Patent Grant
7864399
The present invention relates to an electro-optic reflective element assembly for an electro-optic mirror assembly, such as an electrochromic interior or exterior rearview mirror assembly for a vehicle, and, more particularly, to an electro-optic rearview mirror assembly which includes an electro-optic reflective element assembly with a reduced bezel.
Variable reflectivity mirror assemblies, such as electro-optic mirror assemblies, such as electrochromic mirror assemblies, are known and are widely implemented in vehicles. The reflective element assembly of such a mirror assembly often includes two substrates or glass elements with an electrochromic medium sandwiched therebetween. The back or outer surface of the second substrate (commonly referred to as the fourth surface of the reflective element assembly) may include a silvered coating to provide reflectance of an image. Each substrate is coated with at least one conductive or semi-conductive layer, which conduct electricity to the electrochromic medium from an electrical connector clipped or otherwise fastened or secured at least partially along an edge of the substrate and layer. An example of a known electrochromic reflective element assembly is shown in
As shown in
Typically, it is desirable to minimize the size of the bezel or overlap of the casing/bezel (or even to eliminate the bezel) which extends around the reflective element of the mirror assembly. The bezel is typically required to extend over the front or first surface of the electrochromic cell or reflective element assembly to cover or hide or conceal, for example, the seal around the electrochromic medium of the electrochromic cell (that typically spaces the front substrate from the rear substrate, such as described in U.S. Pat. No. 6,002,511, which is hereby incorporated herein by reference), in order to conceal or hide the seal (and/or the electrical spring conductors, busbar conductors, clips, connectors and/or the like) which may otherwise be visible, particularly when the electrochromic medium is darkened. An exemplary and effective means for hiding the seal and, thus, minimizing the size of the bezel is disclosed in U.S. Pat. No. 5,066,112, which is hereby incorporated herein by reference. Also, and such as described in U.S. Pat. No. 6,449,082, which is hereby incorporated herein by reference, there is typically an offset to allow the clip or connector to connect to the cell or substrate that may influence the size of the overlap or bezel.
In cells or reflective element assemblies that may provide a small bezel or no bezel, it is often difficult to make electrical contact to the semi-conductive and/or conductive layers of the substrates with a restricted overhang between the substrates. A variety of methods have been used to provide electrical power to the semi-conductive and/or conductive layers of electrochromic cells, such as described in U.S. Pat. Nos. 5,066,112; 6,356,376; and 6,512,264, which are hereby incorporated herein by reference.
Therefore, there is a need in the art for an electrochromic mirror element which overcomes the above disadvantages and shortcomings of the prior art.
The present invention provides an electro-optic or electrochromic interior or exterior rearview mirror assembly which includes an electro-optic or electrochromic cell or reflective element assembly having a pair of substrates and an electro-optic or electrochromic medium disposed between the substrates. The reflective element assembly may include electrical connectors for providing electrical current to the conductive and/or semi-conductive layers or coatings at the surfaces of the substrates opposing the electro-optic medium. The electrical connectors may connect to the substrates at or behind an overhang region of the front substrate such that the connectors are substantially not viewable through the front substrate. The electrical connectors may be electrically isolated from one another and may connect to one of the substrates and may provide electrical current to the respective substrates. One edge or side of each of the substrates of the reflective element assembly may be in flush alignment, while allowing for electrical connection to one of the substrates along the generally flush edges.
According to an aspect of the present invention, a reflective element assembly for a mirror system of a vehicle includes front and rear substrates with an electro-optic medium sandwiched therebetween, a non-conductive seal disposed around a perimeter of the electro-optic medium and between the front and rear substrates, and first and second electrical connectors. The rear substrate has a smaller dimension across a dimension of the rear substrate than a corresponding dimension across the front substrate such that the front substrate defines a first overhang region at a first edge of the front substrate that extends beyond a corresponding first edge of the rear substrate. The front substrate has a first surface and a second surface opposite the first surface. The second surface faces the electro-optic medium, The front substrate has at least one first conductive layer disposed on the second surface. The rear substrate has a third surface and a fourth surface opposite the third surface. The third surface faces the electro-optic medium. The rear substrate has at least one second conductive layer disposed on the third surface. The second conductive layer includes a tab portion that extends at least to a second edge of the rear substrate. The rear substrate includes a non-conductive raceway proximate the second edge and devoid of the second conductive layer except at the tab portion. The non-conductive seal encompasses at least a portion of the second conductive layer and at least a portion of the raceway. The first electrical connector is in electrical connection with the first conductive layer and the second electrical connector is in electrical connection with the tab portion of the second conductive layer. The first electrical connector connects to the first conductive layer at the first overhang region so as to be behind the front substrate and substantially not viewable through the first surface of the front substrate.
The front substrate may include a hiding or concealing layer at the perimeter portions to substantially hide the connectors and seal from view by the driver of the vehicle.
According to another aspect of the present invention, a reflective element assembly for a mirror system for a vehicle includes front and rear substrates with an electro-optic medium sandwiched therebetween, a non-conductive seal disposed around a perimeter of the electro-optic medium and between the front and rear substrates, and first and second electrical connectors. The rear substrate has a smaller dimension across a dimension of the rear substrate than a corresponding dimension across the front substrate such that the front substrate defines a first overhang region at a first edge of the front substrate that extends beyond a corresponding first edge of the rear substrate. The front substrate has a first surface and a second surface opposite the first surface. The second surface faces the electro-optic medium. The front substrate has at least one first conductive layer disposed on the second surface. The rear substrate has a third surface and a fourth surface opposite the third surface. The third surface faces the electro-optic medium. The third surface of the rear substrate has a non-conductive portion proximate the first edge and devoid of the second conductive layer. The non-conductive seal encompasses at least a portion of the non-conductive portion of the rear substrate. The first electrical connector is in electrical connection with the first conductive layer and the second electrical connector is in electrical connection with the second conductive layer. The first electrical connector extends from the fourth surface of the second substrate and over at least a portion of the first edge of the second substrate and toward the first overhang region of the front substrate. The first electrical connector connects to the first conductive surface at the first overhang region so as to be behind the front substrate and substantially not viewable through the first surface of the front substrate. The non-conductive seal and the non-conductive portion substantially electrically isolate the first electrical connector from the second conductive layer.
According to another aspect of the present invention, an electro-optic or electrochromic mirror element includes a pair of substrates and an electro-optic or electrochromic medium sandwiched therebetween. Each of the pair of substrates includes at least one conductive or semi-conductive layer disposed thereon. The pair of substrates are positioned relative to one another such that the upper and/or lower edges of the substrates are substantially flush or aligned with one another. One of the substrates includes a relief area along the aligned edge to provide clearance for electrical connection to the conductive layer or layers of the other substrate along the aligned edge.
According to another aspect of the present invention, an electro-optic or electrochromic mirror assembly for a vehicle comprises an electro-optic or electrochromic reflective element assembly comprising a first substrate having first and second surfaces and a second substrate having third and fourth surfaces. The first and second substrates are arranged so that the second surface opposes the third surface with an electro-optic or electrochromic medium disposed therebetween. The first substrate has at least one at least partially conductive coating or layer on the second surface and the second substrate has at least one at least partially conductive coating or layer on the third surface. The first and second substrates are positioned relative to one another such that at least a portion of a first edge of the first substrate is generally flush or aligned with a corresponding edge of the second substrate. The first edge of the first substrate has a relief area formed therealong, wherein the relief area provides clearance for electrical connection to the corresponding edge of the second substrate.
In one form, the conductive coating of the second substrate includes a tab out portion at the corresponding edge. The relief area of the first substrate provides clearance for electrical connection to the tab out portion of the at least one conductive coating or layer. The first substrate may be the front substrate and the second substrate may be the rear substrate, with the aligned or generally flush edges being along the upper edges of the substrates.
Therefore, the present invention provides an electro-optic or electrochromic cell or mirror reflective element assembly that provides an overhang region at least one edge of the front substrate for electrical connection to the conductive layer at the rear surface of the substrate, such that the electrical connection is not viewable through the front surface of the front substrate. The present invention thus may provide a reflective element assembly that is suitable for use in a bezelless mirror assembly, where the front surface of the reflective element is substantially entirely viewable by a driver of the vehicle. Optionally, a reflective element assembly of the present invention may provide a flush alignment of an upper and/or lower edge of a pair of substrates, while providing clearance for electrical connection to the upper and/or lower edges of one of the substrates and the respective conductive coating. The present invention thus provides enhanced assembly processes for the mirror element, since the substrates may be aligned with one another within an assembly fixture and do not require stepped pins or spacers positioned along one edge to provide sufficient offset or staggering between the substrates to provide clearance for electrical connection to one of the substrates along the aligned or flush edge thereof.
These and other objects, advantages, purposes, and features of the present invention will become apparent from the study of the following description in conjunction with the drawings.
Referring now to the drawings and the illustrative embodiments depicted therein, an electro-optic or electrochromic cell or mirror element assembly or reflective element assembly 10 for an interior rearview mirror assembly of a vehicle (not shown) includes first and second glass substrates 12, 14 and an electro-optic or electrochromic medium 16 disposed or sandwiched therebetween (
Electrochromic mirror element assembly 10 comprises a first or front substantially transparent substrate 12 and a second or rear substantially transparent substrate 14 (which may be glass substrates or the like). The substrates are generally elongated along a longitudinal axis and define upper and lower edges and generally curved opposite side or end edges. Although shown and described as a reflective element assembly for an interior rearview mirror assembly or system, the reflective element assembly may be formed to be suitable for other mirror assemblies or systems, such as for an exterior rearview mirror assembly of a vehicle or the like.
The first substrate 12 of reflective element assembly 10 includes one or more electrically conductive or semi-conductive layers 18 (shown in
Rear or second substrate 14 includes at least one layer or coating of metallic conductive (such as a layer of silver, aluminum or an alloy of silver or an alloy of aluminum or other metal or metal alloy) or non-metallic semi-conductive material (such as an ITO layer or the like) 20 disposed on a forward or third surface 14a of rear substrate 14 (shown in
As can be seen in
During operation, a voltage may be applied to mirror element assembly 10 via busbars or clips or electrical connectors 22, 24 positioned around and engaging at least a portion of an outer edge of the semi-conductive layers 18, 20 (
The voltage applied by connectors 22, 24 is bled from semi-conductive layers 18, 20 to the electrochromic medium 16. Preferably, the layers provide for reduced resistance through the layers, which provides for faster, more uniform coloration of the electrochromic medium 16, since the electrons applied via busbars 24 at semi-conductive layer 20a may bleed through the other semi-conductive layers 20 faster due to the enhanced conductivity in the conductive layers 20. Preferably, the layers 20 provide a sheet resistance of less than approximately 10 ohms per square, more preferably less than approximately 5 ohms per square, and most preferably less than approximately 2 ohms per square. Desirably, and particularly for larger area mirrors, the sheet resistance is less than approximately 1 ohm per square, such as in the range of approximately 0.1 to 0.7 ohms per square.
In order to provide enhanced performance of the electrochromic mirror element, each of the layers of the combination or stack of layers may have substantial conductivity and none of the layers significantly retard electron/electrical conductivity from one layer to the other throughout the stack, and, thus, do not impede the flow of electrons into the electrochromic (EC) medium. In this regard, it is desirable that one or more of the metallic layers comprises a metallic material (which is preferably a highly reflective material, such as silver or silver alloys or the like) having a specific resistivity of preferably less than approximately 5×10−5 ohm·cm, more preferably less than approximately 1×10−5 ohm·cm, and most preferably less than approximately 5×10−6 ohm·cm. Preferably, such a highly conductive metallic layer or layers is/are sandwiched between two non-metallic, partially conductive layers, preferably formed of a non-metallic material (such as a semi-conducting oxide, such as indium oxide, tungsten oxide, tin oxide, doped tin oxide or the like) having a specific resistivity of less than approximately 1×10−2 ohm·cm, more preferably less than approximately 1×10−3 ohm·cm, and most preferably less than approximately 5×10−4 ohm·cm, such as disclosed in PCT application No. PCT/US03/29776, filed Sep. 19, 2003 by Donnelly Corporation et al. for MIRROR REFLECTIVE ELEMENT ASSEMBLY, published Apr. 1, 2004 as International Publication No. WO 2004/026633 A2, which is hereby incorporated herein by reference.
In the illustrated embodiment of
The transparent semi-conductive non-metallic layers on rear substrate 14 preferably comprise non-metallic transparent electrically conductive or semi-conductive materials, such as tin oxide, indium oxide, indium cerium oxide, indium tungsten oxide, nickel oxide, tungsten oxide, indium tin oxide, half-wave indium tin oxide, full wave indium tin oxide, doped tin oxides, such as antimony-doped tin oxide and fluorine-doped tin oxide, doped zinc oxides, such as antimony-doped zinc oxide and aluminum-doped zinc oxide and/or the like.
The metallic layer or layers on rear substrate 14 comprise a thin film or layer of metal, such as silver, aluminum, or alloys thereof, or the like, with a selected thickness to provide sufficient reflectivity and/or transmissivity, depending on the application of the mirror element and whether the mirror element includes a display, such as a display-on-demand or display-on-need type of display or the like, as discussed below. Preferably, the selected metallic material comprises silver, but may otherwise comprise a material selected from aluminum, silver alloys, aluminum alloys (such as 6061 or 1100 aluminum alloys or the like), manganese, chromium or rhodium, or any other metallic material which is sufficiently reflective and/or transmissive at a selected thickness, without affecting the scope of the present invention.
In a preferred embodiment, the semi-conductive layers 18, 20a comprise indium tin oxide (ITO) and are deposited onto the surfaces 12a, 14a of the respective substrate 12, 14 via a hot deposition process, which may involve, for example, sputter deposition onto a heated substrate, with the heated substrate often being heated to a temperature of greater than about 200° C., sometimes greater than 300° C., as is known in the art. The combination of the semi-conductive layers 18, 20a on the substrates 12, 14 defines a conductive substrate which may be used for various embodiments of a mirror element in accordance with the present invention.
The other semi-conductive layers and metallic layers of the layers 20 on rear substrate 14 (or other layers on front substrate 12) may be deposited onto semi-conductive layer 20a via a cold deposition process, such as sputter coating or the like, onto an unheated substrate. Preferably, each of the layers 20 is deposited on second substrate 14 by a sputter deposition process. More particularly, the substrate 14 (including the semi-conductive layer 20a already deposited thereon) may be positioned in one or more sputter deposition chambers with either planar or rotary magnetron targets, and with deposition of the layers being achieved by either reactive deposition of an oxide coating by sputtering from a metal target (or from a conductive, pressed oxide target) in an oxygen-rich atmosphere, or by DC sputtering from an oxide target, such as an indium oxide (IO), indium tungsten oxide (IWO), indium tin oxide (ITO) or indium cerium oxide (ICO) target or the like, such as described in PCT application No. PCT/US03/29776, filed Sep. 19, 2003 by Donnelly Corporation et al. for MIRROR REFLECTIVE ELEMENT ASSEMBLY, published Apr. 1, 2004 as International Publication No. WO 2004/026633 A2, which is hereby incorporated herein by reference. However, other processes for applying or depositing layers of conductive material or layers and metallic material or layers may be implemented, without affecting the scope of the present invention.
The rear substrate 14 is masked substantially around the outer region of surface 14a during the deposition process, such that the semi-conductive and/or conductive layer or layers 20 is/are not deposition in the masked outer region. However, substrate 14 is not masked over the entire outer edge or region of substrate 14, in order to allow deposition of the layer or layers at a particular un-masked area, such that a tab-out portion or area 21 is formed in the layer or layers 20. The tab out area 21 facilitates electrical connection of connector 24 with the conductive layers 20.
As shown in
Because the relief area 12d along upper edge 12b of front substrate 12 provides clearance for electrical connection to the other substrate 14, while also allowing for substantially flush alignment of the upper edges 12b, 14b of the substrates 12, 14, the present invention provides for enhanced assembly processes for assembling the mirror element and obviates the need for a stepped or offset spacer or pin. During assembly of the mirror element assembly 10, the substrates 12, 14 may be placed in a fixture with the outer regions 12e, 14e of the upper edges 12b, 14b of both substrates abutting a wall of the fixture. The wall of the fixture thus aligns the upper edges of the substrates, and a stepped pin or the like is not necessary to provide the appropriate offset or clearance for the electrical connections to each substrate. This eases the assembly process, since stepped pins do not have to be carefully placed at the appropriate places along the edges of the substrates to achieve the desired offset or clearance. Uniform pins may be placed between the substrates to provide the appropriate spacing or separation gap between the substrates during assembly.
Although shown and described as being generally aligned along the upper edges, the lower edges may alternately be aligned in a similar manner, without affecting the scope of the present invention. It is further envisioned that a similar relief area may be formed at both the upper edge of one substrate and the lower edge of the other substrate, such that both the upper and lower edges may be generally flush or aligned with one another, while providing clearance for electrical connection to both substrates and their respective conductive or semi-conductive layer or layers.
Optionally, the first (outermost) surface 12f of front substrate 12 may be coated with an anti-wetting property, such as via a hydrophilic coating (or stack of coatings), such as is disclosed in U.S. Pat. Nos. 6,193,378; 5,854,708; 6,071,606 and 6,013,372, the entire disclosures of which are hereby incorporated by reference herein. Also, the first (outermost) surface 12f of front substrate 12 may be optionally coated with an anti-wetting property, such as via a hydrophobic coating (or stack of coatings), such as is disclosed in U.S. Pat. No. 5,724,187, the entire disclosure of which is hereby incorporated by reference herein. Such a hydrophobic property on the first/outermost surface of the electrochromic mirror reflective elements (and on the first/outermost surface of a non-electrochromic mirror, non-electro-optical, conventional reflective elements) can be achieved by a variety of means such as by use of organic and inorganic coatings utilizing a silicone moiety (for example, a urethane incorporating silicone moieties) or by utilizing diamond-like carbon coatings. For example, long-term stable water-repellent and oil-repellent ultra-hydrophobic coatings, such as described in PCT International Publication Nos. WO0192179 and WO0162682, the entire disclosures of which are hereby incorporated by reference herein, can be disposed on the first (outermost) surface 12f of front substrate 12. Such ultra-hydrophobic layers comprise a nano structured surface covered with a hydrophobic agent which is supplied by an underlying replenishment layer (such as is described in Classen et al., “Towards a True “Non-Clean” Property: Highly Durable Ultra-Hydrophobic Coating for Optical Applications”, ECC 2002 “Smart Coatings” Proceedings, 2002, 181-190, the entire disclosure of which is hereby incorporated by reference herein).
