Claims
- 1. A surface acoustic wave device comprising a plurality of surface acoustic wave elements, each having a comb electrode formed on a piezoelectric substrate and connection terminals connected to the comb electrode; and a package which has a die attach surface to which each of the connection terminals is joined or bonded through a bonding member, and in which said plurality of surface acoustic wave elements are housed side by side.wherein the bonding member has a shape elongated in a direction substantially perpendicular to a direction in which said surface acoustic wave elements are juxtaposed.
- 2. A surface acoustic wave device according to claim 1, wherein said plurality of surface acoustic wave elements include a surface acoustic wave element having a frequency characteristic different from that of other surface acoustic wave elements.
- 3. A surface acoustic wave device aecording to claim 1, wherein the connection terminal is formed into an elongated shape which is shorter along a direction in which said surface acoustic wave elements are juxtaposed.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-138098 |
May 2000 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a Continuation Application of PCT Application No. PCT/JP01/03864, filed May 9, 2001, which was not published under PCT Article 21(2) in English.
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-138098, filed May 11, 2000, the entire contents of which are incorporated herein by reference.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP01/03864 |
May 2001 |
US |
Child |
10/042196 |
|
US |