Information
-
Patent Grant
-
6743300
-
Patent Number
6,743,300
-
Date Filed
Tuesday, January 15, 200222 years ago
-
Date Issued
Tuesday, June 1, 200420 years ago
-
Inventors
-
-
Examiners
Agents
- Barlow, Josephs & Holmes, Ltd.
-
CPC
-
US Classifications
Field of Search
-
International Classifications
-
-
Disclaimer
Terminal disclaimer Term Extension
118
Abstract
The present invention is directed to a controlled environment processing chamber or chambers in which solvents and/or solutions used for processing a material or object can be introduced. The process includes a means of applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. Means are provided for introducing a solvent, solvent mixture or solution in either a liquid or vapor state. A first system recovers solvent(s) or solution(s) from the object being processed and chamber, and a second system, separate from the first system, further recovers residual solvent or solution from the object and chamber. Treatment may be in the form of coating, etching, deposition, cleaning, stripping, plating, adhesion, dissolving, penetrating, anodizing, impregnating, debinding or any other process in which material is removed or deposited on a solid surface by transfer from or to a liquid or gas phase. Another aspect of the invention provides for a method of processing an object using the system described above.
Description
BACKGROUND OF THE INVENTION
The instant invention relates to a new method for processing parts using solvents. More particularly the present invention relates to a single chamber solvent processing method whereby parts that require solvent processing can be subjected to multiple processing steps in one containment chamber.
In the finishing of metals, plastics, ceramics, composites and other materials, often many process steps are required either for intermediate processing or to produce a finished product. Some steps may include cleaning, drying, anodizing, film deposition, painting, impregnating, curing, heat-treating and other processes. Most of these steps require the use of organic solvents and/or inorganic chemicals, which often are regarded as environmental hazards, or health threats to workers. As a result, more often than not these processes are highly regulated by the EPA and/or local air and water pollution agencies. Quite often, these processes are carried out in special areas to either control emissions or limit ambient contamination between process steps. For these types of processes, it would seem advantageous to be able to perform multiple steps within a single chamber or enclosed environment in order to maintain the required quality control and/or limited emissions to the work place. Such a process method would improve the product quality and reduce pollution, labor costs and overall costs of controlled environment work areas such as clean rooms.
SUMMARY OF THE INVENTION
In this regard, the present invention is directed to a controlled environment processing chamber or chambers in which solvents and/or solutions used for processing a material can be introduced. The process includes a means of applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. Means are provided for introducing a solvent, solvent mixture or solution in either a liquid or vapor state. A first system recovers solvent(s) or solution(s) from the object being processed and chamber, and a second system, separate from the first system, further recovers residual solvent or solution from the object and chamber. Treatment may be in the form of coating, etching, deposition, cleaning, stripping, plating, adhesion, dissolving, penetrating, anodizing, impregnating, de-binding or any other process in which material is removed or deposited on a solid surface by transfer from or to a liquid or gas phase.
In another aspect of the invention, a method of processing an object in an enclosed solvent processing system, including a solvent supply system in sealable communication with a cleaning chamber comprises the steps of:
(a) sealing the solvent or solution supply system with respect to the chamber;
(b) evacuating the supply system of air and non condensable gases and maintaining this air free environment
(c) opening the chamber to atmosphere and placing an object to be processed in the chamber;
(d) evacuating the chamber to remove air and other non-condensable gases;
(e) sealing the chamber with respect to atmosphere;
(f) opening the chamber with respect to the solvent supply system and introducing a solvent or solution into the evacuated chamber;
(g) processing the object while maintaining an air free environment within the chamber;
(h) recovering and processing the solvent or solution introduced into the chamber within the closed circuit processing system;
(i) introducing another solvent or solution as a liquid, gas or vapor to further process the object;
(j) recovering and processing the 2
nd
solvent or solution introduced into the chamber within the closed circuit processing system;
(k) repeating steps (h) and (i) as required;
(l) sealing the chamber with respect to the solvent supply system closed circuit solvent processing system;
(m) introducing air or other non condensable gases into the chamber for sweeping further solvent on the object and within the chamber; and
(n) opening the chamber and removing the treated object.