Referring now to
As can be seen with reference to
The first pin or connecting member 122 may be attached to the first or front substrate 112, such as by counter sinking a head 122a of pin 122 into the rear surface 112a of front substrate 112, such that a body or shaft portion 122b of pin 122 extends rearward therefrom. The pin 122 thus may contact (or may be contacted by) the semi-conductive layer or coating 118 on the second surface 112a of front substrate 112 to make the electrical connection thereto. The pin may be countersunk in the rear surface 112a of front substrate 112 prior to depositing or applying the semi-conductive layer 118 to the rear surface 112a of the substrate 112. The substrate and pin assembly may then be placed in a vacuum deposition chamber/apparatus, such as a sputter deposition chamber or the like, to have the semi-conductive coating 118 deposited on both the surface 112a of substrate 112 and on at least a portion of the pin 122 itself. Such an approach provides an effective electrical connection between the pin and the semi-conductive coating because the coating is also deposited on and contacts the electrical connector or pin.
As can be see in
Similar to pin 122, pin 124 may be countersunk within the front or third surface 114a of rear substrate 114, such that the head 124a of pin 124 is generally flush with the third surface 114a of the substrate. After the pin is countersunk within the rear substrate 114, the third surface 114a of the substrate may be coated with the semi-conductive layer or layers, such that the semi-conductive layer 120 coats or contacts the head 124a of pin 124 and makes electrical contact therewith. The shaft or body portion 124b of pin 124 may extend through a hole or opening through substrate 114 and rearwardly from the substrate or cell for electrical connection to the appropriate power source or circuitry or control or the like at the rear of the reflective element assembly. As can be seen in
The pin connectors of the electrochromic cell or reflective element assembly of the present invention thus may facilitate a flush electrochromic cell or reflective element assembly, because no clips or busbars are required around the outside of the perimeter edges of the substrates to contact the semi-conductive and/or conductive layers of the substrates. Optionally, a perimeter coating, which may be substantially opaque and may be conductive or semi-conductive, may be applied along the perimeter regions or border of the semi-conductive layer of the first or front substrate, in order to mask or hide or conceal the seal and connectors and the like to enhance the aesthetic appearance of the electrochromic reflective element assembly and to minimize the size or overhang of the bezel of the mirror assembly. The perimeter coating or layer may be of the type disclosed in U.S. Pat. No. 5,066,112, which is hereby incorporated herein by reference, or may be any other type perimeter coating which may provide the desired result or appearance.
Referring now to
A metallic or conducting connector layer 230 may be applied or disposed or positioned around the perimeter region of the perimeter coating 228 and may be folded or wrapped around to at least partially cover the perimeter edges 212b of the substrate 212 so that an outer or edge portion 230a may extend partially along the outer perimeter edge 212b of the substrate and may be in contact with the semi-conductive layers on the surface 212a of substrate 212. As shown in
The outer or edge portions 230a of the metallic layer 230 and the outer or edge portions 220a of the layers or layers 220 of rear substrate 214 thus may provide for electrical contact to the conductive layers of the substrate substantially around the perimeter of the electrochromic cell or reflective element assembly, without requiring overlap or offset between the cells, such as for known or conventional clips and busbars. The metallic layer 230 and conductive layers 220 thus may provide an electrical raceway around at least a portion of the reflective element to enhance electrical flow along the substrates to enhance the performance of the mirror cell. Optionally, the metallic layer 230 may be substantially hidden by the Class A type appearance of the opaque layer 228, such that the mirror cell or reflective element assembly may minimize the size of any bezel associated with the mirror assembly, while providing an aesthetically pleasing mirror reflective element and mirror assembly. The reflective element assembly of the present invention thus may provide a minimum bezel size or no bezel mirror cell or reflective element assembly.
With reference to
Similarly, as shown in
Although shown as having a single perimeter electrical connector or layer 230 along the second surface of the front substrate 212, the reflective element assemblies 210′, 210″ may optionally include a substantially opaque Class A layer between the connectors 230 and semi-conductive layer 218, such as described above with respect to the reflective element assembly 210 of
Referring now to
The front and rear substrates of the reflective element assembly thus may have a full wraparound busbar connected at least some of or most of or each of the outer points or peaks of the waves. As shown in
The wave cut reflective element assembly or electrochromic cell may provide a faster coloring of the reflective element assembly or electrochromic cell and a more uniform transition from bleached to color because the electrical potential may be generally uniformly distributed at substantially all of the points along the perimeter of the reflective element assembly. The benefits associated with the wave cut design may be even more significant for larger mirror sizes. The wave cut design of the present invention may also facilitate implementation of a less expensive or lower conductivity substrate while having little or no affect on the performance of the reflective element assembly or electrochromic cell. The cell gap may thus also be made smaller to assist in reducing double imaging of the mirror assembly. Also, because the voltage may be distributed more uniformly across the electrochromic cell, the “banding effect” may be significantly less for the wave cut design. Because the electrochromic cell may be a generally flush electrochromic cell, multiple cells may be stacked on one another during the manufacturing process using less complicated and less costly fixtures and jigs, in order to reduce the manufacturing costs associated with the electrochromic cells. Also, by taking advantage of the overlapping areas of the substrates, the effective surface area of the perimeter seal around the electrochromic cell may be made larger than in conventional cells.
Referring now to
The upward extending portion or top hat portion 414c of rear substrate 414 thus may provide or facilitate electrical connection to the rear substrate, without requiring the substrates to be offset along the upper edges in the conventional manner. As shown in
Referring now to
The rear substrate 514 includes a metallic or conductive layer or coating 520, preferably a highly reflective metallic layer or coating (such as, for example, chromium, chromium/rhodium, silver, aluminum, silver alloy, aluminum alloy, ITO/silver/ITO stack, ITO/aluminum/ITO stack (such as ITO-silver-ITO stacks, display on demand stacks or infrared transmitting stacks of the types disclosed in PCT application No. PCT/US03/29776, filed Sep. 19, 2003 by Donnelly Corporation et al. for MIRROR REFLECTIVE ELEMENT ASSEMBLY, published Apr. 1, 2004 as International Publication No. WO 2004/026633 A2, which is hereby incorporated herein by reference) or the like) applied to or deposited on and substantially over the third surface 514a of rear substrate 514. The outer perimeter edge area or border region 514b of the third surface 514a of the rear substrate 514 may be masked while the metallic reflector 520 is applied, such that the border region 514b of the front surface 514a of substrate 514 provides a non-conductive surface or path or raceway 514e (such as a glass surface or the like) at least partially around the metallic reflector 520 and proximate to the edge 514d of substrate 514.
As shown in
As shown in
Although shown and described herein as having upper and lower overhang regions, the reflective element assembly of the present invention may have only one overhang region, such as for the electrical connection to the conductive layer on the rear surface of the front substrate, or may have one or more overhang regions elsewhere along the perimeter of the reflective element assembly, such as along one or both sides of the reflective element assembly or the like, without affecting the scope of the present invention. The overhang region or regions may be selected at the upper or lower edges or at one or both side edges of the reflective element assembly depending on the particular application of the reflective element assembly. For example, for an interior rearview mirror assembly, where the longitudinal axis of the reflective element assembly typically extends lengthwise along the reflective element assembly (such as generally horizontally when the reflective element assembly is installed in a vehicle), the overhang region or regions may be at the upper and/or lower edges of the reflective element assembly. Similarly, for an exterior mirror assembly of, for example, a truck or the like, where the longitudinal axis of the reflective element assembly may extend generally vertically when the reflective element assembly is installed at the truck or vehicle (in other words, where the width of the reflective element assembly is less than the height of the reflective element assembly), the overhang regions may be at the side edges of the reflective element assembly. The overhang regions may thus extend along the width dimension of the reflective element assembly. However, the overhang regions may be elsewhere along or around the edges of the reflective element assembly, without affecting the scope of the present invention.
As can also be seen with reference to
As shown in
As discussed above, the electrically conductive layer 521 may provide electrical connection to the metallic reflector 520 via the tab-out portion 520a of the metallic reflector, which may be overcoated or applied to the front portion 521a of the electrically conductive layer 521 along the front or third surface 514a of the rear substrate 514. A potting material 526 (such as, for example, a silicone or urethane elastomer, preferably a conductive semi-elastomeric material or the like) may be applied or positioned over the rear surface (and may be applied partially or entirely around the outer perimeter edge of the substrate) to seal the connection of the connector terminal 524 and the conductive layer 521. The electrical connection terminal 524 may extend rearward from the reflective element assembly 510 and may protrude from the potting material 526 for electrical connection to a connector associated with the appropriate electrical power, circuitry or control or the like.
As shown in
As discussed above, the semi-conductive layer 518 may be applied to or deposited on the second surface 512a of substrate 512 and on or over a perimeter black out or opaquifying layer 519. Optionally, as also discussed above, the perimeter layer 519 may be conductive. Optionally, as shown in
The potting material 526 may extend partially around the perimeter edge of the front substrate and substantially surround and seal the electrical connector 522 at the rear surface of the front substrate. Preferably, the material 526 surrounding the connector 522 may comprise a conductive material, such as a conductive epoxy, such as a conductive epoxy commercially available from DuPont, a conductive paste, a conductive tape, such as a copper tape with conductive adhesive, a conductive frit or the like, to provide an enhanced connection of the pin or connector 522 to the conductive layer or raceway and the semi-conductive or ITO layer or the like on the front substrate. As shown in
The conductive material or epoxy may be injected or disposed into the area of the reflective element assembly outside and around the perimeter seal to substantially fill the area and to enhance the conductivity around the connector 522 and conductive coating 518 of front substrate 512. Optionally, the conductive material or epoxy may be applied to the overlap region at the “empty cell” stage of the manufacturing process, where the cell has not yet been filled with the electrochromic medium. The empty cell, with the seal and conductive epoxy disposed thereon, may then be fired or heated together to cure or harden both the seal and the conductive epoxy in a single process.
Therefore, the opaquifying layer and semi-conductive and conductive layers, and the electrical connectors of the reflective element assembly 510 provide a concealed or hidden seal and electrical connectors, such that the bezel size may be reduced or eliminated, while providing an aesthetically pleasing rearview mirror assembly and reflective element. The overhang region of the front substrate relative to the rear substrate may allow for multiple electrical connectors or multiple-point contact between the front electrical/perimeter busbar and the appropriate electrical power or circuitry or control or the like at the rear of the reflective element assembly or cell.
Optionally, and as shown in
The coatings or layers on the second surface 512a′ of substrate 512′ may be applied to or deposited on the second surface in a manner to provide multiple and varying layers of chromium oxide or other metals or metal compounds or the like to enhance the performance of the layers. For example, the central region of the second surface 512a′ may be masked while leaving the border or perimeter region 512b′ unmasked during the application or deposition of the layers 519′. The chromium oxide layer or layers 519a′ or the like may be reactively sputter deposited or evaporated in an oxygen atmosphere to deposit a dark, light absorbing chromium layer on the perimeter region 512b′ of the second surface 512a′ of the front substrate 512′. While the chromium oxide is being deposited or applied to the perimeter region 512b′, the oxygen gas level in the vacuum chamber may be gradually reduced to approximately zero, thereby providing varying layers 519a′ of chromium oxide on the perimeter region 512b′. The chromium metal conductive layer 519b′ may then be sputter deposited or coated onto the chromium oxide layer or layers 519a′, such as in a zero oxygen atmosphere, to deposit a metal conducting perimeter coating at the perimeter region 512b′ of the rear surface 512a′ of front substrate 512′. The front substrate 512′ may be removed from the vacuum chamber and the mask over the central region may be removed. The transparent semi-conductive coating or layer 518 may then be sputter deposited or coated or otherwise applied to or deposited on or across the entire rear surface 512a′ of front substrate 512′. Such a process and coatings provide a build up of “black chrome” (such as approximately 500 angstroms to approximately 2,000 angstroms thick) initially, followed by “metallic chrome” (such as approximately 500 angstroms to approximately 3,000 angstroms thick), thereby forming a border or perimeter electrically conductive busbar, but with the black chrome layer being substantially non-reflecting when viewed from the first surface side of the front substrate or reflective element assembly. Although described as comprising chrome oxide, other metals may be provided to form a metal compound (such as chrome oxide, nickel oxide, silver oxide or the like) at the substrate surface and a substantially pure metallic deposit (such as chromium, nickel, silver or the like) to provide a highly conductive raceway. The metal compound may be sandwiched between the substrate and the substantially pure metal, and provides a dark (such as black) layer at the substrate surface to at least substantially conceal or hide the seals and connectors and the like, while the substantially pure metal is at the semi-conductive layer or ITO layer or the like.
Optionally, and according to another aspect of the present invention, an electro-optic or electrochromic mirror assembly for a vehicle may comprise an electro-optic or electrochromic mirror element or reflective element assembly comprising a front or first substrate having first and second surfaces and a rear or second substrate having third and fourth surfaces. The first and second substrates are arranged so that the second surface opposes the third surface with an electro-optic or electrochromic medium disposed therebetween. The first substrate has at least one at least partially conductive or semi-conductive coating or layer on the second surface and may also have an opaquifying conductive border/perimeter coating/layer around the perimeter edges or regions of the substrate. The second substrate has at least one at least partially conductive coating or layer on the third surface. The first and second substrates are positioned relative to one another such that at least a portion of an edge of the first substrate is generally flush or aligned with a corresponding edge of the second substrate. The edge of the second substrate may have a relief area formed therealong relative to the edge of the first substrate, wherein the relief area provides clearance or access for electrical connection to the conductive border/perimeter coating/layer on the second surface of the corresponding edge of the first substrate. The electrical connections to the first substrate may provide or deliver electrical power to the semi-conductive coating on the second surface of the first substrate and to the conductive coating on the third surface of the second substrate, as discussed below.
The perimeter seal of the reflective element assembly may be formed such that the outer edge of the perimeter seal is generally flush with the edges of both the first and second substrates except in the relief area or areas formed along the edge of second substrate. The perimeter seal profile in the relief areas along the edge of the second substrate may be configured such that the outer edge of the perimeter seal is recessed from the outer edges of both the first and second substrates, such that a gap or spacing between the first and the second substrates is created outside of the seal. A conductive material or bridge may be disposed or applied at the gap or spacing to couple the conductive coating on the third surface of the second substrate with the appropriate electrical connector or contact at the border/perimeter conductive coating/layer on the second surface of the first substrate. In addition, in order to avoid shorting of the positive and negative electrical contacts, a small portion of the border/perimeter conductive coating/layer and the underneath transparent semi-conductive coating on the second surface of the first substrate may be removed (electrically isolated) in a pattern generally around the electrical contact for the second substrate at the spacing created in the relief area or areas formed along the edge or edges of the substrates. Electrical contact to the semi-conductive layer of the second surface of the first substrate may be made by affixing an electrical lead to the perimeter/border conductive coating/layer in the relief areas, while electrical contact to the third surface of the second substrate may be made by affixing an electrical lead to the perimeter/border conductive coating/layer of the first substrate in the electrically isolated portion of the relief area or areas. The electrical contact is then made to the third surface of the second substrate via the conductive material or bridge between the first and second substrates at the electrically isolated relief area or areas.
The electrical contacts to the transparent semi-conductive layer on the front substrate and the reflective conductive layer on the rear substrate may thus be made at one of the substrates, with a conductive bridge connecting one of the contacts at one substrate to the coating or layer on the other substrate. Such a configuration or arrangement may provide for a true flush, bezelless cell or reflective element assembly and may facilitate making both electrical contacts to the front substrate at specified areas or relief areas along the perimeter edges or regions of the substrates.
For example, and with reference to
The second surface or rear surface of front substrate 612 is coated with a semi-conductive transparent coating or layer and a perimeter busbar layer 619a and perimeter opaquifying or “black-out” layer 619 around its perimeter edges, such as, for example, coatings or layers similar to the busbar layer 519a and opaquifying layer 519 of reflective element assembly 510, discussed above. As can be seen in
Top hat form 614c of rear substrate 614 may be coated with the conductive coating on the third surface of the substrate and/or may have a conductive coating or layer and tab-out edge of the conductive coating on the surface (such as, for example, a conductive coating or layer and tab-out portion of the types described above with respect to
Reflective element assembly 610 further includes a conductive material or bridge 623, such as a conductive epoxy or the like, disposed at the electrically isolated region 621a and spanning the gap between the top hat forms 612c, 614c of the front and rear substrates. The conductive bridge 623 provides for electrical connection between the electrically isolated region 621a (and the electrical connector 624 connected thereto) of the top hat form 612c of front substrate 612 and the conductive coating or layer or tab-out region of the top hat form 614c of rear substrate 614.
Accordingly, electrical power may be applied to the semi-conductive coating or layer on the second surface of the front substrate via an electrical connector or contact (such as a pin or clip or the like) at the top hat form of the front substrate. Electrical power may also be applied to the conductive coating or layer on the third surface of the rear substrate via an electrical connector or contact (such as a pin or clip or the like) also positioned at the top hat form of the front substrate (and via the conductive bridge). The present invention thus provides a flush electro-optic or electrochromic cell or reflective element assembly with electrical contacts at only one of the substrates.
