INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SENSOR DEVICE AND METHOD FOR PRODUCING THE SAME

Abstract

An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The drawings illustrate the embodiments of the present invention and together with the description serve to explain the principles of the invention. Other embodiments of the present invention and many of the intended advantages of the present invention will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.

The invention will now be explained in more detail with reference to the accompanying figures.

FIGS. 1 to 7 illustrate schematic views of components which are joined together for the production of a semiconductor sensor device.

FIG. 1 illustrates a schematic plan view of a substrate plate.

FIG. 2 illustrates a schematic cross section through the substrate plate from FIG. 1.

FIG. 3 illustrates a schematic cross section through the substrate plate in accordance with FIG. 2 after the application of a buffer layer composed of rubber-elastic composition.

FIG. 4 illustrates a schematic cross section through the substrate plate from FIG. 3 after the application of a sensor chip onto the buffer layer.

FIG. 5 illustrates a schematic plan view of a covering plate.

FIG. 6 illustrates a schematic cross section through the substrate plate from FIG. 4 after the application of the covering plate.

FIG. 7 illustrates a schematic cross section through a semiconductor sensor device after the filling of an intermediate region with rubber-elastic composition.

FIGS. 8 to 11 illustrate schematic views of components which are assembled for the production of a semiconductor sensor device of a second embodiment of the invention.

FIG. 8 illustrates a schematic plan view of a covering plate.

FIG. 9 illustrates a schematic cross section through a sandwich-like framework after the application of the covering plate onto corresponding spacers.

FIG. 10 illustrates a schematic cross section of the sandwich-like framework from FIG. 9 after the insertion of a mold stamp.

FIG. 11 illustrates a schematic cross section through a semiconductor sensor device of the second embodiment of the invention after the filling of an intermediate region and removal of the mold stamp.

Claims

1. An integrated circuit having a semiconductor sensor device comprising: a sensor housing partly filled with a rubber-elastic composition;a sensor chip with a sensor region arranged in the interior of the housing, wherein the sensor housing has an opening to the surroundings, and the sensor region faces the opening, and where the sensor chip is embedded into the rubber-elastic composition on all sides in the interior of the housing; andwherein the sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.

2. The integrated circuit of claim 1, comprising: the three regions comprising a lower region with a substrate plate, a side-wall-free and frameless intermediate region with a rubber-elastic composition, in which are embedded the sensor chip and connecting elements to the substrate plate and an upper region with a covering plate, which has the opening to the surroundings that lies opposite the sensor region.

3. The integrated circuit of claim 2, wherein the intermediate region has at least three spacers which extend from the substrate plate as far as the covering plate and are embedded in the rubber-elastic composition.

4. The integrated circuit of claim 1, wherein the intermediate region has four spacers arranged in four corner regions of the housing.

5. The integrated circuit of claim 3, wherein the spacers have spacer rods whose ends are cohesively connected to the substrate plate and the covering plate.

6. The integrated circuit of claim 3, wherein the spacers have a metal and partly serve as through contacts through the intermediate region.

7. The integrated circuit of claim 2, wherein the substrate plate and/or the covering plate have a ceramic material.

8. The integrated circuit of claim 2, wherein the substrate plate and/or the covering plate have a plastic laminate.

9. The integrated circuit of claim 2, wherein the substrate plate has surface-mountable external contact areas of the integrated circuit on its underside.

10. The integrated circuit of claim 2, wherein the substrate plate has on its top side contact pads which are electrically connected to surface-mountable external contacts of the integrated circuit via through contacts through the substrate plate.

11. The integrated circuit of claim 2, wherein the substrate plate has a region provided with a mechanical buffer layer which has the rubber-elastic composition of the intermediate region and on which the sensor chip is fixed such that it is oscillation-mechanically decoupled from the substrate plate, wherein the buffer layer carries the sensor chip in floating fashion.

12. The integrated circuit of claim 2, wherein the top side of the substrate plate has a wiring structure with further semiconductor chips of a sensor module which are arranged thereon.

13. The integrated circuit of claims 2, wherein the sensor chip has contact areas which are electrically connected to contact pads of the substrate plate via connecting elements, bonding wires.

14. The integrated circuit of claim 2, wherein the rubber-elastic composition has two regions a lower region below the sensor chip, on which the rear side of the sensor chip is arranged, and an upper region, into which the edge sides and the top side of the sensor chip with the sensor regions are embedded.