The main objective of this invention is to maintain two or more solutions used for processing an object in two or more steps at a relatively constant concentration state from batch to batch. In order to accomplish this, a process must either prevent any mixing of solvent or solution vapors or liquids with previous solvents or solutions used in the processing, or separate solvents mixed during different processing steps to return the solutions to their starting compositions. Another main objective of this invention is to prevent solvents or solutions used in the processing from mixing with air, which would eventually lead to this solvent escaping the system as this air is discharged during the process. Any air used for solvent recovery, motive gas for vacuum, drying, curing, or other processing is internally circulated to provide a closed looped system requiring no discharge of air or solvent from the unit.
Another object of this invention is to provide an improved closed circuit solvent system and method, which enables solvent recovery and limits hazardous emissions. The invention can employ a variety of solvents having boiling points as low as 70 degrees Fahrenheit and as high as 500 degrees Fahrenheit.
Other objects, features and advantages of the invention shall become apparent as the description thereof proceeds when considered in connection with the accompanying illustrative drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
In the drawings which illustrate the best mode presently contemplated for carrying out the present invention:
FIG. 1
is a schematic view of the preferred embodiment of the system used for the solvent processing method of the present invention;
FIG. 2
is a schematic view of an alternate embodiment thereof;
FIG. 3
is a schematic view of a second alternate embodiment thereof; and
FIG. 4
is a schematic view of a third alternate embodiment thereof.
DETAILED DESCRIPTION OF THE INVENTION
Multiple step processing of materials within industries can vary in technique and processing chemicals. However, this processing invention can best be understood by reference to the following illustrative examples.
This first example is a multi-step processing method utilizing mixtures of the same miscible chemicals, however, using different concentrations of the chemical mixture to treat an object at different times and to accomplish a different treatment method. An example of this process method would be the removal of contaminants from the surface of an object followed by the introduction of a different concentrated solvent mixture to remove any residual contaminant and/or wash solvent or solution. The rinse step could be used to enhance a third step such as a drying step.
FIG. 1
is a depiction of this process. As an example of this process, a concentrated aqueous surfactant solution containing less than 10 wt % isopropanol (IPA) is used to clean a substrate followed by a liquid rinse with a solution containing greater than 50% IPA.
In
FIG. 1
, the process method
10
includes a cleaning chamber
12
having a jacket
14
in fluid communication with a heat source
16
(i.e., steam). An object
18
requiring cleaning is placed upon a support
20
fixedly mounted within the cleaning chamber
12
. A valve
22
, in fluid communication with the atmosphere and the cleaning chamber
12
, is provided for selectively introducing air into the cleaning chamber
12
.
The object
18
to be cleaned is placed into the cleaning chamber
12
on the support
20
through an opening created by removing a lid
28
. After receiving the object
18
, the lid
28
is secured to the cleaning chamber
12
wherein the cleaning chamber is sealed. The air handling vacuum pump
38
is used to remove virtually all the air from the cleaning chamber
12
through valve
72
.
The aqueous cleaning solution is preferably introduced to the cleaning chamber
12
from a fluid supply tank
24
as a heated liquid soak as through pump
82
and valve
76
. Typically, the solution can be circulated by opening the overflow valve
58
or drained and refilled by opening valve
30
and returning the solution to the fluid supply tank
24
. The solution may be agitated as well as with jet pumps or spray nozzles on the inlet line through valve
76
, or with typical ultrasonic transducers (not shown).
After the object
18
has been cleaned, any liquid solvent remaining in the cleaning chamber
12
is drained and/or pumped into the heated fluid solvent vessel
24
by opening valve
30
. The drained liquid will also remove most of the chips or insoluble material, if present, and transfer them to the heated solvent vessel
24
.
In a second step, a clean solution of IPA-water, richer in IPA, can now be sprayed on the substrate by opening valve
80
, activating pump
46
and spraying the solution through nozzle
78
. The cleaner, higher IPA concentrated solution rinses residual surfactants and contaminants from the surface and replaces excess water with a faster drying IPA solvent. The rinse solution is sent to the fluid supply tank
24
by opening valve
30
.