Optionally, and with reference to
The front substrate 612′ may include a transparent semi-conductive layer on its second or rear surface and may include a busbar layer 619a′ (which may include a tab out portion 619b′ over the relief region or regions 625) and/or a opaquifying or black-out layer around its perimeter edges and an electrical contact 622′ at each of the areas or regions exposed by the relief regions (such as discussed above). The electrical contact 622′ is electrically connected to the semi-conductive layer and busbar layer or tab out portion on the front substrate 612′. Each of the areas or regions of the second surface of the front substrate that are exposed by the relief regions also includes a deletion line 621′ that defines an electrically isolated area or region 621a′. A second electrical contact 624′ is applied or connected to the electrically isolated region 621a′ of each of the relief regions.
As can be seen in
Optionally, and as shown in
The electro-optic or electrochromic mirror cell or reflective element assembly 610′ thus may provide for electrical connections at two or more locations around the mirror cell or reflective element assembly, and may provide for the electrical connections at only the front substrate of the reflective element assembly. The reflective element assembly thus may provide a flush reflective element assembly or mirror cell that may be implemented in a bezelless mirror assembly, while providing enhanced performance or coloring or darkening of the reflective element assembly.
Optionally, and with reference to
An electrical connection or contact 722 is connected to or applied to the front substrate electrical connection area 725b to provide electrical power or connection to the semi-conductive layer 718 on the rear surface of the front substrate 712. Likewise, an electrical connection or contact 724 is connected to or applied to the electrically isolated rear substrate electrical connection area 725a and is in electrical communication with the conductive layer of the third surface 714a of rear substrate 714 via a conductive material or bridge 723, as discussed below.
With reference to
When the substrates 712, 714 are placed together to form the electro-optic or electrochromic mirror cell or reflective element assembly (with the electro-optic or electrochromic medium disposed or sandwiched therebetween), the electrical connection area 727 of rear substrate 714 generally aligns with a portion of the electrical connection area 725 of front substrate 712. The conductive bridge 723 bridges or spans the gap or spacing between the electrical connection areas 725a and 727 to connect the electrical contact or connector 724 and electrical connection area 725a to the metallic conductive reflective layer 720 of rear substrate 714.
The cut-away edge 714c of rear substrate 714 provides for exposure of the electrical connectors or contacts 722, 724 along the outer edge 712c of the electrical connection area 725 of front substrate 712. The electrical contacts for providing electrical power to the conductive or semi-conductive layers at both substrates are made at only one of the substrates. The other edges of the substrates 712, 714 are generally flush or aligned to form a flush reflective element assembly for an exterior rearview mirror assembly. The reflective element assembly may thus be implemented in a mirror assembly having a minimal bezel or a bezelless mirror assembly to enhance the appearance of the mirror assembly.
Referring now to
Reflective element assembly 810 includes electrical connectors 824, 822 at a rear surface 814b of rear substrate 814 and at least partially along the upper edge 814c and lower edge 814d of rear substrate 814, respectively. The connectors may be disposed partially at the rear surface 814b of rear substrate 814 and may extend along and overlap the edges 814c, 814d of rear substrate 814. The electrical or metallic connectors 824, 822 are in electrical connection with the respective conductive layers 820, 818 and may be connected to an electrical power source or circuitry or the like to provide electrical power to the semi-conductive coatings 818, 820 to darken or color the electrochromic medium 816. The front substrate 812 includes a deletion line 821 along the upper portion 812b of the substrate and along the semi-conductive coating or layer 818 on the rear surface 812a of substrate 812. The deletion line 821 defines an electrically isolated area or region 821a along a perimeter region of substrate 812, such as along the upper portion of the substrate 812.
As can be seen with reference to
Optionally, and as shown in
Optionally, and as shown in
Optionally, and with reference to
Optionally, and with reference to
An electrical connector 922 is disposed at the rear substrate, such as partially along the rear surface 914d of rear substrate 914, and overlaps at least a portion 920a of the conductive layer 920 on the edge 914b of rear substrate 914, thereby providing an electrical connection from the rear of the reflective element assembly 910 to the electrically isolated area 921a of the conductive layer 920. The connector 922 thus provides an electrical connection to the semi-conductive layer 918 on the rear surface 912a of the front substrate 912 via the conductive bridge 923 extending along and between the isolated area 921a and the semi-conductive layer 918 at the perimeter or border regions of the front and rear substrates. The isolated area 921a and the conductive bridge 923 provide an electrical raceway along a perimeter or border portion of the semi-conductive layer 918 to enhance the performance of the reflective element assembly 910.
A second electrical connector 924 is disposed partially along the rear surface 914d of the rear substrate 914 and overlaps at least a portion 920b of the conductive layer 920 at the edge 914c of rear substrate 914, thereby providing an electrical connection from the rear of the reflective element assembly 910 to the conductive layer 920 along the front surface 914a of rear substrate 914.
Referring now to
As can be seen in
Referring now to
Reflective element assembly 1110 includes an electrical connector 1122 that may be disposed at a perimeter or border region 1110a of the reflective element assembly for providing or delivering electrical power to the semi-conductive layer 1118 of front substrate 1112 via a conductive bridge or adhesive 1123a. As can be seen in
Likewise, a second electrical connector 1124 may be disposed on another perimeter region 1110b of the reflective element and may be formed to overlay the rear surface 1114b of rear substrate 1114 and extend along an edge 1114d of the rear substrate and contact the conductive bridge 1123b disposed between the connector 1124 and the conductive layer 1120 and outside of the perimeter seal 1117. The conductive layer or coating 1118 of front substrate 1112 may not extend fully across the surface 1112a of front substrate 1112 so as to define a non-conductive surface or area of border coating 1119 at conductive bridge 1123b and generally at the overhang region 1112f. The second surface 1112a of front substrate 1112 and the non-conductive border coating 1119 and non-conductive seal 1117 function to electrically isolate or insulate the connector 1124 and conductive adhesive 1123b from the conductive coating 1118 of front substrate 1112. The second connector 1124 may provide electrical power to the metal reflector coating or conductive layer 1120 on the rear substrate 1114, with the conductive adhesive 1123b acting as a raceway along a perimeter or border region of the front surface of the rear substrate 1114. The connectors 1122, 1124 may be connected to an appropriate power source, control, circuitry or the like for controlling the electrochromic cell or reflective element assembly.
Optionally, and as shown in
Referring now to
The front substrate 1212 includes an opaquifying or darkening or blackening or concealing or hiding non-conductive border coating 1219a disposed over the semi-conductive layer 1218 and around or along a perimeter region or border 1212b of the rear surface 1212a of the front substrate 1212, and an opaquifying conductive border coating 1219b disposed over the semi-conductive layer 1218 and around or along a perimeter region or border 1212c of the rear surface 1212a of the front substrate 1212. The transparent semi-conductive coating or layer 1218 may include a deletion line 1221 to define an electrically isolated area or region 1221a, with the non-conductive border coating 1219a disposed along the semi-conductive layer 1218 and over the deletion line 1221. The non-conductive border coating 1219a may at least partially or substantially fill in or encompass deletion line 1221. The non-conductive border coating 1219a and deletion line 1221 thus function to electrically isolate or insulate the conductive coating 1218 from electrical connector 1224.
In the illustrated embodiment, the reflective element assembly 1210 includes an encapsulant 1225 which substantially surrounds the rear and side edges of the reflective element assembly and may cover or overlay a heater pad or the like 1227 at the rear surface 1214b of the rear substrate 1214. The encapsulant 1225 extends along the edges 1214c, 1214d of rear substrate 1214, and further at least partially along the perimeter edges 1212d, 1212e of front substrate 1212. A metal connector 1222 may be provided through the encapsulant 1225 to power or energize the semi-conductive layer 1218 on rear surface 1212a of front substrate 1212 via a conductive bridge or epoxy or adhesive 1223a disposed at least partially around the connector 1222 and between the connector 1222 and the opaquifying conductive border coating 1219b. As can be seen in
Likewise, the metal connector 1224 may be provided through the encapsulant 1225 to power or energize the conductive layer 1220 on front surface 1214a of rear substrate 1214 via a conductive bridge or epoxy or adhesive 1223b disposed at least partially around the connector 1224 and between the connector 1224 and the opaquifying conductive border coating 1219a, and further between the opaquifying conductive border coating 1219a and the conductive layer 1220. The non-conductive border coating 1219a and deletion line 1221 thus serve to electrically isolate the connector 1224 and conductive bridge 1223b from conductive layer or coating 1218 of front substrate 1212.
Optionally, and with reference to
The conductive bridge 1223b′ may contact the conductive layer 1220 along an edge portion 1220a of the conductive layer. Optionally, in such an embodiment, the edge portion 1220a of the metallic reflector or conductive layer 1220 may wrap at least partially around the edge dimension 1214d of the rear substrate 1214 to extend partially along the edge 1214d, and the encapsulant 1225 may provide a cavity 1225a partially along the edge 1214d for receiving the conductive bridge or epoxy or adhesive or paste or frit or the like 1223b′ to provide contact to the conductive layer 1220 along the wrapped edge portion 1220a of the conductive layer 1220 to enhance the electrical contact and conductivity from the connector 1224 to the conductive layer 1220. The reflective element assembly 1210′ thus may provide an enlarged electro-optic or electrochromic region of the reflective element assembly by reducing the conductive bridge region for the conductive adhesive or bridge 1223b′.
Therefore, the present invention provides an electro-optic or electrochromic reflective element assembly that provides electrical contact to electrical raceways or conductive layers or coatings along regions or border or perimeter regions of the assembly that have a restricted overhang. The electrical connections may be made at overhang regions of the front substrate where the perimeter regions of the front substrate extend beyond the corresponding perimeter regions of the rear substrate, such that the electrical connectors are not viewable through the front surface of the front substrate. The present invention thus may provide a reduced or minimal bezel or no bezel assembly and may provide enhanced performance of the electrochromic mirror assembly. The conductive epoxy or adhesive or bridge may provide an electrical raceway along a perimeter or border portion of the semi-conductive and/or conductive layers of the substrates to provide rapid electrical flow along the layers or coatings to further provide rapid and substantially uniform darkening or coloring of the electrochromic medium. The connectors and bridges of the present invention facilitate such enhanced performance at a restricted overhang region and thus provide for a minimal bezel or no bezel around the perimeter of the reflective element assembly. The electrical connectors are electrically isolated or insulated from the other conductive layer or coating via a non-conductive surface and non-conductive seal being positioned between the connector and the respective other conductive layer.
In the embodiments described above, it is envisioned that the non-conductive glass surfaces (where applicable) may be formed by masking the surface of the substrate during coating or deposition of the conductive layer or coating, or may be formed by etching (such as laser etching, chemical etching, mechanical etching or the like) or otherwise removing the conductive layer or coating at the desired area or region, such as via a high voltage discharge to remove or burn the coating off of the desired area or region. The masked portion or etched portion or non-conductive portion may be generally at the outer perimeter or edge of the coating, and may have a width of approximately 0.05 mm, or approximately 0.1 mm, or up to approximately 1 mm. The masked portion or non-conductive surface may be partially or substantially filled or encompassed by the non-conductive seal or by other non-conductive layers or the like disposed at the surface of the substrate. Likewise, the deletion lines (where applicable) may be formed on and through the respective conductive or semi-conductive layer to define electrically isolated areas or regions of the layers. The deletion lines may be formed via any known manner, such as via chemical etching, mechanically etching or, and preferably, laser etching of the layers. The size or width of the deletion line is selected to be sufficient to create an electrical break so there is no electrical conductivity between the layer and the electrically isolated region of the layer. Typically, the deletion lines may be formed to be approximately 0.01 mm to approximately 0.5 min or thereabouts.
Also, the perimeter seal that generally surrounds the electrochromic medium and spaces the front and rear substrates may have a width of preferably approximately 0.5 mm to approximately 3 mm, more preferably approximately 1 mm to approximately 2 mm, and most preferably approximately 1.25 mm to approximately 1.75 mm. The overhang that is defined at the edges of the substrates (where, for example, the rear substrate may be smaller than the front substrate) may be preferably approximately 0.1 mm to approximately 2 mm, more preferably approximately 0.25 mm to approximately 1.5 mm, and most preferably approximately 0.75 mm to approximately 1.25 mm.
In addition to other materials to be used as conductive busbars (such as silver frit, paste, conductive inks, and/or the like), optionally, ultrasonic soldering techniques may be used to apply a busbar which consists of solder (typically, standard soldering technique may not provide good adhesion/flow between the solder and a glass substrate). The solder can be used to provide a busbar for an semi-conductive coating (such as ITO or the like) or for a metallic coating. For example, an ultrasonic soldering system made by Asahi Glass company of Japan (e.g., Model: Sunbonder USM-3) may be used for applying this special solder. The solders that may be used include, for example, ultrasonic solders 143 and 297, available from Asahi Glass company. However, other materials may be implemented, such as conductive inks, pastes, frits, and the like, without affecting the scope of the present invention.
Optionally, and with reference to
Optionally, the electro-optic or electrochromic cell or reflective element assembly of the present invention and the electrical connectors thereon or therearound may be coated with a protective coating to limit or reduce corrosion that may occur on the electrical connectors over time. The coating may comprise a parylene coating or parylene C coating or the like to enhance corrosion resistance (or may comprise other known parylene coatings, such as a parylene N coating, a parylene D coating or a parylene HT coating or the like). Such a parylene coating may be formed in a plasma chamber or vacuum applied and is highly penetrating or permeating so that the parylene coating may penetrate and surround the metal electrical clips or pins or connectors and seal them to limit corrosion of the electrical components. The parylene coating may comprise a thin coating (such as, for example, approximately 2.5 μm to about 12.5 μm) which coats and permeates anything placed in the chamber and not otherwise covered or masked. The parylene coating may comprise a vacuum applied polymer that is either in a gaseous or solid state, and may possess substantial dielectric and barrier properties per unit thickness. Such parylene coatings are known and are typically used in position sensor applications, intake manifold pressure sensor applications, gas sensor applications and valve cover gasket applications for vehicles.
For example, an electrical clip or connector may be in contact with the semi-conductive or conductive layer and may be susceptible or vulnerable to corrosion at the point where the two come in contact (particularly in a high moisture or salt environment and particularly for exterior rearview mirror assemblies). A parylene coating may be applied to substantially seal the connector at the semi-conductive or conductive layer to resist such corrosion. The electrochromic cell or reflective element assembly (with electrical contacts or connectors attached thereto) may be placed in a chamber and the parylene coating may be applied, such as via a vacuum vapor deposition process or the like. Optionally, two or more cells may be stacked in a stepped or offset manner, such that the edges of each cell are exposed to the parylene coating, while the above and below cell act as a mask over the rest of the cell. The parylene coating thus may only be applied to the offset area. The cells of the stack of cells thus may act as a self masking element for the other cells of the stack. Such a self masking approach with multiple cells may be particularly useful for parylene coatings because of the amount of time that it typically may take to coat an item with such parylene coatings.
The parylene raw material (di-para-xylylene dimer) is a crystalline powder and may be vaporized at approximately 150 degrees C. and then molecularly cleaved or pyrolyzed at approximately 680 degrees C. This forms the para-xylylene, which may be introduced generally at room temperature into a vacuum deposition chamber as a monomeric gas that polymerizes substantially evenly on the substrates. The coating then grows as a conformal film on all of the exposed surfaces, edges, etc. of the substrates or cells.
Testing has shown that a known conventional corrosion protection coating or seal may allow corrosion of the electrical contacts and failure of the mirror after about 12 weeks in a salt spray test chamber (such as a test chamber conducting tests in accordance with ASTM B-117, which is hereby incorporated herein by reference), while a substantially identical or similar mirror coated with a parylene C coating may be substantially unchanged, with the electrical contacts remaining at least substantially uncorroded, after about 22 weeks in the same salt spray test chamber and undergoing the same salt spray test. The parylene coating thus provides substantial enhancement of corrosion resistance and the mirror reflective element life cycle over known mirror corrosion protection means.
Optionally, the mirror assemblies or reflective element assemblies or cells of the present invention may include one or more displays for displaying information to the driver or occupant of the vehicle. Optionally, the conductive or semi-conductive layers of the reflective element assembly may have a metallic layer which may be absent or removed at portions, such as to create a local window for placement therebehind of a light emitting display, such as a compass display or PSIR display or other informational display or the like, such as a display of the type disclosed in commonly assigned U.S. Pat. Nos. 6,222,460 and 6,326,900, which are hereby incorporated herein by reference in their entireties, but while maintaining at least the underlying semi-conducting layer at the local window region so that electrical connection through the electrochromic medium at that local region is sustained.
Optionally, the reflective element assembly of the present invention may include other display systems or elements (not shown) which are operable to provide, emit or display information or light through the reflective element assembly. The light is emitted through the reflective element assembly at a display area, such that the display information or light is viewable by a driver of the vehicle. The second or rear substrate and the respective semi-conductive layers of the reflective element assembly or cell then comprise a transflective one way mirror, such as disclosed in commonly assigned U.S. patent application Ser. No. 10/054,633, filed Jan. 22, 2002 by Lynam et al. for VEHICULAR LIGHTING SYSTEM, now U.S. Pat. No. 7,195,381, which is hereby incorporated herein by reference. Preferably, the reflective element assembly (behind which the display is disposed so that the information displayed is visible by viewing through the reflective element assembly) of the mirror assembly comprises a transflective mirror reflector or reflective element assembly such that the mirror reflective element assembly is significantly transmitting to visible light incident from its rear (i.e., the portion furthest from the driver in the vehicle), while simultaneously, the mirror reflective element assembly is substantially reflective to visible light incident from its front (i.e. the position closest to the driver when the mirror assembly is mounted in the vehicle, such as is disclosed in U.S. patent application Ser. No. 09/793,002, filed Feb. 26, 2001 by Schofield et al. for VIDEO MIRROR SYSTEMS INCORPORATING AN ACCESSORY MODULE, now U.S. Pat. No. 6,690,268; and/or in U.S. Pat. Nos. 5,668,663 and 5,724,187, the entire disclosures of which are hereby incorporated by reference herein.
