"Si Micro-Machining Advanced Technique", Science Forum Co., Ltd., pp. 120-123. |
H. Kishi, et al., "Suppression Method for Micro-Pyramid in Anisotropic Etching of Si", Vacuum, the 29th volume, the second number, pp. 85-91. |
Encyclopedia of Chemical Technology Guideline for Safely Treating Hydrazine Hydrate pp. 1-13. |
M. Abu-Zeid, "corner Undercutting in Anisotropically Etched Isolation Contours", Electrochem. Soc., vol. 131, No. 9, (1984) pp. 2138-2142. |
Shimanoe et al., "An Anisotropic Etching Technology for Fabrication of Integrated Semiconductor Sensors", Toyota Technical Review, vol. 42, No. 2, (1992), pp. 68-75. |
A. Horinouchi et al., "Sweep Rate Dependence of I-V Characteristics in Electrochemical Silicon Etch-Stop", Technical Digest of the 9th Sensor Symposium, 1990, pp. 19-22. |
M. Theunissen et al., "Appliction of Preferential electrochemical Etching of Silicon to Semiconductor Device Technology", Journal of the Electrochemical Society, vol. 177, pp. 959-1770. |