Solvent vapors are next removed from the cleaning chamber
12
by means of a solvent handling vacuum pump
32
. Specifically valve
34
is opened and vacuum pump
32
is activated and since there is no air present in this system, solvent vapors can be easily condensed in a heat exchanger
62
and the clean condensed solvent can be sent to the clean fluid holding tank
26
to be stored for reuse as clean spray for the next cleaning and rinse cycle. During this vapor-scavenging step, any residual solvent liquid remaining on the heated parts boils off the parts at the lower vacuum pressures, thus reducing solvent residual left in the vessel or on the parts. Since IPA dries faster and tends to spot less than water, a higher concentration of IPA enhances this drying process.
Upon removal of solvent vapor and liquid from the cleaning chamber
12
, the chamber is then returned to atmospheric pressure by introducing ambient air through valve
22
to the cleaning chamber
12
. Depending upon the vacuum level attained in the vapor-scavenging step, the cleaning chamber
12
may contain residual solvent vapors, which can be removed by evacuating the chamber
12
through valve
72
using a second vacuum pump
38
. Collecting residual solvent in activated carbon filter
56
or in scrubbers or other conventional air stripping processes can treat the effluent air stream. This introduction of air followed by purging the cleaning chamber
12
can be repeated as many times as necessary prior to opening the cleaning chamber
12
and removing the cleaned article
18
. In the preferred embodiment, ambient air may not be introduced to the chamber or the cleaned article
18
may not be removed from the chamber, and additional processing steps can be performed since the chamber can be completely void of air and chemicals or has been returned to the initial stage of containing just the article and ambient air.
In the process above, essentially all of the solvent has been recovered and therefore the overall concentration of the two solvents in the system
10
has not changed. The rinse used in the process, however is sent to the fluid supply tank
24
, therefore there is a shift in the amount, and concentrations of the solvents in the fluid supply tank
24
and the clean fluid holding tank
26
. The system can be returned to its' initial state by opening valve
60
and activating vacuum pump
32
. The tank is then heated by opening valve
70
and introducing steam from source
16
to vessel jacket
68
. The solvent vapor mixture is boiled from the fluid supply tank
24
and condensed in heat exchanger
62
and returned to clean fluid holding tank
26
through vacuum pump
32
. The vapors are mixed with liquid solvent from the clean fluid holding tank
26
, which is circulated to the vacuum pump
32
through pump
46
, through heat exchanger
36
and through open valve
64
. Upon distilling essentially all of the volume of the solvent mixture used previously in the rinse step over to tank
26
, the concentrations and amount of solvent in each tank is essentially returned to their original amounts. In this example, since the IPA is more volatile than water, the clean fluid holding tank
26
will be richer in IPA and the fluid supply tank
24
will mostly contain water. Surfactants are relatively non-volatile and therefore the surfactants remain concentrated in the wash fluid supply tank
24
.
Other types of two step wash-rinse processes would include a Normal Methyl Pyrolidone wash followed by a water rinse, a Trichloroethylene wash with an Ethanol rinse, a Tetrachloroethylene wash followed by a Methyl Alcohol rinse or a Normal Propyl Bromide wash with a 2,3-dihydrodeca-fluoropentane rinse.
Other examples of this type of process would include a two-step cleaning process in which the first step cleans organic contaminants with a lipophilic solvent followed by a cleaning of water-soluble contaminant with a hydrophilic solvent. Miscible mixtures of alcohols with halogenated solvents would be an example of the type of solvent mixtures that could be used. Methanol-Normal Propyl Bromide, Ethanol-Trichloroethylene, Isopropyl Alcohol-Tetrachloroethylene or Furfuryl Alcohol-2,3-dihydrodecafluropentane are some examples of mixtures, which could be used.
The process above, although essentially eliminating the change in solution concentrations and amounts by preventing losses to the environment, does allow the accumulation of high boiling contaminants in the wash solution in fluid supply tank
24
.