The display system preferably comprises a display-on-demand type of display and includes a display element or light emitting device (also not shown) positioned at the back or fourth surface of the rear substrate. The display element is operable to emit light, such as in the form of indicia, alphanumeric characters, images, or the like, in response to a control or input. The display element may be a vacuum fluorescent (VF) display, a light emitting diode (LED), an organic light emitting diode (OLED), a gas discharge display, a plasma display, a cathode ray tube, a backlit active matrix LCD screen, an electroluminescent display, a field emission display or the like, without affecting the scope of the present invention. The particular display element may be selected to provide a desired color to the display. For example, a VF display may be selected to provide a blue-green color or other colors to the information displayed (depending on the phosphor selected for the display), while a light emitting diode may be selected to provide other colors, such as reds, ambers, or other colors.
Preferably, the display is a display-on-demand type of display, such as of the types disclosed in commonly assigned U.S. Pat. Nos. 5,668,663 and 5,724,187, and/or in U.S. patent application Ser. No. 10/054,633, filed Jan. 22, 2002 by Lynam et al. for VEHICULAR LIGHTING SYSTEM, now U.S. Pat. No. 7,195,381; and/or Ser. No. 09/793,002, filed Feb. 26, 2001 by Schofield et al. for VIDEO MIRROR SYSTEMS INCORPORATING AN ACCESSORY MODULE, now U.S. Pat. No. 6,690,268, which are all hereby incorporated herein by reference. With such a display, it is not only desirable to adjust the display brightness according to ambient lighting conditions, but it is also desirable to adjust the display brightness such that a sufficient contrast ratio is maintained against the variable background brightness of the reflected scene. Also, it may be desirable to compensate for changes in transmission of the electrochromic device affected to control rearward glare sources, in order that the display brightness appears to be maintained at a generally constant level.
In certain conditions, the ambient light intensity within the cabin of the vehicle may be sufficiently high so that reflected light from the mirror reflective element and, in particular, from the display region, tends to “wash-out” the display. It is envisioned that this glare may be reduced by taking advantage of the electrochromic function of the mirror assembly. More particularly, the electro-optic or electrochromic medium of the electro-optic or electrochromic reflective element assembly may be colored or darkened in the area of the display by constructing a locally addressable region across the display. This may be achieved by creating a deletion line in the second surface semi-conductive layer at the second surface of the first or front substrate and/or in the third surface semi-conductive layer of the rear substrate, hence breaking electrical continuity from the rest of the electrochromic cell. An ambient light sensor (not shown) may be used to detect the critical ambient light levels at which “wash-out” is a problem. The addressable region may then be separately colored or darkened to the appropriate level to reduce the glare from the display area in response to the ambient light sensor. Although such a glare problem could be solved by coloring the entire mirror, by localizing the region of coloration to only the display area, the electrochromic mirror assembly of the present invention allows the rest of the mirror reflective area, which does not incorporate the display, to retain full reflectivity while the display area is colored or darkened (such as may be useful when driving by day).
In order to maintain easy viewing of the display, it is desirable to adjust the display intensity in response to ambient light levels (in order to avoid washout during daytime driving conditions and glare during nighttime driving conditions) and in response to the degree of transmissivity of the electrochromic reflective element. For example, in low lighting conditions, such as during the nighttime, the intensity of the display may be dimmed to avoid glare, while in higher lighting conditions, such as during the daytime, the intensity of the display may be increased to provide sufficient visibility of the display to the driver of the vehicle. The mirror assembly may include light sensors for sensing the ambient light in the cabin of the vehicle or at the mirror assembly and may include a control which is operable to automatically adjust the display intensity and/or the transmissivity of the electrochromic medium in response to the ambient light sensors.
Further, automatic dimming circuitry used in electro-optic or electrochromic mirror assemblies utilizing the reflective element assemblies of the present invention may utilize one or more (typically two) photo sensors to detect glaring and/or ambient lighting. For example, a silicon photo sensor, such as a TSL235R Light-to-Frequency converter (available from Texas Advanced Optoelectronic Solutions Inc. of Plano, Tex.), can be used as such photo sensors. Such light-to-frequency converters comprise the combination of a silicon photodiode and a current-to-frequency converter on a single monolithic CMOS integrated circuit.
The reflective element assembly or assemblies of the present invention may also include or house a plurality of electrical or electronic devices, such as antennas, including global positioning system (GPS) or cellular phone antennas, such as disclosed in U.S. Pat. No. 5,971,552, a communication module, such as disclosed in U.S. Pat. No. 5,798,688, displays, such as shown in U.S. Pat. Nos. 5,530,240 and 6,329,925, blind spot detection systems, such as disclosed in U.S. Pat. No. 5,929,786 or 5,786,772, transmitters and/or receivers, such as garage door openers, a digital network, such as described in U.S. Pat. No. 5,798,575, a high/low head lamp controller, such as disclosed in U.S. Pat. No. 5,715,093, a memory mirror system, such as disclosed in U.S. Pat. No. 5,796,176, a hands-free phone attachment, a video device for internal cabin surveillance and/or video telephone function, such as disclosed in U.S. Pat. Nos. 5,760,962 and 5,877,897, a remote keyless entry receiver, map lights, such as disclosed in U.S. Pat. No. 5,938,321; 5,813,745; 5,820,245; 5,673,994; 5,649,756; or 5,178,448, microphones, such as disclosed in U.S. Pat. Nos. 6,243,003 and 6,278,377, speakers, a compass, such as disclosed in U.S. Pat. No. 5,924,212, a seat occupancy detector, a trip computer, an ONSTAR® system or the like (with all of the above-referenced patents commonly assigned to Donnelly Corporation, and with the disclosures of the referenced patents being hereby incorporated herein by reference in their entireties).
The reflective element assembly or assemblies of the present invention may include a printed circuit board (PCB), which may be attached to the rear surface (e.g. the fourth surface) of the mirror element by, for example, a suitable adhesive or the like. An example of such an arrangement is disclosed in commonly assigned U.S. Pat. No. 5,820,245, which is hereby incorporated herein by reference in its entirety. The PCB optionally may include glare sensing and ambient photo sensors and electrochromic circuitry that automatically dims the reflectivity of the electrochromic mirror element when glare conditions are detected, such as at nighttime or the like. Alternately, the PCB may be snap connected, by a clip or otherwise attached, to a plastic plate that itself is adhered to the electrochromic element.
The printed circuit board may include electronic or electrical circuitry for actuating the variable reflectance of the reflective element and for operating other electrical or electronic functions supported in the rearview mirror assembly. The circuit board may support, for example, light emitting diodes (LEDs) for illuminating indicia on display elements provided on the chin of the bezel of the mirror assembly or display devices provided on the reflective element, or map or dash board lights or the like. The circuit board may be independently supported from the reflective element or in the casing or may be mounted to the reflective element's rear or fourth surface on a separate plate or may be directly adhered to the rear surface by a suitable adhesive. Reference is made to U.S. Pat. Nos. 5,671,996 and 5,820,245, the disclosures of which are hereby incorporated herein by reference in their entireties.
Therefore, the present invention provides an electro-optic or electrochromic reflective element assembly which requires a minimal bezel or no bezel around the perimeter edges of the reflective element assembly. The reflective element assembly may provide for electrical connection to the conductive layer at the front substrate that is substantially non viewable through the front substrate. The present invention may also provide a reflective element assembly which may provide a flush alignment of the edges of the substrates along at least one side or edge, while providing a relief area for electrical connection to one of the substrates along the flush or aligned edges. The reflective element assembly of the present invention provides enhanced manufacturing of the reflective element assembly, since the flush alignment of the substrates obviates the need for stepped spacers or pins positioned along the upper or lower edges of the substrates during assembly of the reflective element assembly.
Changes and modifications in the specifically described embodiments can be carried out without departing from the principles of the present invention, which is intended to be limited only by the scope of the appended claims, as interpreted according to the principles of patent law.
The present application is a continuation of U.S. patent application Ser. No. 12/429,620, filed Apr. 24, 2009, now U.S. Pat. No. 7,710,631, which is a continuation of U.S. patent application Ser. No. 11/956,893, filed Dec. 14, 2007, now U.S. Pat. No. 7,525,715, which is a continuation of U.S. patent application Ser. No. 11/709,625, filed Feb. 22, 2007, now U.S. Pat. No. 7,310,177, which is a continuation of U.S. patent application Ser. No. 10/533,762, filed May 4, 2005, now U.S. Pat. No. 7,184,190, which is a 371 application of PCT Application No. PCT/US2003/035381, filed Nov. 5, 2003, which claims priority of U.S. provisional applications, Ser. No. 60/490,111, filed Jul. 25, 2003, and Ser. No. 60/423,903, filed Nov. 5, 2002; and U.S. patent application Ser. No. 10/533,762 is a continuation-in-part of U.S. patent application Ser. No. 10/528,269, filed Mar. 17, 2005, now U.S. Pat. No. 7,274,501, which is a 371 application of PCT Application No. PCT/US2003/029776, filed Sep. 19, 2003, which claims priority of U.S. provisional applications, Ser. No. 60/412,275, filed Sep. 20, 2002; Ser. No. 60/424,116, filed Nov. 5, 2002; and Ser. No. 60/489,816, filed Jul. 24, 2003, which are all hereby incorporated herein by reference in their entireties.
| Number | Name | Date | Kind |
|---|---|---|---|
| 1096452 | Perrin | May 1914 | A |
| 1563258 | Cunningham | Nov 1925 | A |
| 2069368 | Horinstein | Feb 1937 | A |
| 2166303 | Hodny et al. | Jul 1939 | A |
| 2263382 | Gotzinger | Nov 1941 | A |
| 2414223 | DeVirgilis | Jan 1947 | A |
| 2457348 | Chambers | Dec 1948 | A |
| 2561582 | Marbel | Jul 1951 | A |
| 2580014 | Gazda | Dec 1951 | A |
| 3004473 | Arthur et al. | Oct 1961 | A |
| 3075430 | Woodward et al. | Jan 1963 | A |
| 3141393 | Platt | Jul 1964 | A |
| 3152216 | Woodward | Oct 1964 | A |
| 3185020 | Thelen | May 1965 | A |
| 3266016 | Maruyama et al. | Aug 1966 | A |
| 3280701 | Donnelly at al. | Oct 1966 | A |
| 3432225 | Rock | Mar 1969 | A |
| 3451741 | Manos | Jun 1969 | A |
| 3453038 | Kissa et al. | Jul 1969 | A |
| 3467465 | Van Noord | Sep 1969 | A |
| 3480781 | Mandalakas | Nov 1969 | A |
| 3499112 | Heilmeier et al. | Mar 1970 | A |
| 3499702 | Goldmacher et al. | Mar 1970 | A |
| 3521941 | Deb et al. | Jul 1970 | A |
| 3543018 | Barcus et al. | Nov 1970 | A |
| 3557265 | Chisholm et al. | Jan 1971 | A |
| 3565985 | Schrenk et al. | Feb 1971 | A |
| 3612654 | Klein et al. | Oct 1971 | A |
| 3614210 | Caplan | Oct 1971 | A |
| 3628851 | Robertson | Dec 1971 | A |
| 3676668 | Collins et al. | Jul 1972 | A |
| 3680951 | Jordan et al. | Aug 1972 | A |
| 3689695 | Rosenfield et al. | Sep 1972 | A |
| 3711176 | Alfrey, Jr. et al. | Jan 1973 | A |
| 3712710 | Castellion et al. | Jan 1973 | A |
| 3748017 | Yamamura et al. | Jul 1973 | A |
| 3781090 | Sumita | Dec 1973 | A |
