Claims
- 1. The method for installing sub enclosures within a primary enclosure including:
- 1. Forming a plurality of insulated rigid panels, each having a clip element upon each of two opposed edges;
- 2. Forming a multiplicity of double elongated post elements, each including clip accommodation means on their opposed elongated edges;
- 3. Placing heat arresting blocks between said double post elements, each of which blocks is thermally and electrically insulative;
- 4. Fastening a footing to the floor element of the primary enclosure;
- 5. Fastening a header element to the overhead structure of the primary enclosure;
- 6. Fastening a plurality of said posts at spaced distances from one another extending between said footing and header elements;
- 7. Inserting a plurality of said panels with their clip edges within the clip accommodation means of said posts; and
- 8. Placing a plurality of ceiling panels in cooperative relationship above said wall panels.
CROSS REFERENCE TO RELATED PATENT APPLICATIONS
This patent application is related to my copending application Ser. No. 573,165, filed Apr. 30, 1975 and this is a continuation-in-part thereof.
US Referenced Citations (1)
| Number |
Name |
Date |
Kind |
|
3623290 |
Downing |
Nov 1971 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
| Parent |
573165 |
Apr 1975 |
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