The present description relates to a light emitting diode (LED) lighting device having a heat sink and a surface mount LED lamp.
Light emitting diode (LED) light sources are susceptible to damage by excessive heat buildup. Surface mount LED light sources are energized at high power levels which increases an amount of heat generated. In some approaches, surface mount LED light sources include a heat sink located such that when the LED is mounted on a printed circuit (PC) board the heat sink contacts the PC board permitting terminal energy to flow from the LED to reduce a temperature of the LED. The inclusion of the heat sink increases the mass of the PC board. A PC board is usually small which reduces an amount of heat energy that the PC board can absorb. In addition, the PC boards typically have high thermal resistance reducing an ability to absorb heat energy. Finally, although the LED heat sink is facing the PC board, the LED heat sink is not in physical contact due to variations in soldering or dimensions, in some instances.
Battery one positive protrusion B1PP passes through hole 17 in printed circuit board 8 and contacts LED heat sink LH of LED lamp LL. Spring 5 creates a force pushing battery one B1 and battery two B2 towards LED lamp LL. However, the battery one B1 and battery two B2 have limited movement because LED heat sink LH exerts a counter force on the batteries at battery one positive protrusion B1PP. Hence, spring 5 maintains battery one positive protrusion B1PP pressed against LED heat sink LH. This pressed against relationship helps assure and maximize heat transfer from LED lamp LL to battery one B1. In order to maintain a pressed against relationship between LED lamp LL and battery one B1 printed circuit board 8 includes a printed circuit board thickness 8D which is less than projection distance PD (
Printed circuit board 8 also includes a plated thru positive hole 18 located under or adjacent to LED positive terminal LP. A positive compression spring PS includes a leg PSL passing through printed circuit board 8 at plated thru positive hole 18. Leg PSL is soldered within plated thru positive hole 18 and also soldered to LED positive terminal LP. Positive compression spring PS extends towards battery one B1 where the positive compression spring contacts battery one positive surface B1PS thereby completing a circuit C (
Spring 5 is pushing battery one B1 and battery two B2 against LED lamp LL and the resulting force sufficient to lift a contact pad or a track attaching LED lamp LL to printed circuit board 8 and separate LED lamp LL from printed circuit board 8, in some instances. Plated thru positive hole 18 and plated thru negative hole 15 are each one of several similar plated thru holes which act as anchors for securing respective LED terminals and ultimately LED lamp LL to printed circuit board 8, in some embodiments. Retainer 2 is molded of a transparent plastic and threaded onto housing 1 such that when the retainer is tightened spring 5 at housing end opened HEO makes contact with lower contact pad 9 thereby closing circuit C and energizing LED lamp LL, in some embodiments. Conversely when retainer 2 is loosened the retainer rotates lower contact pad 9 away from a top of spring 5, opens circuit C and de-energizes LED lamp LL. Hence, lower contact pad 9, retainer 2 and spring 5 cooperate to form a switch SW. Therefore, circuit C includes the battery one B1, battery two B2, spring 5, printed circuit board 8, LED lamp LL and switch SW for selectively de-energizing or energizing LED lamp LL. Retainer 2 is additionally contoured to provide a retainer support 2S on a retainer dome 2D to support and deter LED lamp LL from moving away from or being separated from printed circuit board 8 due to the forces developed by spring 5, in some embodiments.
Removing heat from LED lamp LL decreases a temperature of the LED lamp and therefore increases the luminous efficacy of the lamp. The heat which flows into battery one B1, which functions as a metallic heat sink, warms the battery. In cold environments batteries fail to function properly, in some instances. Therefore, warming battery one B1 improves an ability of the battery one to provide energy in cold environments.
One aspect of this description relates to a light emitting diode (LED) lighting device including a circuit configured to energize a surface mount LED lamp having an LED heat sink with a source of power. The LED lighting device further includes a printed circuit board having a first side, a second side and an opening extending from said first side to said second side. The surface mount LED lamp attached to said first side with said LED heat sink located adjacent to said opening on said first side. The LED lighting device further includes a fixture configured to hold said printed circuit board and position a metallic heat sink having a protrusion on said second side of said printed circuit board with said protrusion passing through said opening and contacting said LED heat sink.
Another aspect of this description relates to a light emitting diode (LED) lighting device. The LED lighting device includes a circuit configured to energize a surface mount LED lamp having an LED heat sink, wherein the circuit comprises a source of power. The LED lighting device further includes a printed circuit board having a first side, a second side and an opening extending from said first side to said second side. The surface mount LED lamp is attached to said first side, and said LED heat sink is located adjacent to said opening on said first side. The LED lighting device further includes a fixture configured to hold a spring, said printed circuit board, and a metallic heat sink having a protrusion, said metallic heat sink is located on said second side of said printed circuit board with said protrusion passing through said opening, said spring configured to press said protrusion against said LED heat sink.
Still another aspect of this description relates to a light emitting diode (LED) lighting device. The LED lighting device includes a circuit configured to energize a surface mount LED lamp with a battery, said LED having an LED heat sink. The LED lighting device further includes a printed circuit board having a first side, a second side and an opening extending from said first side to said second side. The surface mount LED lamp solder bonded to said first side with said LED heat sink located adjacent to said opening on said first side. The LED lighting device further includes a fixture having a tubular housing comprising a first housing end and a second housing end, wherein said second housing end is a closed end. The battery has a positive terminal having a protrusion and a negative terminal, said battery positioned within said housing with said negative terminal about said second housing end and said positive terminal about said first housing end, said fixture having a retainer for holding said printed circuit board at said first housing end with said battery on said second side and said protrusion passing through said opening and contacting said LED heat sink, said printed circuit board comprising a thickness less than a length of said protrusion. The fixture is configured to hold a spring for pressing said protrusion against said LED heat sink.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Number | Name | Date | Kind |
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20070109775 | Chen | May 2007 | A1 |
20110019395 | Malkoff | Jan 2011 | A1 |