| 3806229 | Schoot et al. | Apr 1974 | A |
| 3807832 | Castellion | Apr 1974 | A |
| 3807833 | Graham et al. | Apr 1974 | A |
| 3821590 | Kosman et al. | Jun 1974 | A |
| 3837129 | Losell | Sep 1974 | A |
| 3847701 | Fairbanks | Nov 1974 | A |
| 3860847 | Carley | Jan 1975 | A |
| 3862798 | Hopkins | Jan 1975 | A |
| 3870404 | Wilson et al. | Mar 1975 | A |
| 3876287 | Sprokel | Apr 1975 | A |
| 3932024 | Yaguchi et al. | Jan 1976 | A |
| 3940822 | Emerick et al. | Mar 1976 | A |
| 3956017 | Shigemasa | May 1976 | A |
| 3978190 | Kurz, Jr. et al. | Aug 1976 | A |
| 3985424 | Steinacher | Oct 1976 | A |
| 4006546 | Anderson et al. | Feb 1977 | A |
| 4035681 | Savage | Jul 1977 | A |
| 4040727 | Ketchpel | Aug 1977 | A |
| 4052712 | Ohama et al. | Oct 1977 | A |
| 4075468 | Marcus | Feb 1978 | A |
| 4088400 | Assouline et al. | May 1978 | A |
| 4093364 | Miller | Jun 1978 | A |
| 4097131 | Nishiyama | Jun 1978 | A |
| 4109235 | Bouthors | Aug 1978 | A |
| 4139234 | Morgan | Feb 1979 | A |
| 4161653 | Bedini et al. | Jul 1979 | A |
| 4171875 | Taylor et al. | Oct 1979 | A |
| 4174152 | Gilia et al. | Nov 1979 | A |
| 4200361 | Malvano et al. | Apr 1980 | A |
| 4202607 | Washizuka et al. | May 1980 | A |
| 4211955 | Ray | Jul 1980 | A |
| 4214266 | Myers | Jul 1980 | A |
| 4219760 | Ferro | Aug 1980 | A |
| 4221955 | Joslyn | Sep 1980 | A |
| 4228490 | Thillays | Oct 1980 | A |
| 4247870 | Gabel et al. | Jan 1981 | A |
| 4257703 | Goodrich | Mar 1981 | A |
| 4274078 | Isobe et al. | Jun 1981 | A |
| 4277804 | Robison | Jul 1981 | A |
| 4281899 | Oskam | Aug 1981 | A |
| 4288814 | Talley et al. | Sep 1981 | A |
| RE30835 | Giglia | Dec 1981 | E |
| 4306768 | Egging | Dec 1981 | A |
| 4310851 | Pierrat | Jan 1982 | A |
| 4331382 | Graff | May 1982 | A |
| 4338000 | Kamimori et al. | Jul 1982 | A |
| 4377613 | Gordon | Mar 1983 | A |
| 4398805 | Cole | Aug 1983 | A |
| 4419386 | Gordon | Dec 1983 | A |
| 4420238 | Felix | Dec 1983 | A |
| 4425717 | Marcus | Jan 1984 | A |
| 4435042 | Wood et al. | Mar 1984 | A |
| 4435048 | Kamimori et al. | Mar 1984 | A |
| 4436371 | Wood et al. | Mar 1984 | A |
| 4438348 | Casper et al. | Mar 1984 | A |
| 4443057 | Bauer et al. | Apr 1984 | A |
| 4446171 | Thomas | May 1984 | A |
| 4465339 | Baucke et al. | Aug 1984 | A |
| 4473695 | Wrighton et al. | Sep 1984 | A |
| 4490227 | Bitter | Dec 1984 | A |
| 4491390 | Tong-Shen | Jan 1985 | A |
| 4499451 | Suzuki et al. | Feb 1985 | A |
| 4521079 | Leenhouts et al. | Jun 1985 | A |
| 4524941 | Wood et al. | Jun 1985 | A |
| 4538063 | Bulat | Aug 1985 | A |
| 4546551 | Franks | Oct 1985 | A |
| 4555694 | Yanagishima et al. | Nov 1985 | A |
| 4561625 | Weaver | Dec 1985 | A |
| 4572619 | Reininger et al. | Feb 1986 | A |
| 4580196 | Task | Apr 1986 | A |
| 4581827 | Higashi | Apr 1986 | A |
| 4588267 | Pastore | May 1986 | A |
| 4603946 | Kato et al. | Aug 1986 | A |
| 4623222 | Itoh et al. | Nov 1986 | A |
| 4626850 | Chey | Dec 1986 | A |
| 4630109 | Barton | Dec 1986 | A |
| 4630904 | Pastore | Dec 1986 | A |
| 4634835 | Suzuki | Jan 1987 | A |
| 4635033 | Inukai et al. | Jan 1987 | A |
| 4636782 | Nakamura et al. | Jan 1987 | A |
| 4638287 | Umebayashi et al. | Jan 1987 | A |
| 4646210 | Skogler et al. | Feb 1987 | A |
| 4652090 | Uchikawa et al. | Mar 1987 | A |
| 4655549 | Suzuki et al. | Apr 1987 | A |
| 4665311 | Cole | May 1987 | A |
| 4665430 | Hiroyasu | May 1987 | A |
| 4669827 | Fukada et al. | Jun 1987 | A |
| 4671615 | Fukada et al. | Jun 1987 | A |
| 4671619 | Kamimori et al. | Jun 1987 | A |
| 4678281 | Bauer | Jul 1987 | A |
| 4679906 | Brandenburg | Jul 1987 | A |
| 4682083 | Alley | Jul 1987 | A |
| 4692798 | Seko et al. | Sep 1987 | A |
| 4694295 | Miller et al. | Sep 1987 | A |
| 4697883 | Suzuki et al. | Oct 1987 | A |
| 4702566 | Tukude et al. | Oct 1987 | A |
| 4712879 | Lynam et al. | Dec 1987 | A |
| 4713685 | Nishimura et al. | Dec 1987 | A |
| 4721364 | Itoh et al. | Jan 1988 | A |
| 4729076 | Masami et al. | Mar 1988 | A |
| 4731669 | Hayashi et al. | Mar 1988 | A |
| 4733335 | Serizawa et al. | Mar 1988 | A |
| 4733336 | Skogler et al. | Mar 1988 | A |
| 4740838 | Mase et al. | Apr 1988 | A |
| 4761061 | Nishiyama et al. | Aug 1988 | A |
| 4773740 | Kawakami et al. | Sep 1988 | A |
| 4780752 | Angerstein et al. | Oct 1988 | A |
| 4781436 | Armbruster | Nov 1988 | A |
| 4789904 | Peterson | Dec 1988 | A |
| 4793690 | Gahan et al. | Dec 1988 | A |
| 4793695 | Wada et al. | Dec 1988 | A |
| 4794261 | Rosen | Dec 1988 | A |
| 4799768 | Gahan | Jan 1989 | A |
| 4803599 | Trine et al. | Feb 1989 | A |
| 4807096 | Skogler et al. | Feb 1989 | A |
| 4820933 | Hong et al. | Apr 1989 | A |
| 4825232 | Howdle | Apr 1989 | A |
| 4826289 | Vandenbrink et al. | May 1989 | A |
| 4827086 | Rockwell | May 1989 | A |
| 4837551 | Iino | Jun 1989 | A |
| 4845402 | Smith | Jul 1989 | A |
| 4847772 | Michalopoulos et al. | Jul 1989 | A |
| 4855161 | Moser et al. | Aug 1989 | A |
| 4855550 | Schultz, Jr. | Aug 1989 | A |
| 4859813 | Rockwell | Aug 1989 | A |
| 4859867 | Larson et al. | Aug 1989 | A |
| 4862594 | Schierbeek et al. | Sep 1989 | A |
| 4871917 | O'Farrell et al. | Oct 1989 | A |
| 4872051 | Dye | Oct 1989 | A |
| 4882466 | Friel | Nov 1989 | A |
| 4882565 | Gallmeyer | Nov 1989 | A |
| 4883349 | Mittelhäuser | Nov 1989 | A |
| 4884135 | Schiffman | Nov 1989 | A |
| 4886960 | Molyneux et al. | Dec 1989 | A |
| 4891828 | Kawazoe | Jan 1990 | A |
| 4892345 | Rachael, III | Jan 1990 | A |
| 4902108 | Byker | Feb 1990 | A |
| 4906085 | Sugihara et al. | Mar 1990 | A |
| 4910591 | Petrossian et al. | Mar 1990 | A |
| 4916374 | Schierbeek et al. | Apr 1990 | A |
| 4926170 | Beggs et al. | May 1990 | A |
| 4930742 | Schofield et al. | Jun 1990 | A |
| 4935665 | Murata | Jun 1990 | A |
| 4936533 | Adams et al. | Jun 1990 | A |
| 4937796 | Tendler | Jun 1990 | A |
| 4937945 | Schofield et al. | Jul 1990 | A |
| 4943796 | Lee | Jul 1990 | A |
| 4948242 | Desmond et al. | Aug 1990 | A |
| 4953305 | Van Lente et al. | Sep 1990 | A |
| 4956591 | Schierbeek et al. | Sep 1990 | A |
| 4959247 | Moser et al. | Sep 1990 | A |
| 4959865 | Stettiner et al. | Sep 1990 | A |
| 4970653 | Kenue | Nov 1990 | A |
| 4973844 | O'Farrell et al. | Nov 1990 | A |
| 4978196 | Suzuki et al. | Dec 1990 | A |
| 4987357 | Masaki | Jan 1991 | A |
| 4996083 | Moser et al. | Feb 1991 | A |
| 5001386 | Sullivan et al. | Mar 1991 | A |
| 5001558 | Burley et al. | Mar 1991 | A |
| 5005213 | Hanson et al. | Apr 1991 | A |
| 5006971 | Jerkins | Apr 1991 | A |
| 5014167 | Roberts | May 1991 | A |
| 5016996 | Ueno | May 1991 | A |
| 5017903 | Krippelz, Sr. | May 1991 | A |
| 5027200 | Petrossian et al. | Jun 1991 | A |
| 5037182 | Groves et al. | Aug 1991 | A |
| 5038255 | Nashihashi et al. | Aug 1991 | A |
| 5052163 | Czekala | Oct 1991 | A |
| 5056899 | Warszawski | Oct 1991 | A |
| 5058851 | Lawlor et al. | Oct 1991 | A |
| 5059015 | Tran | Oct 1991 | A |
| 5066108 | McDonald | Nov 1991 | A |
| 5066112 | Lynam et al. | Nov 1991 | A |
| 5069535 | Baucke et al. | Dec 1991 | A |
| 5070323 | Iino et al. | Dec 1991 | A |
| 5073012 | Lynam | Dec 1991 | A |
| 5076673 | Lynam et al. | Dec 1991 | A |
| 5076674 | Lynam | Dec 1991 | A |
| 5078480 | Warszawski | Jan 1992 | A |
| 5096287 | Kakinami et al. | Mar 1992 | A |
| 5100095 | Haan et al. | Mar 1992 | A |
| 5101139 | Lechter | Mar 1992 | A |
| 5105127 | Lavaud et al. | Apr 1992 | A |
| 5115346 | Lynam | May 1992 | A |
| 5117346 | Gard | May 1992 | A |
| 5121200 | Choi | Jun 1992 | A |
| 5122619 | Dlubak | Jun 1992 | A |
| 5124845 | Shimojo | Jun 1992 | A |
| 5128799 | Byker | Jul 1992 | A |
| 5131154 | Schierbeek et al. | Jul 1992 | A |
| 5135298 | Feltman | Aug 1992 | A |
| 5136483 | Schöniger et al. | Aug 1992 | A |
| 5140455 | Varaprasad et al. | Aug 1992 | A |
| 5142407 | Varaprasad et al. | Aug 1992 | A |
| 5145609 | Varaprasad et al. | Sep 1992 | A |
| 5150232 | Gunkima et al. | Sep 1992 | A |
| 5151816 | Varaprasad et al. | Sep 1992 | A |
| 5151824 | O'Farrell | Sep 1992 | A |
| 5154617 | Suman et al. | Oct 1992 | A |
| 5158638 | Osanami et al. | Oct 1992 | A |
| 5160200 | Cheselske | Nov 1992 | A |
| 5160201 | Wrobel | Nov 1992 | A |
| 5168378 | Black et al. | Dec 1992 | A |
| 5173881 | Sindle | Dec 1992 | A |
| 5177031 | Buchmann et al. | Jan 1993 | A |
| 5178448 | Adams et al. | Jan 1993 | A |
| 5179471 | Caskey et al. | Jan 1993 | A |
| 5183099 | Bechu | Feb 1993 | A |
| 5184956 | Langlarais et al. | Feb 1993 | A |
| 5189537 | O'Farrell | Feb 1993 | A |
| 5193029 | Schofield et al. | Mar 1993 | A |
| 5197562 | Kakinami et al. | Mar 1993 | A |
| 5207492 | Roberts | May 1993 | A |
| 5210967 | Brown | May 1993 | A |
| 5214408 | Asayama | May 1993 | A |
| 5217794 | Schrenk | Jun 1993 | A |
| 5223814 | Suman | Jun 1993 | A |
| 5223844 | Mansell et al. | Jun 1993 | A |
| 5229975 | Truesdell et al. | Jul 1993 | A |
| 5230400 | Kakinami et al. | Jul 1993 | A |
| 5233461 | Dornan et al. | Aug 1993 | A |
| 5235316 | Qualizza | Aug 1993 | A |
| 5239405 | Varaprasad et al. | Aug 1993 | A |
| 5239406 | Lynam | Aug 1993 | A |
| 5243417 | Pollard | Sep 1993 | A |
| 5245422 | Borcherts et al. | Sep 1993 | A |
| 5252354 | Cronin et al. | Oct 1993 | A |
| 5253109 | O'Farrell et al. | Oct 1993 | A |
| 5255442 | Schierbeek et al. | Oct 1993 | A |
| 5260626 | Takase et al. | Nov 1993 | A |
| 5277986 | Cronin et al. | Jan 1994 | A |
| 5280555 | Ainsburg | Jan 1994 | A |
| 5285060 | Larson et al. | Feb 1994 | A |
| 5289321 | Secor | Feb 1994 | A |
| 5296924 | de Saint Blancard et al. | Mar 1994 | A |
| 5303205 | Gauthier et al. | Apr 1994 | A |
| 5304980 | Maekawa | Apr 1994 | A |
| 5305012 | Faris | Apr 1994 | A |
| 5307136 | Saneyoshi | Apr 1994 | A |
| 5313335 | Gray et al. | May 1994 | A |
| 5325096 | Pakett | Jun 1994 | A |
| 5325386 | Jewell et al. | Jun 1994 | A |
| 5327288 | Wellington et al. | Jul 1994 | A |
| 5330149 | Haan et al. | Jul 1994 | A |
| 5331312 | Kudoh | Jul 1994 | A |
| 5331358 | Schurle et al. | Jul 1994 | A |
| 5339075 | Abst et al. | Aug 1994 | A |
| 5339529 | Lindberg | Aug 1994 | A |
| 5341437 | Nakayama | Aug 1994 | A |
| D351370 | Lawlor et al. | Oct 1994 | S |
| 5354965 | Lee | Oct 1994 | A |
| 5355118 | Fukuhara | Oct 1994 | A |
| 5355245 | Lynam | Oct 1994 | A |
| 5355284 | Roberts | Oct 1994 | A |
| 5361190 | Roberts et al. | Nov 1994 | A |
| 5371659 | Pastrick et al. | Dec 1994 | A |
| 5373482 | Gauthier | Dec 1994 | A |
| 5379146 | Defendini | Jan 1995 | A |
| 5386285 | Asayama | Jan 1995 | A |
| 5386306 | Gunjima et al. | Jan 1995 | A |
| 5402103 | Tashiro | Mar 1995 | A |
| 5406395 | Wilson et al. | Apr 1995 | A |
| 5406414 | O'Farrell et al. | Apr 1995 | A |
| 5408353 | Nichols et al. | Apr 1995 | A |
| 5408357 | Beukema | Apr 1995 | A |
| 5410346 | Saneyoshi et al. | Apr 1995 | A |
| 5414461 | Kishi et al. | May 1995 | A |
| 5416313 | Larson et al. | May 1995 | A |
| 5416478 | Morinaga | May 1995 | A |
| 5418610 | Fischer | May 1995 | A |
| 5421940 | Cornils et al. | Jun 1995 | A |
| 5422756 | Weber | Jun 1995 | A |
| 5424726 | Beymer | Jun 1995 | A |
| 5424865 | Lynam | Jun 1995 | A |
| 5424952 | Asayama | Jun 1995 | A |
| 5430431 | Nelson | Jul 1995 | A |
| 5432496 | Lin | Jul 1995 | A |
| 5436741 | Crandall | Jul 1995 | A |
| 5437931 | Tsai et al. | Aug 1995 | A |
| 5439305 | Santo | Aug 1995 | A |
| 5444478 | Lelong et al. | Aug 1995 | A |
| 5446576 | Lynam et al. | Aug 1995 | A |
| 5455716 | Suman et al. | Oct 1995 | A |
| 5461361 | Moore | Oct 1995 | A |
| D363920 | Roberts et al. | Nov 1995 | S |
| 5469298 | Suman et al. | Nov 1995 | A |
| 5475366 | Van Lente et al. | Dec 1995 | A |
| 5475494 | Nishida et al. | Dec 1995 | A |
| 5481409 | Roberts | Jan 1996 | A |
| 5483453 | Uemura et al. | Jan 1996 | A |
| 5485161 | Vaughn | Jan 1996 | A |
| 5485378 | Franke et al. | Jan 1996 | A |
| 5487522 | Hook | Jan 1996 | A |
| 5488496 | Pine | Jan 1996 | A |
| 5497305 | Pastrick et al. | Mar 1996 | A |
| 5497306 | Pastrick | Mar 1996 | A |
| 5500760 | Varaprasad et al. | Mar 1996 | A |
| 5509606 | Breithaupt et al. | Apr 1996 | A |
| 5510983 | Iino | Apr 1996 | A |
| 5515448 | Nishitani | May 1996 | A |
| 5519621 | Worthman | May 1996 | A |
| 5521744 | Mazurek | May 1996 | A |
| 5521760 | DeYoung et al. | May 1996 | A |
| 5523811 | Wada et al. | Jun 1996 | A |
| 5523877 | Lynam | Jun 1996 | A |
| 5525264 | Cronin et al. | Jun 1996 | A |
| 5528422 | Roberts | Jun 1996 | A |
| 5528474 | Roney et al. | Jun 1996 | A |
| 5529138 | Shaw et al. | Jun 1996 | A |
| 5530240 | Larson et al. | Jun 1996 | A |
| 5530420 | Tsuchiya et al. | Jun 1996 | A |
| 5530421 | Marshall et al. | Jun 1996 | A |
| 5535056 | Caskey et al. | Jul 1996 | A |