15. The integrated circuit of claim 1, wherein the rubber-elastic composition has an optically transparent elastomer.

16. The integrated circuit of claim 1, wherein the rubber-elastic composition has silicone rubber.

17. The integrated circuit of claim 1, wherein the rubber-elastic composition has a depression above the sensor region of the sensor chip, which depression reduces the thickness of the rubber-elastic composition above the sensor region.

18. The integrated circuit of claim 1, wherein the depression in the rubber-elastic composition has a convex contour.

19. The integrated circuit of claim 1, wherein the depression in the rubber-elastic composition has a cylindrical contour, with the result that a uniformly thinned layer of the rubber-elastic composition covers the sensor region.

20. A method for producing a panel for a plurality of semiconductor sensor devices comprising a sensor housing partly filled with a rubber-elastic composition, and comprising a sensor chip with sensor region arranged in the interior of the housing, wherein the sensor housing has an opening to the surroundings, and the sensor region faces the opening, and wherein the sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing, comprising: producing a substrate plate with a plurality of semiconductor chip positions in which external contact areas are provided on the underside and contact pads are provided on the top side, which are electrically connected to one another via through contacts through the substrate plate and leave free a central position for a sensor chip;applying a structured mechanical buffer layer, which has a rubber-elastic composition, in the central positions of the semiconductor device positions onto the top side of the substrate plate;applying of sensor chips by their rear sides onto the rubber-elastic composition of the buffer layer in the semiconductor device positions;connecting of contact areas of the sensor chip to contact pads of the substrate plate via connecting elements, bonding wires;applying of spacers and a covering plate with openings for the sensor regions of the sensor chips in the semiconductor device positions; andfilling the intermediate region between substrate plate and covering plate with a rubber-elastic composition with embedding of the sensor chips, the connecting elements and the spacers.

21. A method for producing an integrated circuit having a semiconductor sensor device comprising a sensor housing partly filled with a rubber-elastic composition, and comprising a sensor chip with sensor region arranged in the interior of the housing, wherein the sensor housing has an opening to the surroundings, and the sensor region faces the opening, and wherein the sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing, comprising: producing a substrate plate with a plurality of semiconductor chip positions in which external contact areas are provided on the underside and contact pads are provided on the top side, which are electrically connected to one another via through contacts through the substrate plate and leave free a central position for a sensor chip;applying a structured mechanical buffer layer, which has a rubber-elastic composition, in the central positions of the semiconductor device positions onto the top side of the substrate plate;applying of sensor chips by their rear sides onto the rubber-elastic composition of the buffer layer in the semiconductor device positions;connecting of contact areas of the sensor chip to contact pads of the substrate plate via connecting elements, bonding wires;applying of spacers and a covering plate with openings for the sensor regions of the sensor chips in the semiconductor device positions;filling the intermediate region between substrate plate and covering plate with a rubber-elastic composition with embedding of the sensor chips, the connecting elements and the spacers to form a panel; andseparating the panel into individual semiconductor sensor devices.

22. The method of claim 21, wherein prior to the filling of the intermediate region with a rubber-elastic composition, mold stamps are inserted into the openings of the covering plate, which mold stamps have the contour of a depression for the rubber-elastic composition, wherein the mold stamps are removed prior to the separation of the panel into individual semiconductor sensor devices.

23. The method of claim 21, wherein a stamp plate having a plurality of mold stamps is positioned on the covering plate prior to the filling of the intermediate region with a rubber-elastic composition, wherein the mold stamps of the stamp plate are introduced into the openings of the covering plate, and wherein the stamp plate is removed prior to the separation of the panel into individual semiconductor sensor devices.

24. The method of claim 21, wherein the application of a structured mechanical buffer layer is effected by printing methods.

25. The method of claim 21, wherein prior to the application of spacers and a covering plate, the spacers are fixed on the covering plate.

26. The method of claim 21, wherein prior to the application of spacers and a covering plate, a one-piece covering plate with integral spacers is produced by injection molding.

27. The method of claim 21, wherein prior to the application of spacers and a covering plate, the spacers are fixed on the substrate plate.

28. The method of claim 21, wherein the filling of the intermediate region with a rubber-elastic composition is effected by dispensing technology.

29. The method of claim 21, wherein the fitting of bonding wires on contact areas of the sensor chip and on contact pads of the substrate plate is effected by thermocompression or thermosonic bonding.

30. The method of claim 21, wherein the separation of the panel into individual semiconductor sensor devices is effected by laser ablation or by sawing technology.