FIG. 2
shows a process, which is an enhancement of the process method above. In the process
10
in
FIG. 2
, the addition of a second heated vessel
74
allows for a greater separation of the two component cleaning and rinse solutions, as well as providing for a continuous removal of waste from the cleaning solution. The process is similar to the process above, except that the cleaning solution at the end of the cleaning step is drained to the distilling tank
74
through valve
30
rather than directly to the fluid supply tank
24
as in the process above. This process
10
works well if the wash solution can be fully recovered for reuse by distilling. In the process above the surfactant used in the aqueous wash could not be recovered by distilling however if we replace the surfactant aqueous solution with tetrachloroethylene (PCE), the PCE could be distilled from distilling vessel
74
and returned to the fluid supply vessel
24
as clean wash.
In this system
10
in
FIG. 2
, the fluid supply vessel
24
would contain a higher concentration of tetrachloroethylene than the clean fluid holding tank
26
which would be richer in IPA. The PCE rich wash would preferably remove organic soluble contaminant and the IPA would rinse off the hydrophilic contaminants left behind after washing. The distilling tank
74
would contain a higher amount of solvent after receiving the wash and rinse from the process described above.
In the preferred embodiment, the distilling tank
74
can continuously distill to a knockout pot
84
. The knockout pot
84
, distilling tank
74
and heat exchanger
62
are first evacuated of non-condensable gases by opening valves
44
and
88
and activating vacuum pump
32
. Upon evacuating the distilling tank
74
, valve
88
is closed and valve
52
is opened introducing steam from source
16
to jacket
54
. The evaporating PCE-IPA solvent mixture is condensed in heat exchanger
62
and collected in knockout pot
84
. Once the solvent is sent to the knockout pot, valve
44
is closed, valve
86
is opened, and the solvent distilled PCE-IPA mixture is returned to the fluid supply tank
24
for reuse as a wash. The evaporating PCE rich mixture in the distilling tank
74
could also be used as a PCE rich vapor degreasing fluid for chamber
12
by opening valve
92
during the heating process above.
The PCE-IPA mixture in fluid supply tank
24
can now be further distilled to produce the rinse for the clean fluid holding tank
26
. The system can be returned to its' initial state by opening valve
60
and activating vacuum pump
32
. The tank is then heated by opening valve
70
and introducing steam from source
16
to vessel jacket
68
. The solvent vapor mixture is boiled from fluid supply tank
24
and condensed in heat exchanger
62
and returned to the clean fluid holding tank
26
through vacuum pump
32
. The vapors are mixed with liquid solvent from the clean fluid holding tank
26
, which is circulated to the vacuum pump
32
through pump
46
, through heat exchanger
36
and through open valve
64
. Upon distilling essentially all of the volume of the solvent mixture over to the clean fluid holding tank
26
, the concentrations and amount of solvent in each tank is essentially returned to their original amounts. In this example, since the IPA is more volatile than PCE, and the clean fluid holding tank
26
will be richer in IPA and the fluid supply tank
24
will be richer in PCE.
The modified process above is limited in the concentrations attainable for washing and rinsing because as mentioned, the solvent recovery system is only a two-stage process.
FIG. 3
shows a process
10
, which adds a separation column
90
to the process to replace the knockout pot in the modified process described above. The separation column
90
can be a plate, bubble, packed, spray or any other type of mass transfer equipment used to separate two or more solvent components into one or more streams of different solvent concentrations. In the process in
FIG. 3
, all the steps in the process described above can apply. The enhanced modification is in the recovery of the solvent mixtures. As depicted in
FIG. 3
, valve
44
opens into the separation column
90
to feed a vapor stream to be separated. If desired a liquid stream can be used and heated vessel
74
can be eliminated however in the preferred embodiment, heated vessel
74
separates contaminant from the solvent mixture prior to return as a wash solvent to be disposed of periodically in waste drum
50
. Valve
60
in process
10
directs vapor from the fluid supply tank
24
to the bottom of the separation column
90
and valve
66
now directs recycled liquid to the top of the separation column. The net result is a greater concentration difference between fluid supply tank
24
, which in this example would be richer in PCE and clean fluid holding tank
26
which would be richer in IPA. Changing the number of trays or height of packing, changing the quantity of liquid returned through valve
66
or vapor returned through valve
60
, or changing the level of the vacuum pulled by vacuum pump
32
can now vary the amount of separation.