| 5535144 | Kise | Jul 1996 | A |
| 5539397 | Asanuma et al. | Jul 1996 | A |
| 5541590 | Nishio | Jul 1996 | A |
| 5550677 | Schofield et al. | Aug 1996 | A |
| 5561333 | Darius | Oct 1996 | A |
| 5566224 | ul Azam et al. | Oct 1996 | A |
| 5567360 | Varaprasad et al. | Oct 1996 | A |
| 5568316 | Schrenk et al. | Oct 1996 | A |
| 5570127 | Schmidt | Oct 1996 | A |
| 5572354 | Desmond et al. | Nov 1996 | A |
| 5574443 | Hsieh | Nov 1996 | A |
| 5575552 | Faloon et al. | Nov 1996 | A |
| 5576687 | Blank et al. | Nov 1996 | A |
| 5576854 | Schmidt et al. | Nov 1996 | A |
| 5576975 | Sasaki et al. | Nov 1996 | A |
| 5587236 | Agrawal et al. | Dec 1996 | A |
| 5587699 | Faloon et al. | Dec 1996 | A |
| 5594222 | Caldwell | Jan 1997 | A |
| 5594615 | Spijkerman et al. | Jan 1997 | A |
| 5602542 | Widmann et al. | Feb 1997 | A |
| 5602670 | Keegan | Feb 1997 | A |
| 5608550 | Epstein et al. | Mar 1997 | A |
| 5610380 | Nicolaisen | Mar 1997 | A |
| 5610756 | Lynam et al. | Mar 1997 | A |
| 5611966 | Varaprasad et al. | Mar 1997 | A |
| 5614885 | Van Lente et al. | Mar 1997 | A |
| 5615023 | Yang | Mar 1997 | A |
| 5615857 | Hook | Apr 1997 | A |
| 5617085 | Tsutsumi et al. | Apr 1997 | A |
| 5619374 | Roberts | Apr 1997 | A |
| 5619375 | Roberts | Apr 1997 | A |
| 5626800 | Williams et al. | May 1997 | A |
| 5631089 | Center, Jr. et al. | May 1997 | A |
| 5631638 | Kaspar et al. | May 1997 | A |
| 5631639 | Hibino et al. | May 1997 | A |
| 5632092 | Blank et al. | May 1997 | A |
| 5632551 | Roney et al. | May 1997 | A |
| 5634709 | Iwama | Jun 1997 | A |
| 5642238 | Sala | Jun 1997 | A |
| 5644851 | Blank et al. | Jul 1997 | A |
| 5646614 | Abersfelder et al. | Jul 1997 | A |
| 5649756 | Adams et al. | Jul 1997 | A |
| 5649758 | Dion | Jul 1997 | A |
| 5650765 | Park | Jul 1997 | A |
| 5661455 | Van Lente et al. | Aug 1997 | A |
| 5662375 | Adams et al. | Sep 1997 | A |
| 5666157 | Aviv | Sep 1997 | A |
| 5668663 | Varaprasad et al. | Sep 1997 | A |
| 5668675 | Fredricks | Sep 1997 | A |
| 5669698 | Veldman et al. | Sep 1997 | A |
| 5669699 | Pastrick et al. | Sep 1997 | A |
| 5669704 | Pastrick | Sep 1997 | A |
| 5669705 | Pastrick et al. | Sep 1997 | A |
| 5670935 | Schofield et al. | Sep 1997 | A |
| 5671996 | Bos et al. | Sep 1997 | A |
| 5673994 | Fant, Jr. et al. | Oct 1997 | A |
| 5673999 | Koenck | Oct 1997 | A |
| 5680123 | Lee | Oct 1997 | A |
| 5680245 | Lynam | Oct 1997 | A |
| 5680263 | Zimmermann et al. | Oct 1997 | A |
| 5686975 | Lipton | Nov 1997 | A |
| 5689241 | Clarke, Sr. et al. | Nov 1997 | A |
| 5689370 | Tonar et al. | Nov 1997 | A |
| 5691848 | Van Lente et al. | Nov 1997 | A |
| 5692819 | Mitsutake et al. | Dec 1997 | A |
| 5699044 | Van Lente et al. | Dec 1997 | A |
| 5708410 | Blank et al. | Jan 1998 | A |
| 5708415 | Van Lente et al. | Jan 1998 | A |
| 5708857 | Ishibashi | Jan 1998 | A |
| 5715093 | Schierbeek et al. | Feb 1998 | A |
| 5724187 | Varaprasad et al. | Mar 1998 | A |
| 5724316 | Brunts | Mar 1998 | A |
| 5729194 | Spears et al. | Mar 1998 | A |
| 5737226 | Olson et al. | Apr 1998 | A |
| 5741966 | Handfield et al. | Apr 1998 | A |
| 5745050 | Nakagawa | Apr 1998 | A |
| 5745266 | Smith | Apr 1998 | A |
| 5748172 | Song et al. | May 1998 | A |
| 5748287 | Takahashi et al. | May 1998 | A |
| 5751211 | Shirai et al. | May 1998 | A |
| 5751246 | Hertel | May 1998 | A |
| 5751390 | Crawford et al. | May 1998 | A |
| 5751489 | Caskey et al. | May 1998 | A |
| 5754099 | Nishimura et al. | May 1998 | A |
| D394833 | Muth | Jun 1998 | S |
| 5760828 | Cortes | Jun 1998 | A |
| 5760931 | Saburi et al. | Jun 1998 | A |
| 5760962 | Schofield et al. | Jun 1998 | A |
| 5761094 | Olson et al. | Jun 1998 | A |
| 5762823 | Hikmet | Jun 1998 | A |
| 5767793 | Agravante et al. | Jun 1998 | A |
| 5775762 | Vitito | Jul 1998 | A |
| 5786772 | Schofield et al. | Jul 1998 | A |
| 5788357 | Muth et al. | Aug 1998 | A |
| 5790298 | Tonar | Aug 1998 | A |
| 5790973 | Blaker et al. | Aug 1998 | A |
| 5793308 | Rosinski et al. | Aug 1998 | A |
| 5793420 | Schmidt | Aug 1998 | A |
| 5796094 | Schofield et al. | Aug 1998 | A |
| 5796176 | Kramer et al. | Aug 1998 | A |
| 5798057 | Hikmet | Aug 1998 | A |
| 5798575 | O'Farrell et al. | Aug 1998 | A |
| 5798688 | Schofield | Aug 1998 | A |
| 5802727 | Blank et al. | Sep 1998 | A |
| 5803579 | Turnbull et al. | Sep 1998 | A |
| 5805367 | Kanazawa | Sep 1998 | A |
| 5806879 | Hamada et al. | Sep 1998 | A |
| 5806965 | Deese | Sep 1998 | A |
| 5808197 | Dao | Sep 1998 | A |
| 5808566 | Behr et al. | Sep 1998 | A |
| 5808589 | Fergason | Sep 1998 | A |
| 5808713 | Broer et al. | Sep 1998 | A |
| 5808777 | Lynam et al. | Sep 1998 | A |
| 5808778 | Bauer et al. | Sep 1998 | A |
| 5812321 | Schierbeek et al. | Sep 1998 | A |
| 5813745 | Fant, Jr. et al. | Sep 1998 | A |
| 5818625 | Forgette et al. | Oct 1998 | A |
| 5820097 | Spooner | Oct 1998 | A |
| 5820245 | Desmond et al. | Oct 1998 | A |
| 5822023 | Suman et al. | Oct 1998 | A |
| 5823654 | Pastrick et al. | Oct 1998 | A |
| 5825527 | Forgette et al. | Oct 1998 | A |
| 5837994 | Stam et al. | Nov 1998 | A |
| 5844505 | Van Ryzin | Dec 1998 | A |
| 5848373 | DeLorme et al. | Dec 1998 | A |
| 5850176 | Kinoshita et al. | Dec 1998 | A |
| 5863116 | Pastrick et al. | Jan 1999 | A |
| 5864419 | Lynam | Jan 1999 | A |
| 5867801 | Denny | Feb 1999 | A |
| 5871275 | O'Farrell et al. | Feb 1999 | A |
| 5877707 | Kowalick | Mar 1999 | A |
| 5877897 | Schofield et al. | Mar 1999 | A |
| 5878353 | ul Azam et al. | Mar 1999 | A |
| 5878370 | Olson | Mar 1999 | A |
| 5879074 | Pastrick | Mar 1999 | A |
| 5883605 | Knapp | Mar 1999 | A |
| 5883739 | Ashihara et al. | Mar 1999 | A |
| 5888431 | Tonar et al. | Mar 1999 | A |
| D409540 | Muth | May 1999 | S |
| 5899551 | Neijzen et al. | May 1999 | A |
| 5899956 | Chan | May 1999 | A |
| 5904729 | Ruzicka | May 1999 | A |
| 5910854 | Varaprasad et al. | Jun 1999 | A |
| 5914815 | Bos | Jun 1999 | A |
| 5917664 | O'Neill et al. | Jun 1999 | A |
| 5918180 | Dimino | Jun 1999 | A |
| 5922176 | Caskey | Jul 1999 | A |
| 5923027 | Stam et al. | Jul 1999 | A |
| 5923457 | Byker et al. | Jul 1999 | A |
| 5924212 | Domanski | Jul 1999 | A |
| 5927792 | Welling et al. | Jul 1999 | A |
| 5928572 | Tonar et al. | Jul 1999 | A |
| 5929786 | Schofield et al. | Jul 1999 | A |
| 5938320 | Crandall | Aug 1999 | A |
| 5938321 | Bos et al. | Aug 1999 | A |
| 5938721 | Dussell et al. | Aug 1999 | A |
| 5940011 | Agravante et al. | Aug 1999 | A |
| 5940120 | Frankhouse et al. | Aug 1999 | A |
| 5940201 | Ash et al. | Aug 1999 | A |
| 5942895 | Popovic et al. | Aug 1999 | A |
| 5949331 | Schofield et al. | Sep 1999 | A |
| 5956079 | Ridgley | Sep 1999 | A |
| 5956181 | Lin | Sep 1999 | A |
| 5959367 | O'Farrell et al. | Sep 1999 | A |
| 5959555 | Furuta | Sep 1999 | A |
| 5959577 | Fan et al. | Sep 1999 | A |
| 5963247 | Banitt | Oct 1999 | A |
| 5965247 | Jonza et al. | Oct 1999 | A |
| 5971552 | O'Farrell et al. | Oct 1999 | A |
| 5973760 | Dehmlow | Oct 1999 | A |
| 5975715 | Bauder | Nov 1999 | A |
| 5984482 | Rumsey et al. | Nov 1999 | A |
| 5986730 | Hansen et al. | Nov 1999 | A |
| 5990469 | Bechtel et al. | Nov 1999 | A |
| 5990625 | Meissner et al. | Nov 1999 | A |
| 5998617 | Srinivasa et al. | Dec 1999 | A |
| 5998929 | Bechtel et al. | Dec 1999 | A |
| 6000823 | Desmond et al. | Dec 1999 | A |
| 6001486 | Varaprasad et al. | Dec 1999 | A |
| 6002511 | Varaprasad et al. | Dec 1999 | A |
| 6002544 | Yatsu | Dec 1999 | A |
| 6005724 | Todd | Dec 1999 | A |
| 6007222 | Thau | Dec 1999 | A |
| 6008486 | Stam et al. | Dec 1999 | A |
| 6008871 | Okumura | Dec 1999 | A |
| 6009359 | El-Hakim et al. | Dec 1999 | A |
| 6016035 | Eberspächer et al. | Jan 2000 | A |
| 6016215 | Byker | Jan 2000 | A |
| 6019411 | Carter et al. | Feb 2000 | A |
| 6019475 | Lynam et al. | Feb 2000 | A |
| 6021371 | Fultz | Feb 2000 | A |
| 6023229 | Bugno et al. | Feb 2000 | A |
| 6025872 | Ozaki et al. | Feb 2000 | A |
| 6037689 | Bingle et al. | Mar 2000 | A |
| 6042253 | Fant, Jr. et al. | Mar 2000 | A |
| 6045243 | Muth et al. | Apr 2000 | A |
| 6045643 | Byker et al. | Apr 2000 | A |
| 6046766 | Sakata | Apr 2000 | A |
| 6046837 | Yamamoto | Apr 2000 | A |
| 6049171 | Stam et al. | Apr 2000 | A |
| D425466 | Todd et al. | May 2000 | S |
| 6060989 | Gehlot | May 2000 | A |
| 6061002 | Weber et al. | May 2000 | A |
| 6062920 | Jordan et al. | May 2000 | A |
| 6064508 | Forgette et al. | May 2000 | A |
| 6065840 | Caskey et al. | May 2000 | A |
| 6067111 | Hahn et al. | May 2000 | A |
| 6067500 | Morimoto et al. | May 2000 | A |
| 6068380 | Lynn et al. | May 2000 | A |
| D426506 | Todd et al. | Jun 2000 | S |
| D426507 | Todd et al. | Jun 2000 | S |
| D427128 | Mathieu | Jun 2000 | S |
| 6072391 | Suzukie et al. | Jun 2000 | A |
| 6074077 | Pastrick et al. | Jun 2000 | A |
| 6074777 | Reimers et al. | Jun 2000 | A |
| 6076948 | Bukosky et al. | Jun 2000 | A |
| 6078355 | Zengel | Jun 2000 | A |
| 6078865 | Koyanagi | Jun 2000 | A |
| D428372 | Todd et al. | Jul 2000 | S |
| D428373 | Todd et al. | Jul 2000 | S |
| 6082881 | Hicks | Jul 2000 | A |
| 6084700 | Knapp et al. | Jul 2000 | A |
| 6086131 | Bingle et al. | Jul 2000 | A |
| 6086229 | Pastrick | Jul 2000 | A |
| 6087012 | Varaprasad et al. | Jul 2000 | A |
| 6087953 | DeLine et al. | Jul 2000 | A |
| 6093976 | Kramer et al. | Jul 2000 | A |
| 6094618 | Harada | Jul 2000 | A |
| D428842 | Todd et al. | Aug 2000 | S |
| D429202 | Todd et al. | Aug 2000 | S |
| D430088 | Todd et al. | Aug 2000 | S |
| 6097023 | Schofield et al. | Aug 2000 | A |
| 6097316 | Liaw et al. | Aug 2000 | A |
| 6099131 | Fletcher et al. | Aug 2000 | A |
| 6099155 | Pastrick et al. | Aug 2000 | A |
| 6102546 | Carter | Aug 2000 | A |
| 6102559 | Nold et al. | Aug 2000 | A |
| 6104552 | Thau et al. | Aug 2000 | A |
| 6106121 | Buckley et al. | Aug 2000 | A |
| 6111498 | Jobes, I et al. | Aug 2000 | A |
| 6111683 | Cammenga et al. | Aug 2000 | A |
| 6111684 | Forgette et al. | Aug 2000 | A |
| 6111685 | Tench et al. | Aug 2000 | A |
| 6111696 | Allen et al. | Aug 2000 | A |
| 6115086 | Rosen | Sep 2000 | A |
| 6115651 | Cruz | Sep 2000 | A |
| 6116743 | Hoek | Sep 2000 | A |
| 6122597 | Saneyoshi et al. | Sep 2000 | A |
| 6122921 | Brezoczky et al. | Sep 2000 | A |
| 6124647 | Marcus et al. | Sep 2000 | A |
| 6124886 | DeLine et al. | Sep 2000 | A |
| 6127919 | Wylin | Oct 2000 | A |
| 6127945 | Mura-Smith | Oct 2000 | A |
| 6128576 | Nishimoto et al. | Oct 2000 | A |
| 6130421 | Bechtel et al. | Oct 2000 | A |
| 6130448 | Bauer et al. | Oct 2000 | A |
| 6132072 | Turnbull et al. | Oct 2000 | A |
| 6139171 | Waldmann | Oct 2000 | A |
| 6139172 | Bos et al. | Oct 2000 | A |
| 6140933 | Bugno et al. | Oct 2000 | A |
| 6142656 | Kurth | Nov 2000 | A |
| 6146003 | Thau | Nov 2000 | A |
| 6148261 | Obradovich et al. | Nov 2000 | A |
| 6149287 | Pastrick et al. | Nov 2000 | A |
| 6150014 | Chu et al. | Nov 2000 | A |
| 6151065 | Steed et al. | Nov 2000 | A |
| 6151539 | Bergholz et al. | Nov 2000 | A |
| 6152551 | Annas | Nov 2000 | A |
| 6152590 | Fürst et al. | Nov 2000 | A |
| 6154149 | Tyckowski et al. | Nov 2000 | A |
| 6154306 | Varaprasad et al. | Nov 2000 | A |
| 6157294 | Urai et al. | Dec 2000 | A |
| 6157418 | Rosen | Dec 2000 | A |
| 6158655 | DeVries, Jr. et al. | Dec 2000 | A |
| 6161865 | Rose et al. | Dec 2000 | A |
| 6163083 | Kramer et al. | Dec 2000 | A |
| 6164564 | Franco et al. | Dec 2000 | A |
| 6166625 | Teowee et al. | Dec 2000 | A |
| 6166629 | Hamma et al. | Dec 2000 | A |
| 6166847 | Tench et al. | Dec 2000 | A |
| 6166848 | Cammenga et al. | Dec 2000 | A |
| 6167755 | Damson et al. | Jan 2001 | B1 |
| 6169955 | Fultz | Jan 2001 | B1 |
| 6170956 | Rumsey et al. | Jan 2001 | B1 |
| 6172600 | Kakinami et al. | Jan 2001 | B1 |
| 6172601 | Wada et al. | Jan 2001 | B1 |
| 6172613 | DeLine et al. | Jan 2001 | B1 |
| 6173501 | Blank et al. | Jan 2001 | B1 |
| 6175164 | O'Farrell et al. | Jan 2001 | B1 |
| 6175300 | Kendrick | Jan 2001 | B1 |
| 6176602 | Pastrick et al. | Jan 2001 | B1 |
| 6178034 | Allemand et al. | Jan 2001 | B1 |
| 6178377 | Ishihara et al. | Jan 2001 | B1 |
| 6181387 | Rosen | Jan 2001 | B1 |
| 6182006 | Meek | Jan 2001 | B1 |
| 6183119 | Desmond et al. | Feb 2001 | B1 |
| 6184679 | Popovic et al. | Feb 2001 | B1 |
| 6184781 | Ramakesavan | Feb 2001 | B1 |
| 6185492 | Kagawa et al. | Feb 2001 | B1 |
| 6185501 | Smith et al. | Feb 2001 | B1 |
| 6188505 | Lomprey et al. | Feb 2001 | B1 |
| 6191704 | Takenaga et al. | Feb 2001 | B1 |
| 6195194 | Roberts et al. | Feb 2001 | B1 |
| 6196688 | Caskey et al. | Mar 2001 | B1 |
| 6198409 | Schofield et al. | Mar 2001 | B1 |
| 6199014 | Walker et al. | Mar 2001 | B1 |
