Patent Application
20100255219
This application claims the benefit of priority under 35 U.S.C. §119 from Korean Patent Application No. 10-2009-0029882, filed on Apr. 7, 2009, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
1. Field
Example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet. Other example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet by performing an annealing process on carbon nanotubes or fullerenes.
2. Description of the Related Art
Carbon-based materials (e.g., a carbon nanotubes, diamond, graphite, graphene and the like) have been studied in various nanotechnology areas. Such carbon-based materials are being used, or may be used, in field effect transistors (FETs), biosensors, nanocomposites, quantum devices or similar devices.
Graphene is a two-dimensional zero-gap (band gap is zero) semiconductor. Various studies about the electrical properties of graphene (e.g., bipolar supercurrent, spin transport, quantum Hall effect, etc.) have been published in recent years. Graphene is now drawing attention as a material for carbon-based integrated nanoelectronic devices.
There has been suggested a method of preparing a graphene sheet by transferring graphene, which is exfoliated (or is derived from) from graphite, to a substrate using a tape. Because a high vacuum process is performed at substantially high temperatures of about 1150° C. to about 1400° C. to obtain high quality graphene sheets, it may be difficult to mass produce the high quality graphene sheets.
Example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet. Other example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet by performing an annealing process on carbon nanotubes or fullerenes.
Example embodiments also relate to methods of preparing a two-dimensional graphene sheet.
According to example embodiments, a method of preparing a graphene sheet includes aligning carbon-containing materials on a substrate, and performing an annealing process on the substrate including the carbon-containing materials to prepare a graphene sheet on the substrate.
The carbon-containing carbon materials may be carbon nanotubes or fullerenes.
Performing the annealing process may include heating portions of the substrate that contact the carbon-containing materials to a temperature greater than a zone melting temperature or a recrystallization temperature of the substrate. The annealing process may be a laser annealing process or a rapid thermal annealing (RTA) process.
The substrate may be formed of silicon (Si), silicon carbide (SiC), silicon on insulator (SOI), amorphous-Si (a-Si), poly-Si, a-SiC or glass. The substrate may be a quartz substrate or a glass substrate on which a thin film of a-Si, poly-si, a-SiC, germanium (Ge) or germanium carbide (GeC) is formed.
The substrate may react (or mix) with the carbon-containing materials due to the annealing process to form silicon carbide (SiC).
Example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.
Various example embodiments will now be described more fully with reference to the accompanying drawings in which some example embodiments are shown. However, specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments. Thus, the invention may be embodied in many alternate forms and should not be construed as limited to only example embodiments set forth herein. Therefore, it should be understood that there is no intent to limit example embodiments to the particular forms disclosed, but on the contrary, example embodiments are to cover all modifications, equivalents, and alternatives falling within the scope of the invention.
In the drawings, the thicknesses of layers and regions may be exaggerated for clarity, and like numbers refer to like elements throughout the description of the figures.
As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, if an element is referred to as being “connected” or “coupled” to another element, it can be directly connected, or coupled, to the other element or intervening elements may be present. In contrast, if an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.).
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes” and/or “including,” if used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
Spatially relative terms (e.g., “beneath,” “below,” “lower,” “above,” “upper” and the like) may be used herein for ease of description to describe one element or a relationship between a feature and another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, for example, the term “below” can encompass both an orientation that is above, as well as, below. The device may be otherwise oriented (rotated 90 degrees or viewed or referenced at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.
Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures). As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but may include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle may have rounded or curved features and/or a gradient (e.g., of implant concentration) at its edges rather than an abrupt change from an implanted region to a non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation may take place. Thus, the regions illustrated in the figures are schematic in nature and their shapes do not necessarily illustrate the actual shape of a region of a device and do not limit the scope.
It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the, art to which example embodiments belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In order to more specifically describe example embodiments, various aspects will be described in detail with reference to the attached drawings. However, the present invention is not limited to example embodiments described.
Example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet. Other example embodiments relate to methods of preparing (or forming) a graphene (or carbon-based) sheet by performing an annealing process on carbon nanotubes or fullerenes.
According to example embodiments, a graphene (or carbon-based) sheet may be prepared in a process by performing an annealing process (e.g., a laser annealing process or a rapid thermal annealing (RTA) process) on carbon-containing materials (e.g., carbon nanotubes or fullerenes) distributed on a substrate.