Process II
Another type of process is shown in
FIG. 4
in which it may be desirable to keep miscible solvents and/or solvent mixtures involved in different processing steps completely separated. Process
100
in
FIG. 4
shows a two-step process in which solvents are stored in two clean fluid holding tanks
26
and
126
. An example might be an n-Propyl Bromide wash in fluid supply tank
24
and a 2,3-dihydrodecafluropentane rinse in fluid supply tank
124
. In the process in
FIG. 4
, the system
100
includes a cleaning chamber
12
having a jacket
14
in electric communication with an electric heat source
42
for heating the chamber
12
walls. An object
18
requiring cleaning is placed upon a support
20
fixedly mounted within the cleaning chamber
12
. A valve
22
, in fluid communication with the atmosphere and the cleaning chamber
12
, is provided for selectively introducing air into the cleaning chamber
12
.
The object
18
to be cleaned is placed into the cleaning chamber
12
on the support
20
through an opening created by removing a lid
28
. After receiving the object
18
, the lid
28
is secured to the cleaning chamber
12
wherein the cleaning chamber is sealed. The air handling vacuum pump
38
is used to remove virtually all the air from the cleaning chamber
12
through valve
72
.
The n-Propyl Bromide cleaning solvent is preferably introduced to the cleaning chamber
12
as a heated liquid soak as through pump
82
and valve
76
. Typically, the solution can be circulated by opening the overflow valve
58
or drained and refilled by opening valve
30
and returning the solution to the fluid supply tank
24
. The solution may be agitated as well as with jet pumps or spray nozzles on the inlet line through valve
76
, or with typical ultrasonic transducers.
After the object
18
has been cleaned, any liquid solvent remaining in the cleaning chamber
12
is drained and/or pumped into the heated fluid supply vessel
24
by opening valve
30
. The drained liquid will also remove most of the chips or insoluble material, if present, and transfer them to the heated solvent vessel
24
.
Clean n-Propyl Bromide solvent from clean fluid holding tank
26
can now be sprayed on the substrate by opening valve
80
, activating pump
46
and spraying the solution through nozzle
78
. The cleaner n-Propyl Bromide solvent rinses residual solvent and contaminants from the surface. The rinse solvent is sent to the fluid supply tank
24
by opening valve
30
.
Solvent vapors are next removed from the cleaning chamber
12
by means of a solvent handling vacuum pump
32
. Specifically valve
34
is opened and since there is no air present in this system, solvent vapors can be easily condensed in a heat exchanger
62
and the clean condensed solvent can be sent to the clean fluid holding tank
26
to be stored for reuse as clean spray for the next cleaning and rinse cycle. During this vapor-scavenging step, any residual solvent liquid remaining on the heated parts boils off the parts at the lower vacuum pressures, thus reducing solvent residual left in the vessel or on the parts.
To ensure complete removal of n-Propyl Bromide from the object
18
, chamber
12
and all piping attached to the chamber
12
, air can be circulated through chamber
12
from the clean fluid holding tank
26
. Since this air contains n-Propyl Bromide vapor, compression of the air-vapor mixture as in compressor
48
followed by cooling in heat exchanger
54
will reduce the saturation level of the air to produce a better gas for drying the chamber. The condensed vapor can be returned to the clean fluid holding tank
26
through valve
52
. The air-vapor mixture is circulated from holding tank
26
, through compressor
48
and heat exchanger
54
, through throttling valve
50
, through open valve
30
into the chamber and leaves the chamber through open valve
34
, through heat exchanger
62
and vacuum pump
32
and back to the clean fluid holding tank
26
. The air can be circulated either by activating compressor
48
or vacuum pump
32
. After the compression, throttling the gas through valve
50
will produce the unsaturated gas state necessary for drying. The process is a closed loop so that no ambient gas is necessary therefore making it easier to maintain the same volume of solvent in clean fluid tank constant. Ensuring complete drying prevents cross contamination of future solvent with n-Propyl Bromide if added to the chamber
12
.
