Claims
- 1. A method for forming an isotropic soft magnetic nitride alloy layer on a substrate by means of sputtering wherein a target to be used comprises an alloy having composition ratio represented by the formula Ma'Tb'Xc' and the sputtering step is carried out in an atmosphere of Ar mixed with nitrogen gas and under a negative bias voltage continuously applied throughout said method to the substrate to form a single layer of soft magnetic nitride alloy having a composition ratio represented by the formula TaMbXcNd, wherein T is at least one metal selected from the group consisting of Fe, Co and Ni; M is at least one metal selected from the group consisting of Nb, Zr, Ti, Ta, Hf, Cr, Mo, W and Mn; X is at least one semimetal or semiconductor element selected from the group consisting of B, C, Si, Ge and Al; N is nitrogen; a', b', c', a, b, c and d indicate atomic percentage and their relation is as follows:
- 70.ltoreq.a'.ltoreq.99
- 0.ltoreq.b'.ltoreq.20
- 0.ltoreq.c'.ltoreq.20
- 1.ltoreq.b'+c'
- 65.ltoreq.a.ltoreq.98
- 0.ltoreq.b.ltoreq.20
- 0.ltoreq.c.ltoreq.20
- 1.ltoreq.d.ltoreq.20
- 1.ltoreq.b+c
- a+b+c+d=100.
- 2. A method for forming an isotropic soft magnetic nitride alloy layer on a substrate by means of sputtering wherein a target to be used comprises an alloy having composition ratio represented by the formula Ma'Tb'Xc' and the sputtering step is carried out in an atmosphere of Ar periodically mixed with nitrogen gas to be reacted with an element or elements to be deposited and under a negative bias voltage continuously applied throughout said method to the substrate to form a laminated layer of soft magnetic nitride alloy comprising nitride layer or layers and non-nitride layer or layers and having an average composition ratio represented by the formula TaMbXcNd, wherein T is at least one metal selected from the group consisting of Fe, Co and Ni; M is at least one metal selected from the group consisting of Nb, Zr, Ti, Ta, Hf, Cr, Mo, W and Mn; X is at least one semimetal or semiconductor selected from the group consisting of B, C, Si, Ge and Al; N is nitrogen; a', b', c', a, b, c and d indicate atomic percentage and their relation is as follows:
- 70.ltoreq.a'.ltoreq.99
- 0.ltoreq.b'.ltoreq.20
- 0.ltoreq.c'.ltoreq.20
- 1.ltoreq.b'+c'
- 65.ltoreq.a.ltoreq.98
- 0.ltoreq.b.ltoreq.20
- 0.ltoreq.c.ltoreq.20
- 1.ltoreq.d.ltoreq.20
- 1.ltoreq.b+c
- a+b+c+d=100.
- 3. The method for forming a soft magnetic nitride alloy layer on a substrate by means of sputtering according to claims 1 or 2, there is further including a heat treatment step of the soft magnetic nitride alloy layer deposited on the substrate in a temperature of more than 300.degree. C. to less than 800.degree. C. to improve a soft magnetic characteristic.
- 4. The method of claim 1 wherein the target is larger than the distance between the substrate and the target.
- 5. The method according to claim 2 wherein the target is larger than the distance between the substrate and the target.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-260896 |
Sep 1990 |
JPX |
|
Parent Case Info
This application is a continuation of now abandoned application, Ser. No. 07/766,794, filed on Sep. 27, 1991 abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
64-15366 |
Jan 1989 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
766794 |
Sep 1991 |
|