Referring to
The carbon nanotubes 11 and 12 aligned on the substrate 10 may be formed using arc discharge, laser ablation, chemical vapor deposition (CVD) or a similar method. A process of forming the carbon nanotubes 11 and 12 on the substrate 10 by using metal catalyst particles involves arranging the metal catalyst particles into desired positions on the substrate 10, and supplying gaseous carbon sources (e.g., acetylene or methane) such that thermal decomposition occurs between the metal catalyst particles and the gaseous carbon.
The substrate 10 may be formed of silicon (Si), silicon carbide (SiC), silicon on insulator (SOI), amorphous-Si (a-Si), poly-Si, a-SiC or glass. The substrate 10 may be a quartz substrate or a glass substrate on which a thin film formed of a-Si, poly-si, a-SiC, germanium (Ge) or germanium carbide (GeC) is deposited.
Referring to
The annealing process may be performed to heat the substrate 10. The annealing process may maintain the substrate 10 in a vacuum state and/or in an argon (Ar) or nitrogen (N2) atmosphere.
Referring to
Portions of the fullerenes 21 and 22 that contact the substrate 20 react (or mix) with the substrate 20 due to the annealing process to form a compound. A two-dimensional graphene sheet 23 is left on the substrate 20.
The annealing process may be performed to heat the substrate 20. The annealing process may maintain the substrate 20 in a vacuum state and/or in an Ar or N2 atmosphere.
Referring to
For example, if the substrate 30 includes silicon (Si), Si reacts with carbon (C) from the carbon nanotubes or fullerenes 31 to form a compound of SiC. If an excimer laser is used, because durations for which the contact portions 33 of the substrate 30 are in a melted state are substantially short (e.g., tens of nanoseconds), Si relatively instantly reacts with the carbon (C). Upper portions 32 of the carbon-containing materials 31 (carbon nanotubes or fullerenes), which are opposite to the lower portions of the carbon-containing materials 31 (carbon nanotubes or fullerenes) that contact the substrate 30, are laid (or become) flat due to the elasticity of the upper portions 32 while the lower portions of the carbon-containing materials 31 (carbon nanotubes or fullerenes) react with the melted silicon (Si).
As such, only the upper portions of the carbon-containing materials 31 (carbon nanotubes or fullerenes), which do not contact the substrate 30, remain so that a graphene sheet 34 remains on the substrate 30. Because the carbon nanotubes or fullerenes 31 are rarely damaged by the irradiation of a laser beam while the substrate 30 is melted, the graphene sheet 34 is formed on the substrate 30 formed of SiC (or having the SiC compound). The annealing process (e.g., the laser annealing process or the RTA process) may be performed to heat the substrate 30 to a temperature that is greater than a melting temperature or a recrystallization temperature of the substrate 30.
If graphene, which is a two-dimensional sheet of carbon atoms, is rolled up, then a carbon nanotube is formed. If the carbon nanotube is unrolled, a nanoscale two-dimensional graphene sheet may be formed. The melting point of silicon (Si) is about 1410° C., and Si reacts with carbon (C) at (or about) the melting point of Si to form SiC as a solid solution.
Graphene may grow on a 4H—SiC or 6H—SiC (0001) surface using epitaxy. According to example embodiments, a process to prepare a graphene sheet is realized because the graphene sheet may be prepared by instantly performing an annealing process on only portions of a substrate using a laser. According to other example embodiments, if a substrate is formed of a Ge-based material, a process of preparing a graphene sheet is realized because the graphene sheet may be prepared based on the fact that a reaction temperature between Ge and C is lower than the melting point of the substrate. Thus, an additional high vacuum and high temperature process is not necessary.
According to example embodiments, a graphene sheet may be prepared by performing an annealing process on carbon nanotubes or fullerenes that are aligned on a substrate.
An additional high vacuum and high temperature process is not necessary. As such, a higher quality and larger scale graphene sheet may be prepared.
The above graphene sheets may be used in field effect transistors (FETs), biosensors, nanocomposites, quantum devices or similar devices. Likewise, the above methods of preparing a graphene sheet may be used in methods of forming field effect transistors (FETs), biosensors, nanocomposites, quantum devices or similar devices.
The foregoing is illustrative of example embodiments and is not to be construed as limiting thereof. Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in example embodiments without materially departing from the novel teachings and advantages. Accordingly, all such modifications are intended to be included within the scope of this invention as defined in the claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function, and not only structural equivalents but also equivalent structures. Therefore, it is to be understood that the foregoing is illustrative of various example embodiments and is not to be construed as limited to the specific embodiments disclosed, and that modifications to the disclosed embodiments, as well as other embodiments, are intended to be included within the scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2009-0029882 | Apr 2009 | KR | national |