In a second step, a heated rinse of clean 2,3-dihydrodecafluropentane can now be introduced to the cleaning chamber
12
by opening valve
176
and turning on pump
182
. The lower boiling 2,3-dihydrodecafluropentane for instance can remove fluorinated organic material, which are not always soluble in other halogenated solvents.
If contaminants are being removed in the rinse step, a third step, a clean 2,3-dihydrodecafluropentane solvent rinses residual solvent and contaminants from the surface and replaces excess contaminated 2,3-dihydrodecafluropentane with a cleaner drying 2,3-dihydrodecafluropentane solvent. The rinse solution is sent to the fluid supply tank
124
by opening valve
130
.
Solvent vapors are now removed from the chamber
12
by means of the solvent handling vacuum pump
132
through valve
134
and condenser
162
and the solvent is sent to clean fluid tank
126
.
Enhanced drying can be attained by opening valve
112
and allowing air from holding tank
126
to first be heated by heater
174
in connection with electrical source
42
and passing through valve
112
and chamber
12
. The drying air and solvent are circulated back to holding tank
126
through valve
134
and vacuum pump
132
after being chilled in heat exchanger
162
. Vacuum pump
132
is sealed with 2,3-dihydrodecafluropentane circulated through circulation pump
146
and valve
164
from holding tank
126
, which is chilled in heat exchanger
136
. Heat exchanger
136
can be cooled by a chiller
144
or with any other type of cooling medium such as city or cooling tower water.
Upon removal of solvent vapor and liquid from the cleaning chamber
12
, the chamber is then returned to atmospheric pressure by introducing ambient air through valve
22
to the cleaning chamber
12
. Depending upon the vacuum level attained in the air-drying step, the cleaning chamber
12
may contain residual solvent vapors, which can be removed by evacuating the chamber
12
using a second vacuum pump
38
. Collecting residual solvent in activated carbon
56
, scrubbers, or other conventional air stripping processes can treat the effluent air stream. This introduction of air by opening valve
22
followed by purging the cleaning chamber
12
with pump
38
can be repeated as many times as necessary prior to opening the cleaning chamber
12
and removing the cleaned article
18
. In the preferred embodiment, the cleaned article
18
is not removed from the chamber, and an additional processing step is begun since the chamber has been returned to the initial stage of containing just the article and ambient air.
The following is a sample list of methods for treating objects utilizing Process II above. In the coating industry, solvents can first be introduced to clean an object and then drained and dried. The second step in the process can be any in the list that follows: Spray painting the object: followed by solvent cleaning of the vessel walls: followed by drying of the vessel and fixtures: followed by curing the paint with superheated air-vapor mixtures. Introduction of caustic aqueous solutions to treat metal surfaces: followed by rinsing of the surface with water: followed by plating, deposition of corrosion inhibitors or anodizing the surface.
In the semiconductor business, a step might include one or more aqueous washes, one or more aqueous rinses, one or more caustic bath treatments (i.e. hydrofluoric acid solutions, NAOH solutions etc), solvent washes or rinses, and air-drying and water or solvent recovery.
In the dry cleaning or rag cleaning industry, a step may include one or more aqueous washes, one or more aqueous rinses, one or more solvent washes or rinses and air-drying.
In the general industrial equipment industries, a step may be a solvent or aqueous solution soak to remove contaminants, dewax materials, remove debinders, remove paints, remove solvents from surfaces, remove maskant and other process coatings, remove excess processing fluids or remove particles and foreign process debris. The second step could be to provide a second wash with a different solution or solvent or solvent concentration; coat objects such as with oil, polymer or maskant; fill object such as in impregnating with polymers or oils; abrasive treatment of surfaces such as in sand blasting, CO
2
surface blasting or high pressure water treatment; deposition of material such as surfactants from liquid solutions for corrosion inhibition or vapor deposition as thin film coating; vapor degreasing such as with trichloroethylene or methylene chloride or surface treatments such as in acid etching.
The above examples of the present invention have been described for purposes of illustration and are not intended to be exhaustive or limited to the steps described or solvents used in the descriptions. The scope of the invention is wide and can cover many industries and processes as illustrated in the sample examples stated. It will be manifest to those skilled in the art that various modifications and rearrangements of the parts may be made without departing from the spirit and scope of the underlying inventive concept and that the same is not limited to the particular forms herein shown and described except insofar as indicated by the scope of the appended claims.
