upon receipt of the disengagement signal, the electromagnet 440 is de-energized. Once the electromagnet 440 is de-energized, the electrical component 130 and heat exchanger 140 are no longer magnetically locked in a thermally coupled position, and either one of the electrical component 130 or heat exchanger 140 may independently be removed from the rack 110 while the other component stays mounted in the rack 110.
In some example embodiments, as the system described above allows an electrical component 130 to be removed from the rack 110 for servicing or replacement independently of its associated heat exchanger 130, the fluid connections between the heat exchanger 130 and the inlet/outlet fluid conduit 216 do not have to be separated during servicing or replacement of the electrical component 130. This may in some applications reduce wear and tear on the fluid connectors 212, 420A, 420B and reduce the chance of fluid leaks occurring from worn connectors or miss-installed heat exchangers. Furthermore, the decoupling of the electrical component 130 from its heat exchanger 140 means that a technician servicing the electrical component 130 does not have to lift and remove the weight of the heat exchanger 140 when servicing or replacing the electrical component 130. This flexibility can be obtained without substantially sacrificing thermal exchange performance as the magnetic locking of the heat exchanger 130 to its heat exchanger 140 during operation provides thermal coupling to facilitate heat exchange between the two components.
With references to
While the embodiments described herein are directed to particular implementations of systems and methods for cooling or heating modular components such as electrical components, it will be understood that modifications and variations may occur to those skilled in the art having read the present disclosure. All such modifications and variations are believed to be within the sphere and scope of the present disclosure.
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