Claims
- 1. An apparatus for distributing gas in a processing system, comprising:
a gas distribution assembly having:
a gas distribution plate defining a plurality of holes through which gases are transmitted; a gas box coupled to the gas distribution plate, the gas box being configured to supply the gases into the plurality of holes; and a means for minimizing heat transfer from the gas distribution plate to the gas box.
- 2. The apparatus of claim 1, wherein the means for minimizing heat transfer comprises a hard radio frequency (RF) gasket disposed between the gas distribution plate and the gas box.
- 3. The apparatus of claim 1, wherein the gas box is coupled to the gas distribution plate through an annular flange portion around the distribution plate, and wherein the means for minimizing heat transfer comprises one or more recesses between the flange portion and the gas box.
- 4. The apparatus of claim 1, wherein the means for minimizing heat transfer comprises a thermal isolator disposed between the gas box and the gas distribution plate, the isolator being configured to eliminate contact between the gas box and the gas distribution plate.
- 5. The apparatus of claim 1, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 6. The apparatus of claim 5, wherein the channel is disposed around the plurality of holes.
- 7. The apparatus of claim 1, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 8. The apparatus of claim 7, wherein the heating element is configured to heat the gas distribution plate.
- 9. The apparatus of claim 7, wherein the heating element is disposed around the plurality of holes.
- 10. The apparatus of claim 7, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 11. An apparatus for distributing gas in a processing system, comprising:
a gas distribution assembly having:
a gas distribution plate defining a plurality of holes through which gases are transmitted; a gas box coupled to the gas distribution plate, the gas box being configured to supply the gases into the plurality of holes; and a hard radio frequency (RF) gasket disposed between the gas distribution plate and the gas box, the gasket being configured to reduce heat transfer from the gas distribution plate to the gas box.
- 12. The apparatus of claim 11, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 13. The apparatus of claim 12, wherein the channel is disposed around the plurality of holes.
- 14. The apparatus of claim 11, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 15. The apparatus of claim 14, wherein the heating element is configured to heat the gas distribution plate.
- 16. The apparatus of claim 14, wherein the heating element is disposed around the plurality of holes.
- 17. The apparatus of claim 14, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 18. An apparatus for distributing gas in a processing system, comprising:
a gas distribution assembly having:
a gas box configured to supply gases into a process chamber; and a gas distribution plate comprising:
a plurality of holes through which the gases are distributed into the process chamber; and a flange portion coupled to the gas box, the flange portion defining one or more recesses configured to reduce heat transfer from the gas distribution plate to the gas box.
- 19. The apparatus of claim 18, wherein the recesses provide a distance between the gas distribution plate and the gas box.
- 20. The apparatus of claim 18, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 21. The apparatus of claim 20, wherein the channel is disposed around the plurality of holes.
- 22. The apparatus of claim 18, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 23. The apparatus of claim 22, wherein the heating element is configured to heat the gas distribution plate.
- 24. The apparatus of claim 22, wherein the heating element is disposed around the plurality of holes.
- 25. The apparatus of claim 22, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 26. An apparatus for distributing gas in a processing system, comprising:
a gas distribution assembly having:
a gas box configured to supply gases into a process chamber; a gas distribution plate comprising:
a plurality of holes through which the gases are distributed into the process chamber; and a flange portion; and a thermal isolator disposed between the gas box and the flange portion of the gas distribution plate to reduce heat transfer from the gas distribution plate to the gas box.
- 27. The apparatus of claim 26, wherein the isolator is configured to eliminate contact between the gas box and the gas distribution plate.
- 28. The apparatus of claim 26, wherein the isolator is made from a ceramic material.
- 29. The apparatus of claim 26, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 30. The apparatus of claim 29, wherein the channel is disposed around the plurality of holes.
- 31. The apparatus of claim 26, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 32. The apparatus of claim 31, wherein the heating element is configured to heat the gas distribution plate.
- 33. The apparatus of claim 31, wherein the heating element is disposed around the plurality of holes.
- 34. The apparatus of claim 31, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 35. A gas distribution plate, comprising:
a bottom plate having a plurality of holes through which gases are transmitted; a channel disposed circumferentially around a perimeter of the bottom plate; and a means for heating the gas distribution plate.
- 36. The gas distribution plate of claim 35, wherein the means for heating comprises a heating element disposed inside the channel.
- 37. The gas distribution plate of claim 35, wherein the channel is disposed around the plurality of holes.
- 38. The gas distribution plate of claim 35, wherein the means for heating comprises a high temperature heat exchanger fluid contained inside the channel.
- 39. A gas distribution plate, comprising:
a bottom plate having a plurality of holes through which gases are transmitted; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 40. The gas distribution plate of claim 39, wherein the heating element is configured to heat the gas distribution plate.