Claims
- 1. A method of treating an object in a closed circuit solvent processing system, said system including a chamber, a first fluid supply tank in communication with said chamber and a second fluid supply tank in communication with said chamber, said method comprising the steps of:placing an object to be processed in a chamber; sealing said chamber; reducing the pressure within said chamber to evacuate the air from said chamber to create a vacuum condition; introducing a first fluid having a first concentration to said evacuated chamber from a first fluid supply tank to process said object contained in said chamber; recovering and retaining said first fluid from said chamber to return said chamber to said evacuated vacuum condition; introducing a second fluid having a second concentration to said evacuated chamber from a second clean fluid supply tank to process said object contained in said chamber; recovering and retaining said second fluid from said chamber to return said chamber to said evacuated vacuum condition; introducing a non-condensable gas to said chamber to return said chamber to atmospheric pressure; opening said chamber and removing said object; redistributing said first and second fluids to said first and second supply tanks; and returning said first and second fluids to said first and second concentrations and retaining said fluids for use in treating subsequent objects.
- 2. The method of treating an object in claim 1 wherein said step of reducing the pressure within said chamber comprises reducing the pressure to between atmospheric pressure and zero absolute pressure.
- 3. The method of treating an object in claim 1 wherein said first and second fluids are selected from the group consisting of: organic solvents, water, and aqueous solutions.
- 4. The method of treating an object in claim 1 wherein the method used in the steps of introducing said first fluid and said second fluid into said chamber is selected from the group consisting of: liquid spray and liquid soak.
- 5. The method of treating en object in claim 1 wherein said first and second fluids each have fluid states, said fluid states during the steps of introducing said first fluid and said second fluid into said chamber is selected from the group consisting of: vapor, gas-vapor mixture and aerosol spray.
- 6. The method of treating an object in claim 1 wherein said first fluid in said first fluid supply tank and said second fluid in said second fluid supply tank each contain a mixture of the same chemicals in differing concentrations.
- 7. The method of treating an object in claim 1, wherein said first fluid in said first fluid supply tank and said second fluid in said second fluid supply tank can be mixed while processing said object.
- 8. The method of treating an object in claim 6, wherein said first fluid in said first fluid supply tank and said second fluid in said second fluid supply tank can be mixed while processing said object.
- 9. The method of treating an object in claim 1 wherein said step of redistributing said first and second fluids to said first and second supply tanks further comprises:heating said first fluid supply tank to evaporate a portion of said first fluid and distilling said evaporated portion of said firm fluid to said second fluid supply tank.
- 10. The method of treating an object in claim 1 wherein said step of redistributing said first and second fluids to said first and second supply tanks further comprises:transferring a portion of said first fluid from said first fluid supply tank to a heated distilling vessel; heating said removed portion of first fluid in said heated distilling vessel to evaporate said first fluid; and distilling said evaporated portion of said first fluid to said second fluid supply tank.
- 11. The method of treating an object in claim 10, wherein said distilling vessel is selected from the group consisting of: single stage vessels, multiple stage vessels, tray distilling vessels, plate distilling vessels or fluidized distilling vessels.
- 12. The method of treating an object in claim 1 wherein said steps of recovering and retaining said first and second fluids from said chamber further comprise:withdrawing a first portion of said first and second fluids from said chamber in a liquid state; and withdrawing the remaining portion of said first and second fluids from said chamber in a vapor state.
- 13. The method of treating an object in claim 12 wherein said step of withdrawing said first and second fluids in a vapor state further comprises:reducing the pressure in said chamber causing said first and second fluids to flash to form a vapor; and withdrawing said vapor from said chamber.
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Sep 1998 |
A |
5849091 |
Skrovan et al. |
Dec 1998 |
A |
6004403 |
Gray et al. |
Dec 1999 |
A |
6006765 |
Skrovan et al. |
Dec 1999 |
A |
6418942 |
Gray et al. |
Jul 2002 |
B1 |