| 6199810 | Wu et al. | Mar 2001 | B1 |
| 6200010 | Anders | Mar 2001 | B1 |
| 6201642 | Bos | Mar 2001 | B1 |
| 6206553 | Boddy et al. | Mar 2001 | B1 |
| 6207083 | Varaprasad et al. | Mar 2001 | B1 |
| 6210008 | Hoekstra et al. | Apr 2001 | B1 |
| 6210012 | Broer | Apr 2001 | B1 |
| 6212470 | Seymour et al. | Apr 2001 | B1 |
| 6217181 | Lynam et al. | Apr 2001 | B1 |
| 6218934 | Regan | Apr 2001 | B1 |
| 6222447 | Schofield et al. | Apr 2001 | B1 |
| 6222460 | DeLine et al. | Apr 2001 | B1 |
| 6227689 | Miller | May 2001 | B1 |
| 6232937 | Jacobsen et al. | May 2001 | B1 |
| 6239851 | Hatazawa et al. | May 2001 | B1 |
| 6239898 | Byker et al. | May 2001 | B1 |
| 6239899 | DeVries et al. | May 2001 | B1 |
| 6243003 | DeLine et al. | Jun 2001 | B1 |
| 6244716 | Steenwyk et al. | Jun 2001 | B1 |
| 6245262 | Varaprasad et al. | Jun 2001 | B1 |
| 6247820 | Van Order | Jun 2001 | B1 |
| 6249214 | Kashiwazaki | Jun 2001 | B1 |
| 6249369 | Theiste et al. | Jun 2001 | B1 |
| 6250148 | Lynam | Jun 2001 | B1 |
| 6250766 | Strumolo et al. | Jun 2001 | B1 |
| 6250783 | Stidham et al. | Jun 2001 | B1 |
| 6255639 | Stam et al. | Jul 2001 | B1 |
| 6257746 | Todd et al. | Jul 2001 | B1 |
| 6259412 | Duroux | Jul 2001 | B1 |
| 6259475 | Ramachandran et al. | Jul 2001 | B1 |
| 6260608 | Kim | Jul 2001 | B1 |
| 6264353 | Carraher et al. | Jul 2001 | B1 |
| 6265968 | Betzitza et al. | Jul 2001 | B1 |
| 6268803 | Gunderson et al. | Jul 2001 | B1 |
| 6269308 | Kodaka et al. | Jul 2001 | B1 |
| 6274221 | Smith et al. | Aug 2001 | B2 |
| 6276821 | Pastrick et al. | Aug 2001 | B1 |
| 6276822 | Bedrosian et al. | Aug 2001 | B1 |
| 6277471 | Tang | Aug 2001 | B1 |
| 6278271 | Schott | Aug 2001 | B1 |
| 6278377 | DeLine et al. | Aug 2001 | B1 |
| 6278941 | Yokoyama | Aug 2001 | B1 |
| 6280068 | Mertens et al. | Aug 2001 | B1 |
| 6280069 | Pastrick et al. | Aug 2001 | B1 |
| 6281804 | Haller et al. | Aug 2001 | B1 |
| 6286965 | Caskey et al. | Sep 2001 | B1 |
| 6286984 | Berg | Sep 2001 | B1 |
| 6289332 | Menig et al. | Sep 2001 | B2 |
| 6290378 | Buchalla et al. | Sep 2001 | B1 |
| 6291906 | Marcus et al. | Sep 2001 | B1 |
| 6294989 | Schofield et al. | Sep 2001 | B1 |
| 6296379 | Pastrick | Oct 2001 | B1 |
| 6297781 | Turnbull et al. | Oct 2001 | B1 |
| 6299333 | Pastrick et al. | Oct 2001 | B1 |
| 6300879 | Regan et al. | Oct 2001 | B1 |
| 6301039 | Tench | Oct 2001 | B1 |
| 6304173 | Pala et al. | Oct 2001 | B2 |
| 6305807 | Schierbeek | Oct 2001 | B1 |
| 6310611 | Caldwell | Oct 2001 | B1 |
| 6310714 | Lomprey et al. | Oct 2001 | B1 |
| 6310738 | Chu | Oct 2001 | B1 |
| 6313454 | Bos et al. | Nov 2001 | B1 |
| 6314295 | Kawamoto | Nov 2001 | B1 |
| 6317057 | Lee | Nov 2001 | B1 |
| 6317248 | Agrawal et al. | Nov 2001 | B1 |
| 6318870 | Spooner et al. | Nov 2001 | B1 |
| 6320176 | Schofield et al. | Nov 2001 | B1 |
| 6320282 | Caldwell | Nov 2001 | B1 |
| 6320612 | Young | Nov 2001 | B1 |
| 6324295 | Valery et al. | Nov 2001 | B1 |
| 6326613 | Heslin et al. | Dec 2001 | B1 |
| 6326900 | DeLine et al. | Dec 2001 | B2 |
| 6329925 | Skiver et al. | Dec 2001 | B1 |
| 6330511 | Ogura et al. | Dec 2001 | B2 |
| 6331066 | Desmond et al. | Dec 2001 | B1 |
| 6333759 | Mazzilli | Dec 2001 | B1 |
| 6335680 | Matsuoka | Jan 2002 | B1 |
| 6336737 | Thau | Jan 2002 | B1 |
| 6340849 | Kramer et al. | Jan 2002 | B1 |
| 6340850 | O'Farrell et al. | Jan 2002 | B2 |
| 6341523 | Lynam | Jan 2002 | B2 |
| 6344805 | Yasui et al. | Feb 2002 | B1 |
| 6346698 | Turnbull | Feb 2002 | B1 |
| 6347880 | Fürst et al. | Feb 2002 | B1 |
| 6348858 | Weis et al. | Feb 2002 | B2 |
| 6351708 | Takagi et al. | Feb 2002 | B1 |
| 6353392 | Schofield et al. | Mar 2002 | B1 |
| 6356206 | Takenaga et al. | Mar 2002 | B1 |
| 6356376 | Tonar et al. | Mar 2002 | B1 |
| 6356389 | Nilsen et al. | Mar 2002 | B1 |
| 6357883 | Strumolo et al. | Mar 2002 | B1 |
| 6362548 | Bingle et al. | Mar 2002 | B1 |
| 6363326 | Scully | Mar 2002 | B1 |
| 6366213 | DeLine et al. | Apr 2002 | B2 |
| 6370329 | Teuchert | Apr 2002 | B1 |
| 6371636 | Wesson | Apr 2002 | B1 |
| 6379013 | Bechtel et al. | Apr 2002 | B1 |
| 6386742 | DeLine et al. | May 2002 | B1 |
| 6390529 | Bingle et al. | May 2002 | B1 |
| 6390635 | Whitehead et al. | May 2002 | B2 |
| 6396397 | Bos et al. | May 2002 | B1 |
| 6396637 | Roest et al. | May 2002 | B2 |
| 6407468 | LeVesque et al. | Jun 2002 | B1 |
| 6407847 | Poll et al. | Jun 2002 | B1 |
| 6408247 | Ichikawa et al. | Jun 2002 | B1 |
| 6411204 | Bloomfield et al. | Jun 2002 | B1 |
| 6412959 | Tseng | Jul 2002 | B1 |
| 6412973 | Bos et al. | Jul 2002 | B1 |
| 6415230 | Maruko et al. | Jul 2002 | B1 |
| 6416208 | Pastrick et al. | Jul 2002 | B2 |
| 6417786 | Learman et al. | Jul 2002 | B2 |
| 6418376 | Olson | Jul 2002 | B1 |
| 6419300 | Pavao et al. | Jul 2002 | B1 |
| 6420036 | Varaprasad et al. | Jul 2002 | B1 |
| 6420800 | LeVesque et al. | Jul 2002 | B1 |
| 6420975 | DeLine et al. | Jul 2002 | B1 |
| 6421081 | Markus | Jul 2002 | B1 |
| 6424272 | Gutta et al. | Jul 2002 | B1 |
| 6424273 | Gutta et al. | Jul 2002 | B1 |
| 6424892 | Matsuoka | Jul 2002 | B1 |
| 6426492 | Bos et al. | Jul 2002 | B1 |
| 6426568 | Turnbull et al. | Jul 2002 | B2 |
| 6427349 | Blank et al. | Aug 2002 | B1 |
| 6428172 | Hutzel et al. | Aug 2002 | B1 |
| 6433676 | DeLine et al. | Aug 2002 | B2 |
| 6433680 | Ho | Aug 2002 | B1 |
| 6433914 | Lomprey et al. | Aug 2002 | B1 |
| 6437688 | Kobayashi | Aug 2002 | B1 |
| 6438491 | Farmer | Aug 2002 | B1 |
| 6439755 | Fant, Jr. et al. | Aug 2002 | B1 |
| 6441872 | Ho | Aug 2002 | B1 |
| 6441943 | Roberts et al. | Aug 2002 | B1 |
| 6441963 | Murakami et al. | Aug 2002 | B2 |
| 6441964 | Chu et al. | Aug 2002 | B1 |
| 6445287 | Schofield et al. | Sep 2002 | B1 |
| 6447128 | Lang et al. | Sep 2002 | B1 |
| 6449082 | Agrawal et al. | Sep 2002 | B1 |
| 6452533 | Yamabuchi et al. | Sep 2002 | B1 |
| 6463369 | Sadano et al. | Oct 2002 | B2 |
| 6466701 | Ejiri et al. | Oct 2002 | B1 |
| 6471362 | Carter et al. | Oct 2002 | B1 |
| 6472977 | Pöchmüller | Oct 2002 | B1 |
| 6473001 | Blum | Oct 2002 | B1 |
| 6474853 | Pastrick et al. | Nov 2002 | B2 |
| 6476731 | Miki et al. | Nov 2002 | B1 |
| 6477460 | Kepler | Nov 2002 | B2 |
| 6477464 | McCarthy et al. | Nov 2002 | B2 |
| 6483429 | Yasui et al. | Nov 2002 | B1 |
| 6483438 | DeLine et al. | Nov 2002 | B2 |
| 6487500 | Lemelson et al. | Nov 2002 | B2 |
| 6494602 | Pastrick et al. | Dec 2002 | B2 |
| 6498620 | Schofield et al. | Dec 2002 | B2 |
| 6501387 | Skiver et al. | Dec 2002 | B2 |
| 6512203 | Jones et al. | Jan 2003 | B2 |
| 6512624 | Tonar et al. | Jan 2003 | B2 |
| 6513252 | Schierbeek et al. | Feb 2003 | B1 |
| 6515581 | Ho | Feb 2003 | B1 |
| 6515582 | Teowee | Feb 2003 | B1 |
| 6515597 | Wada et al. | Feb 2003 | B1 |
| 6516664 | Lynam | Feb 2003 | B2 |
| 6520667 | Mousseau | Feb 2003 | B1 |
| 6522451 | Lynam | Feb 2003 | B1 |
| 6522969 | Kannonji | Feb 2003 | B2 |
| 6534884 | Marcus et al. | Mar 2003 | B2 |
| 6539306 | Turnbull et al. | Mar 2003 | B2 |
| 6542085 | Yang | Apr 2003 | B1 |
| 6542182 | Chautorash | Apr 2003 | B1 |
| 6543163 | Ginsberg | Apr 2003 | B1 |
| 6545598 | de Villeroche | Apr 2003 | B1 |
| 6549253 | Robbie et al. | Apr 2003 | B1 |
| 6549335 | Trapani et al. | Apr 2003 | B1 |
| 6550949 | Bauer et al. | Apr 2003 | B1 |
| 6553308 | Uhlmann et al. | Apr 2003 | B1 |
| 6560004 | Theiste et al. | May 2003 | B2 |
| 6560027 | Meine | May 2003 | B2 |
| 6568839 | Pastrick et al. | May 2003 | B1 |
| 6572233 | Northman et al. | Jun 2003 | B1 |
| 6575643 | Takahashi | Jun 2003 | B2 |
| 6580373 | Ohashi | Jun 2003 | B1 |
| 6581007 | Hasegawa et al. | Jun 2003 | B2 |
| 6583730 | Lang et al. | Jun 2003 | B2 |
| 6591192 | Okamura et al. | Jul 2003 | B2 |
| 6592230 | Dupay | Jul 2003 | B2 |
| 6593565 | Heslin et al. | Jul 2003 | B2 |
| 6593984 | Arakawa et al. | Jul 2003 | B2 |
| 6594065 | Byker et al. | Jul 2003 | B2 |
| 6594067 | Poll et al. | Jul 2003 | B2 |
| 6594090 | Kruschwitz et al. | Jul 2003 | B2 |
| 6594583 | Ogura et al. | Jul 2003 | B2 |
| 6594614 | Studt et al. | Jul 2003 | B2 |
| 6595649 | Hoekstra et al. | Jul 2003 | B2 |
| 6597489 | Guarr et al. | Jul 2003 | B1 |
| 6606183 | Ikai et al. | Aug 2003 | B2 |
| 6611202 | Schofield et al. | Aug 2003 | B2 |
| 6611227 | Nebiyeloul-Kifle et al. | Aug 2003 | B1 |
| 6611759 | Brosche | Aug 2003 | B2 |
| 6614387 | Deadman | Sep 2003 | B1 |
| 6614579 | Roberts et al. | Sep 2003 | B2 |
| 6615438 | Franco et al. | Sep 2003 | B1 |
| 6616313 | Fürst et al. | Sep 2003 | B2 |
| 6616764 | Krämer et al. | Sep 2003 | B2 |
| 6618672 | Sasaki et al. | Sep 2003 | B2 |
| 6621616 | Bauer et al. | Sep 2003 | B1 |
| 6624936 | Kotchick et al. | Sep 2003 | B2 |
| 6627918 | Getz et al. | Sep 2003 | B2 |
| 6630888 | Lang et al. | Oct 2003 | B2 |
| 6636258 | Strumolo | Oct 2003 | B2 |
| 6638582 | Uchiyama et al. | Oct 2003 | B1 |
| 6639360 | Roberts et al. | Oct 2003 | B2 |
| 6642840 | Lang et al. | Nov 2003 | B2 |
| 6642851 | DeLine et al. | Nov 2003 | B2 |
| 6648477 | Hutzel et al. | Nov 2003 | B2 |
| 6650457 | Busscher et al. | Nov 2003 | B2 |
| 6657708 | Drevillon et al. | Dec 2003 | B1 |
| 6661830 | Reed et al. | Dec 2003 | B1 |
| 6665592 | Kodama | Dec 2003 | B2 |
| 6669109 | Ivanov et al. | Dec 2003 | B2 |
| 6670207 | Roberts | Dec 2003 | B1 |
| 6670910 | Delcheccolo et al. | Dec 2003 | B2 |
| 6671080 | Poll et al. | Dec 2003 | B2 |
| 6672731 | Schnell et al. | Jan 2004 | B2 |
| 6672734 | Lammers | Jan 2004 | B2 |
| 6672744 | DeLine et al. | Jan 2004 | B2 |
| 6672745 | Bauer et al. | Jan 2004 | B1 |
| 6674370 | Rodewald et al. | Jan 2004 | B2 |
| 6675075 | Engelsburg et al. | Jan 2004 | B1 |
| 6678083 | Anstee | Jan 2004 | B1 |
| 6678614 | McCarthy et al. | Jan 2004 | B2 |
| 6679608 | Bechtel et al. | Jan 2004 | B2 |
| 6683539 | Trajkovic et al. | Jan 2004 | B2 |
| 6683969 | Nishigaki et al. | Jan 2004 | B1 |
| 6685348 | Pastrick et al. | Feb 2004 | B2 |
| 6690268 | Schofield et al. | Feb 2004 | B2 |
| 6690413 | Moore | Feb 2004 | B1 |
| 6693517 | McCarthy et al. | Feb 2004 | B2 |
| 6693518 | Kumata et al. | Feb 2004 | B2 |
| 6693519 | Keirstead | Feb 2004 | B2 |
| 6693524 | Payne | Feb 2004 | B1 |
| 6700692 | Tonar et al. | Mar 2004 | B2 |
| 6709136 | Pastrick et al. | Mar 2004 | B2 |
| 6713783 | Mase et al. | Mar 2004 | B1 |
| 6717610 | Bos et al. | Apr 2004 | B1 |
| 6717712 | Lynam et al. | Apr 2004 | B2 |
| 6719215 | Drouillard | Apr 2004 | B2 |
| 6726337 | Whitehead et al. | Apr 2004 | B2 |
| 6727808 | Uselmann et al. | Apr 2004 | B1 |
| 6727844 | Zimmermann et al. | Apr 2004 | B1 |
| 6731332 | Yasui et al. | May 2004 | B1 |
| 6734807 | King | May 2004 | B2 |
| 6736526 | Matsuba et al. | May 2004 | B2 |
| 6737629 | Nixon et al. | May 2004 | B2 |
| 6737964 | Samman et al. | May 2004 | B2 |
| 6738088 | Uskolovsky et al. | May 2004 | B1 |
| 6742904 | Bechtel et al. | Jun 2004 | B2 |
| 6744353 | Sjönell | Jun 2004 | B2 |
| 6748211 | Isaac et al. | Jun 2004 | B1 |
| 6749308 | Niendorf et al. | Jun 2004 | B1 |
| 6755542 | Bechtel et al. | Jun 2004 | B2 |
| 6756912 | Skiver et al. | Jun 2004 | B2 |
| 6757109 | Bos | Jun 2004 | B2 |
| D493131 | Lawlor et al. | Jul 2004 | S |
| D493394 | Lawlor et al. | Jul 2004 | S |
| 6759113 | Tang | Jul 2004 | B1 |
| 6759945 | Richard | Jul 2004 | B2 |
| 6760157 | Allen et al. | Jul 2004 | B1 |
| 6774356 | Heslin et al. | Aug 2004 | B2 |
| 6774810 | DeLine et al. | Aug 2004 | B2 |
| 6778904 | Iwami et al. | Aug 2004 | B2 |
| 6784129 | Seto et al. | Aug 2004 | B2 |
| 6797396 | Liu et al. | Sep 2004 | B1 |
| 6800871 | Matsuda et al. | Oct 2004 | B2 |
| 6801283 | Koyama et al. | Oct 2004 | B2 |
| 6805474 | Walser et al. | Oct 2004 | B2 |
| 6806452 | Bos et al. | Oct 2004 | B2 |
| 6810323 | Bullock et al. | Oct 2004 | B1 |
| 6824281 | Schofield et al. | Nov 2004 | B2 |
| 6831268 | Bechtel et al. | Dec 2004 | B2 |
| 6832848 | Pastrick | Dec 2004 | B2 |
| 6836725 | Millington et al. | Dec 2004 | B2 |
| 6842276 | Poll et al. | Jan 2005 | B2 |
| 6846098 | Bourdelais et al. | Jan 2005 | B2 |
| 6847487 | Burgner | Jan 2005 | B2 |
| 6848817 | Bos et al. | Feb 2005 | B2 |
| 6849165 | Kloppel et al. | Feb 2005 | B2 |
| 6853491 | Ruhle et al. | Feb 2005 | B1 |
| 6870655 | Northman et al. | Mar 2005 | B1 |
| 6870656 | Tonar et al. | Mar 2005 | B2 |
| 6871982 | Holman et al. | Mar 2005 | B2 |
| 6877888 | DeLine et al. | Apr 2005 | B2 |
| 6882287 | Schofield | Apr 2005 | B2 |
| 6891563 | Schofield et al. | May 2005 | B2 |
| 6902284 | Hutzel et al. | Jun 2005 | B2 |
| 6906632 | DeLine et al. | Jun 2005 | B2 |
| 6910779 | Abel et al. | Jun 2005 | B2 |
| 6912396 | Sziraki et al. | Jun 2005 | B2 |
| 6916099 | Su et al. | Jul 2005 | B2 |
| 6922902 | Schierbeek et al. | Aug 2005 | B2 |
| 6928180 | Stam et al. | Aug 2005 | B2 |