- 41. The gas distribution plate of claim 39, wherein the heating element is disposed around the plurality of holes.
- 42. The gas distribution plate of claim 39, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 43. A gas distribution plate, comprising:
a bottom plate having a plurality of holes through which gases are transmitted; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 44. The gas distribution plate of claim 43, wherein the channel is disposed around the plurality of holes.
- 45. The gas distribution plate of claim 43, wherein the heat exchanger fluid is heated by a heat source.
- 46. A chemical vapor deposition reactor, comprising:
a vacuum chamber defining a processing region; a substrate support pedestal positioned within the vacuum chamber and proximate the processing region; and a gas distribution assembly positioned within the vacuum chamber and proximate the processing region, wherein the gas distribution assembly comprises:
a gas distribution plate defining a plurality of holes through which gases are distributed into the processing region; a gas box coupled to the gas distribution plate, the gas box being configured to supply the gases into the plurality of holes; and a hard radio frequency (RF) gasket disposed between the gas distribution plate and the gas box, the gasket being configured to reduce heat transfer from the gas distribution plate to the gas box.
- 47. The reactor of claim 46, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 48. The reactor of claim 47, wherein the channel is disposed around the plurality of holes.
- 49. The reactor of claim 46, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 50. The reactor of claim 49, wherein the heating element is disposed around the plurality of holes.
- 51. A chemical vapor deposition reactor, comprising:
a vacuum chamber defining a processing region; a substrate support pedestal positioned within the vacuum chamber and proximate the processing region; and a gas distribution assembly positioned within the vacuum chamber and proximate the processing region, wherein the gas distribution assembly comprises:
a gas box configured to supply gases into the processing region; and a gas distribution plate comprising:
a plurality of holes through which the gases are distributed into the processing region; and a flange portion coupled to the gas box, the flange portion defining one or more recesses configured to reduce heat transfer from the gas distribution plate to the gas box.
- 52. The reactor of claim 51, wherein the recesses provide a distance between the gas distribution plate and the gas box.
- 53. The reactor of claim 51, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 54. The reactor of claim 51, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 55. The reactor of claim 54, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 56. A chemical vapor deposition reactor, comprising:
a vacuum chamber defining a processing region; a substrate support pedestal positioned within the vacuum chamber and proximate the processing region; and a gas distribution assembly positioned within the vacuum chamber and proximate the processing region, wherein the gas distribution assembly comprises:
a gas box configured to supply gases into the processing region; a gas distribution plate comprising:
a plurality of holes through which the gases are distributed into the processing region; and a flange portion; and a thermal isolator disposed between the gas box and the flange portion of the gas distribution plate to reduce heat transfer from the gas distribution plate to the gas box.
- 57. The reactor of claim 56, wherein the isolator is configured to eliminate contact between the gas box and the gas distribution plate.
- 58. The reactor of claim 56, wherein the isolator is made from a ceramic material.
- 59. The reactor of claim 56, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; a channel disposed circumferentially around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 60. The reactor of claim 56, wherein the gas distribution plate comprises:
a bottom plate through which the plurality of holes are disposed; and a heating element disposed circumferentially around a perimeter of the bottom plate.
- 61. The reactor of claim 60, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 62. A chemical vapor deposition reactor, comprising:
a vacuum chamber defining a processing region; a substrate support pedestal positioned within the vacuum chamber and proximate the processing region; and a gas distribution assembly positioned within the vacuum chamber and proximate the processing region, wherein the gas distribution assembly comprises:
a gas distribution plate comprising:
a bottom plate having a plurality of holes through which gases are distributed into the processing region; and a heating element disposed around a perimeter of the bottom plate.
- 63. The reactor of claim 62, wherein the heating element is insulated with radio frequency (RF) insulating material.
- 64. The reactor of claim 62, wherein the heating element is disposed around the plurality of holes.
- 65. A chemical vapor deposition reactor, comprising:
a vacuum chamber defining a processing region; a substrate support pedestal positioned within the vacuum chamber and proximate the processing region; and a gas distribution assembly positioned within the vacuum chamber and proximate the processing region, wherein the gas distribution assembly comprises:
a gas distribution plate comprising:
a bottom plate having a plurality of holes through which gases are distributed into the processing region; a channel disposed around a perimeter of the bottom plate; and a high temperature heat exchanger fluid contained inside the channel, the heat exchanger fluid being configured to heat the gas distribution plate.
- 66. The reactor of claim 65, wherein the channel is disposed around the plurality of holes.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to U.S. Ser. No. ______ (AMAT/7355) by Lee et al. and entitled “METHODS FOR OPERATING A CHEMICAL VAPOR DEPOSITION CHAMBER USING A HEATED GAS DISTRIBUTION PLATE.”