Patent Application
20100282823
The field to which the disclosure generally relates to magnetic particle containing materials that may be used to fasten together substrates.
Soldering is a process in which two or more metal substrates are joined together by melting and flowing a filler metal into the joint, the filler metal having a relatively low melting point. In a conventional soldering process, heat is applied to the substrates to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the substrates to be joined by wetting action. A solder flux agent or material is typically used to assist the flow of the solder into the desired location.
Metal substrates may alternatively be joined together using polymeric adhesive materials. Conventionally, this is done by applying the adhesive between the metal substrates. The substrates may also be fastened in a similar manner to a conventional soldering process.
In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more substrates together to form an integrated part. The magnetic particles in the fastening material may allow a molten mixture of the fastening material to be drawn to a desired location through use of a magnet, electromagnet or magnetic field.
Other exemplary embodiments of the invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while disclosing exemplary embodiments of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Exemplary embodiments of the invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
The following description of the embodiment(s) is merely exemplary (illustrative) in nature and is in no way intended to limit the invention, its application, or uses.
Referring now to
In one embodiment, as shown first in
As shown in
A fastening material 40 in a molten or liquid state containing magnetic particles 42 may then be introduced onto a non-mated surface 50 of the substrate 12 opposite the magnetic mold base 60. As best shown in
The drawing rate of the molten material 40 towards the magnetic mold base 60 is a function of the size of the cavities 38, the viscosity of the molten material 40, the force of gravity and the strength of the magnetic field created by the magnetic mold base 60.
At this point, as shown in
In an alternative exemplary arrangement to the arrangement as shown in
In still another alternative exemplary arrangement to supplement the introduction of the fastening material 40 as in
In yet another alternative exemplary arrangement to
In one exemplary embodiment for any of the exemplary embodiments of
Exemplary alloys of bismuth, indium, and/or tin that may be utilized in the high temperature alloy fastening material 40 include Indalloy 174, Indalloy 162, and Indalloy 19, each having compositions described below in Table 1 (percentages are weight percents):
Exemplary magnetic materials 42 that may be used with the exemplary alloys include iron powders (I.P.) such as CM (average particle size 8 micron) or HS (average particle size 2 micron), or combinations thereof, both supplied by BASF Corp. of Mt. Olive, N.J. These exemplary magnetic materials 42 may be surface treated with phenyl phosphonic acid (PPA), 14MAG124 (a magnetorheological fluid) or with silica (SiO2) to reduce oxidation at elevated temperatures. These magnetic materials 42 may be washed with solvents prior to introduction to the material 40 to remove residual oils from the iron powders.
Exemplary formulations of fastening materials 40 including one of the high temperature alloys of Table 1 with the exemplary magnetic materials 42 which were hand mixed with a spatula for a predetermined amount of time. These exemplary formulation are provided in Table 2:
In another exemplary formulation for the fastening material 40, the fastening material 40 may be a high melting temperature polymeric material containing the afore-mentioned magnetic particles 42. Exemplary thermoplastic polymers that may be utilized include nylon, polypropylene, polystyrene, or polyethylene.
The method for bonding together the substrates 12, 14 to form an integrated part 10, as shown in
This bonding method of the exemplary embodiments provides a number of benefits. For example, pieces of either similar or dissimilar substrates can be fastened together quickly and easily. Also, multiple fastening operations can be performed at one time. Further, either temporary or permanent fasteners can be installed using the same exemplary method. Also, bonds of varying strength may be realized through the use of different integrated part 10 materials, different sized holes, and differing magnetic flux density. Finally, the fastening process can be readily reversed by heating of the fastening material 40 above its melting point and applying a magnet to remove the molten fastening material.
The above description of embodiments of the invention is merely exemplary in nature and, thus, variations thereof are not to be regarded as a departure from the spirit and scope of the invention.
In select exemplary embodiments the magnetic particles in the solder composition may be present in an amount ranging from about 0.01-50 weight (wt.) percent; about 1-10 wt. percent; about 2-6 wt. percent or about 3-20 wt. percent.
