Claims
- 1. A wave soldering apparatus comprising:a means to apply molten solder to a desirable surface of a module, a means to transfer the module across the molten solder, a means to apply acoustic pressure waves through air to the module/solder interface proximate the exit of the wave.
- 2. The apparatus of claim 1 where the means to produce the acoustic pressure waves utilizes a transducer.
- 3. The apparatus of claim 1 where the means to produce the acoustic pressure waves includes a means to at least one of vary and oscillate an angle of direction towards the module/solder interface.
- 4. The apparatus of claim 1 where the means to produce the acoustic pressure waves utilizes multiple transducers.
- 5. A wave soldering apparatus comprising:a means to apply molten solder to the desirable surface of a module, a means to transfer the object across the molten solder, a means to apply acoustic pressure waves through air proximate to the module/solder interface at the exit of the wave, where the means produces ultrasonic frequencies.
- 6. The apparatus of claim 5 where a transducer is used to produce the acoustic pressure waves.
- 7. The apparatus of claim 5 where the air is a reduced oxygen atmosphere.
- 8. The apparatus of claim 1 where the air is a reduced oxygen atmosphere.
- 9. The apparatus of claim 4 where the means to produce the acoustic pressure waves includes a means to at least one of vary and oscillate an angle of direction towards the module/solder interface.
- 10. The apparatus of claim 5 where the means to produce the acoustic pressure waves includes a means to at least one of vary and oscillate an angle of direction towards the module/solder interface.
- 11. The apparatus of claim 5 where the means to produce the acoustic pressure waves utilizes multiple transducers.
- 12. The apparatus of claim 11 where the means to produce the acoustic pressure waves includes a means to at least one of vary and oscillate an angle of direction towards the module/solder interface.
Parent Case Info
This patent application claims priority from U.S. Provisional Application No. 60/071,866, filed Jan. 20, 1998, entitled Vibrational Energy for Improved Soldering of Printed Circuit Assemblies.
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Name |
Date |
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4632291 |
Rahn et al. |
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Provisional Applications (1)
|
Number |
Date |
Country |
|
60/071866 |
Jan 1998 |
US |