| 6928366 | Ockerse et al. | Aug 2005 | B2 |
| 6930737 | Weindorf et al. | Aug 2005 | B2 |
| 6934067 | Ash et al. | Aug 2005 | B2 |
| 6946978 | Schofield | Sep 2005 | B2 |
| 6947576 | Stam et al. | Sep 2005 | B2 |
| 6947577 | Stam et al. | Sep 2005 | B2 |
| 6951410 | Parsons | Oct 2005 | B2 |
| 6951681 | Hartley et al. | Oct 2005 | B2 |
| 6952312 | Weber et al. | Oct 2005 | B2 |
| 6958495 | Nishijima et al. | Oct 2005 | B2 |
| 6958683 | Mills et al. | Oct 2005 | B2 |
| 6968273 | Ockerse et al. | Nov 2005 | B2 |
| 6972888 | Poll et al. | Dec 2005 | B2 |
| 6974236 | Tenmyo | Dec 2005 | B2 |
| 6975215 | Schofield et al. | Dec 2005 | B2 |
| 6977702 | Wu | Dec 2005 | B2 |
| 6980092 | Turnbull et al. | Dec 2005 | B2 |
| 6985291 | Watson et al. | Jan 2006 | B2 |
| 6992718 | Takahara | Jan 2006 | B1 |
| 7001058 | Inditsky | Feb 2006 | B2 |
| 7004592 | Varaprasad et al. | Feb 2006 | B2 |
| 7004593 | Weller et al. | Feb 2006 | B2 |
| 7006173 | Hiyama et al. | Feb 2006 | B1 |
| 7009751 | Tonar et al. | Mar 2006 | B2 |
| 7012543 | DeLine et al. | Mar 2006 | B2 |
| 7041965 | Heslin et al. | May 2006 | B2 |
| 7042616 | Tonar et al. | May 2006 | B2 |
| 7046418 | Lin et al. | May 2006 | B2 |
| 7046448 | Burgner | May 2006 | B2 |
| 7057681 | Hinata et al. | Jun 2006 | B2 |
| 7064882 | Tonar et al. | Jun 2006 | B2 |
| 7092052 | Okamoto et al. | Aug 2006 | B2 |
| 7106213 | White | Sep 2006 | B2 |
| 7106392 | You | Sep 2006 | B2 |
| 7108409 | DeLine et al. | Sep 2006 | B2 |
| 7121028 | Shoen et al. | Oct 2006 | B2 |
| 7125131 | Olczak | Oct 2006 | B2 |
| 7130727 | Liu et al. | Oct 2006 | B2 |
| 7132064 | Li et al. | Nov 2006 | B2 |
| 7136091 | Ichikawa et al. | Nov 2006 | B2 |
| 7149613 | Stam et al. | Dec 2006 | B2 |
| 7151515 | Kim et al. | Dec 2006 | B2 |
| 7151997 | Uhlmann et al. | Dec 2006 | B2 |
| 7154657 | Poll et al. | Dec 2006 | B2 |
| 7158881 | McCarthy et al. | Jan 2007 | B2 |
| 7160017 | Lee et al. | Jan 2007 | B2 |
| 7167796 | Taylor et al. | Jan 2007 | B2 |
| 7175291 | Li | Feb 2007 | B1 |
| 7176790 | Yamazaki | Feb 2007 | B2 |
| 7184190 | McCabe et al. | Feb 2007 | B2 |
| 7188963 | Schofield et al. | Mar 2007 | B2 |
| 7193764 | Lin et al. | Mar 2007 | B2 |
| 7195381 | Lynam et al. | Mar 2007 | B2 |
| 7199767 | Spero | Apr 2007 | B2 |
| 7209277 | Tonar et al. | Apr 2007 | B2 |
| 7215473 | Fleming | May 2007 | B2 |
| 7233304 | Aratani et al. | Jun 2007 | B1 |
| 7241037 | Mathieu et al. | Jul 2007 | B2 |
| 7245336 | Hiyama et al. | Jul 2007 | B2 |
| 7248305 | Ootsuta et al. | Jul 2007 | B2 |
| 7251079 | Capaldo et al. | Jul 2007 | B2 |
| 7255451 | McCabe et al. | Aug 2007 | B2 |
| 7255465 | DeLine et al. | Aug 2007 | B2 |
| 7262406 | Heslin et al. | Aug 2007 | B2 |
| 7262916 | Kao et al. | Aug 2007 | B2 |
| 7265342 | Heslin et al. | Sep 2007 | B2 |
| 7268841 | Kasajima et al. | Sep 2007 | B2 |
| 7269327 | Tang | Sep 2007 | B2 |
| 7269328 | Tang | Sep 2007 | B2 |
| 7274501 | McCabe et al. | Sep 2007 | B2 |
| 7286280 | Whitehead et al. | Oct 2007 | B2 |
| 7287868 | Carter et al. | Oct 2007 | B2 |
| 7289037 | Uken et al. | Oct 2007 | B2 |
| 7290919 | Pan et al. | Nov 2007 | B2 |
| 7292208 | Park et al. | Nov 2007 | B1 |
| 7308341 | Schofield et al. | Dec 2007 | B2 |
| 7310177 | McCabe et al. | Dec 2007 | B2 |
| 7311428 | DeLine et al. | Dec 2007 | B2 |
| 7323819 | Hong et al. | Jan 2008 | B2 |
| 7324261 | Tonar et al. | Jan 2008 | B2 |
| 7328103 | McCarthy et al. | Feb 2008 | B2 |
| 7329013 | Blank et al. | Feb 2008 | B2 |
| 7329850 | Drummond et al. | Feb 2008 | B2 |
| 7338177 | Lynam | Mar 2008 | B2 |
| 7344284 | Lynam et al. | Mar 2008 | B2 |
| 7349143 | Tonar et al. | Mar 2008 | B2 |
| 7362505 | Hikmet et al. | Apr 2008 | B2 |
| 7370983 | DeWind et al. | May 2008 | B2 |
| 7372611 | Tonar et al. | May 2008 | B2 |
| 7375895 | Brynielsson | May 2008 | B2 |
| 7379224 | Tonar et al. | May 2008 | B2 |
| 7379225 | Tonar et al. | May 2008 | B2 |
| 7379243 | Horsten et al. | May 2008 | B2 |
| 7389171 | Rupp | Jun 2008 | B2 |
| 7396147 | Munro | Jul 2008 | B2 |
| 7411732 | Kao et al. | Aug 2008 | B2 |
| 7412328 | Uhlmann et al. | Aug 2008 | B2 |
| 7417781 | Tonar et al. | Aug 2008 | B2 |
| 7420159 | Heslin et al. | Sep 2008 | B2 |
| 7446462 | Lim et al. | Nov 2008 | B2 |
| 7446650 | Schofield et al. | Nov 2008 | B2 |
| 7448776 | Tang | Nov 2008 | B2 |
| 7452090 | Weller et al. | Nov 2008 | B2 |
| 7453057 | Drummond et al. | Nov 2008 | B2 |
| 7455412 | Rottcher | Nov 2008 | B2 |
| 7467883 | DeLine et al. | Dec 2008 | B2 |
| 7468651 | DeLine et al. | Dec 2008 | B2 |
| 7471438 | McCabe et al. | Dec 2008 | B2 |
| 7477439 | Tonar et al. | Jan 2009 | B2 |
| 7480149 | DeWard et al. | Jan 2009 | B2 |
| 7488080 | Skiver et al. | Feb 2009 | B2 |
| 7490007 | Taylor et al. | Feb 2009 | B2 |
| 7490943 | Kikuchi et al. | Feb 2009 | B2 |
| 7490944 | Blank et al. | Feb 2009 | B2 |
| 7494231 | Varaprasad et al. | Feb 2009 | B2 |
| 7496439 | McCormick | Feb 2009 | B2 |
| 7502156 | Tonar et al. | Mar 2009 | B2 |
| 7505188 | Niiyama et al. | Mar 2009 | B2 |
| 7511607 | Hubbard et al. | Mar 2009 | B2 |
| 7511872 | Tonar et al. | Mar 2009 | B2 |
| 7525715 | McCabe et al. | Apr 2009 | B2 |
| 7526103 | Schofield et al. | Apr 2009 | B2 |
| 7538316 | Heslin et al. | May 2009 | B2 |
| 7540620 | Weller et al. | Jun 2009 | B2 |
| 7543947 | Varaprasad et al. | Jun 2009 | B2 |
| 7547467 | Olson et al. | Jun 2009 | B2 |
| 7551354 | Horsten et al. | Jun 2009 | B2 |
| 7571042 | Taylor et al. | Aug 2009 | B2 |
| 7572490 | Park et al. | Aug 2009 | B2 |
| 7579939 | Schofield et al. | Aug 2009 | B2 |
| 7579940 | Schofield et al. | Aug 2009 | B2 |
| 7580795 | McCarthy et al. | Aug 2009 | B2 |
| 7581867 | Lee et al. | Sep 2009 | B2 |
| 7583184 | Schofield et al. | Sep 2009 | B2 |
| 7586566 | Nelson et al. | Sep 2009 | B2 |
| 7586666 | McCabe et al. | Sep 2009 | B2 |
| 7589893 | Rottcher | Sep 2009 | B2 |
| 7600878 | Blank et al. | Oct 2009 | B2 |
| 7612929 | Tonar et al. | Nov 2009 | B2 |
| 7619508 | Lynam et al. | Nov 2009 | B2 |
| 7623202 | Araki et al. | Nov 2009 | B2 |
| 7626749 | Baur et al. | Dec 2009 | B2 |
| 7633567 | Yamada et al. | Dec 2009 | B2 |
| 7636195 | Nieuwkerk et al. | Dec 2009 | B2 |
| 7636930 | Chang | Dec 2009 | B2 |
| 7643927 | Hils | Jan 2010 | B2 |
| 7651228 | Skiver et al. | Jan 2010 | B2 |
| 7658521 | DeLine et al. | Feb 2010 | B2 |
| 7667579 | DeLine et al. | Feb 2010 | B2 |
| 7670016 | Weller et al. | Mar 2010 | B2 |
| 7695174 | Takayanagi et al. | Apr 2010 | B2 |
| 7706046 | Bauer et al. | Apr 2010 | B2 |
| 7710631 | McCabe et al. | May 2010 | B2 |
| 7711479 | Taylor et al. | May 2010 | B2 |
| 7726822 | Blank et al. | Jun 2010 | B2 |
| 7728276 | Drummond et al. | Jun 2010 | B2 |
| 7746534 | Tonar et al. | Jun 2010 | B2 |
| 20010019356 | Takeda et al. | Sep 2001 | A1 |
| 20010022616 | Rademacher et al. | Sep 2001 | A1 |
| 20010026215 | Nakaho et al. | Oct 2001 | A1 |
| 20010026316 | Senatore | Oct 2001 | A1 |
| 20010030857 | Futhey et al. | Oct 2001 | A1 |
| 20010045981 | Gloger et al. | Nov 2001 | A1 |
| 20020003571 | Schofield et al. | Jan 2002 | A1 |
| 20020036828 | Wong | Mar 2002 | A1 |
| 20020044065 | Quist et al. | Apr 2002 | A1 |
| 20020049535 | Rigo et al. | Apr 2002 | A1 |
| 20020072026 | Lynam et al. | Jun 2002 | A1 |
| 20020085155 | Arikawa | Jul 2002 | A1 |
| 20020093826 | Bos et al. | Jul 2002 | A1 |
| 20020113203 | Heslin et al. | Aug 2002 | A1 |
| 20020126497 | Pastrick | Sep 2002 | A1 |
| 20020154007 | Yang | Oct 2002 | A1 |
| 20020154379 | Tonar et al. | Oct 2002 | A1 |
| 20020159270 | Lynam et al. | Oct 2002 | A1 |
| 20020171906 | Busscher et al. | Nov 2002 | A1 |
| 20020172053 | Pastrick et al. | Nov 2002 | A1 |
| 20020191409 | DeLine et al. | Dec 2002 | A1 |
| 20020196639 | Weidel | Dec 2002 | A1 |
| 20030002165 | Mathias et al. | Jan 2003 | A1 |
| 20030002179 | Roberts et al. | Jan 2003 | A1 |
| 20030007261 | Hutzel et al. | Jan 2003 | A1 |
| 20030016125 | Lang et al. | Jan 2003 | A1 |
| 20030016287 | Nakayama et al. | Jan 2003 | A1 |
| 20030016542 | Pastrick et al. | Jan 2003 | A1 |
| 20030020603 | DeLine et al. | Jan 2003 | A1 |
| 20030025596 | Lang et al. | Feb 2003 | A1 |
| 20030025597 | Schofield | Feb 2003 | A1 |
| 20030030546 | Tseng | Feb 2003 | A1 |
| 20030030551 | Ho | Feb 2003 | A1 |
| 20030030724 | Okamoto | Feb 2003 | A1 |
| 20030035050 | Mizusawa et al. | Feb 2003 | A1 |
| 20030043269 | Park | Mar 2003 | A1 |
| 20030043589 | Blank | Mar 2003 | A1 |
| 20030048639 | Boyd et al. | Mar 2003 | A1 |
| 20030052969 | Satoh et al. | Mar 2003 | A1 |
| 20030058338 | Kawauchi et al. | Mar 2003 | A1 |
| 20030067383 | Yang | Apr 2003 | A1 |
| 20030069690 | Correia et al. | Apr 2003 | A1 |
| 20030076415 | Strumbolo | Apr 2003 | A1 |
| 20030080877 | Takagi et al. | May 2003 | A1 |
| 20030085806 | Samman et al. | May 2003 | A1 |
| 20030088361 | Sekiguchi | May 2003 | A1 |
| 20030090568 | Pico | May 2003 | A1 |
| 20030090569 | Poechmueller | May 2003 | A1 |
| 20030090570 | Takagi et al. | May 2003 | A1 |
| 20030095331 | Bengoechea et al. | May 2003 | A1 |
| 20030098908 | Misaiji et al. | May 2003 | A1 |
| 20030101749 | Lingle et al. | Jun 2003 | A1 |
| 20030103141 | Bechtel et al. | Jun 2003 | A1 |
| 20030103142 | Hitomi et al. | Jun 2003 | A1 |
| 20030117522 | Okada | Jun 2003 | A1 |
| 20030122929 | Minuado et al. | Jul 2003 | A1 |
| 20030122930 | Schofield et al. | Jul 2003 | A1 |
| 20030133014 | Mendoza | Jul 2003 | A1 |
| 20030137586 | Lewellen | Jul 2003 | A1 |
| 20030141965 | Gunderson et al. | Jul 2003 | A1 |
| 20030146831 | Berberich et al. | Aug 2003 | A1 |
| 20030147244 | Tenmyo | Aug 2003 | A1 |
| 20030169158 | Paul, Jr. | Sep 2003 | A1 |
| 20030169522 | Schofield et al. | Sep 2003 | A1 |
| 20030179293 | Oizumi | Sep 2003 | A1 |
| 20030189754 | Sugino et al. | Oct 2003 | A1 |
| 20030202096 | Kim | Oct 2003 | A1 |
| 20030210369 | Wu | Nov 2003 | A1 |
| 20030214576 | Koga | Nov 2003 | A1 |
| 20030214584 | Ross, Jr. | Nov 2003 | A1 |
| 20030214733 | Fujikawa et al. | Nov 2003 | A1 |
| 20030222793 | Tanaka et al. | Dec 2003 | A1 |
| 20030222983 | Nobori et al. | Dec 2003 | A1 |
| 20030227546 | Hilborn et al. | Dec 2003 | A1 |
| 20030228416 | Iwamaru | Dec 2003 | A1 |
| 20040004541 | Hong | Jan 2004 | A1 |
| 20040027695 | Lin | Feb 2004 | A1 |
| 20040028955 | Hoffman | Feb 2004 | A1 |
| 20040032321 | McMahon et al. | Feb 2004 | A1 |
| 20040032638 | Tonar et al. | Feb 2004 | A1 |
| 20040032675 | Weller et al. | Feb 2004 | A1 |
| 20040032676 | Drummond et al. | Feb 2004 | A1 |
| 20040036768 | Green | Feb 2004 | A1 |
| 20040046870 | Leigh Travis | Mar 2004 | A1 |
| 20040051634 | Schofield et al. | Mar 2004 | A1 |
| 20040056955 | Berberich et al. | Mar 2004 | A1 |
| 20040057131 | Hutzel et al. | Mar 2004 | A1 |
| 20040061920 | Tonar et al. | Apr 2004 | A1 |
| 20040064241 | Sekiguchi | Apr 2004 | A1 |
| 20040066285 | Sekiguchi | Apr 2004 | A1 |
| 20040075603 | Kodama | Apr 2004 | A1 |
| 20040077359 | Bernas et al. | Apr 2004 | A1 |
| 20040080404 | White | Apr 2004 | A1 |
| 20040080431 | White | Apr 2004 | A1 |
| 20040085196 | Miller et al. | May 2004 | A1 |
| 20040085499 | Baek | May 2004 | A1 |
| 20040090314 | Iwamoto | May 2004 | A1 |
| 20040090317 | Rothkop | May 2004 | A1 |
| 20040095632 | Busscher et al. | May 2004 | A1 |
| 20040096082 | Nakai et al. | May 2004 | A1 |
| 20040098196 | Sekiguchi | May 2004 | A1 |
| 20040105614 | Kobayashi et al. | Jun 2004 | A1 |
| 20040107030 | Nishira et al. | Jun 2004 | A1 |
| 20040107617 | Shoen et al. | Jun 2004 | A1 |
| 20040109060 | Ishii | Jun 2004 | A1 |
| 20040114039 | Ishikura | Jun 2004 | A1 |
| 20040128065 | Taylor et al. | Jul 2004 | A1 |
| 20040145457 | Schofield et al. | Jul 2004 | A1 |
| 20040170008 | Tenmyo | Sep 2004 | A1 |
| 20040202001 | Roberts et al. | Oct 2004 | A1 |
| 20040243303 | Padmanabhan | Dec 2004 | A1 |
| 20040251804 | McCullough et al. | Dec 2004 | A1 |
| 20040264011 | Lynam | Dec 2004 | A1 |
| 20050024591 | Lian et al. | Feb 2005 | A1 |
| 20050024729 | Ockerse et al. | Feb 2005 | A1 |
| 20050078347 | Lin et al. | Apr 2005 | A1 |
| 20050078389 | Kulas et al. | Apr 2005 | A1 |
| 20050079326 | Varaprasad et al. | Apr 2005 | A1 |
| 20050083577 | Varaprasad et al. | Apr 2005 | A1 |
| 20050099559 | Lee et al. | May 2005 | A1 |
| 20050099693 | Schofield et al. | May 2005 | A1 |
| 20050111070 | Lin et al. | May 2005 | A1 |
| 20050134983 | Lynam | Jun 2005 | A1 |
| 20050140855 | Utsumi et al. | Jun 2005 | A1 |
| 20050168995 | Kittelmann et al. | Aug 2005 | A1 |
| 20050169003 | Lindahl et al. | Aug 2005 | A1 |
| 20050172504 | Ohm et al. | Aug 2005 | A1 |
| 20050185278 | Horsten et al. | Aug 2005 | A1 |
| 20050195488 | McCabe et al. | Sep 2005 | A1 |
| 20050237440 | Sugimura et al. | Oct 2005 | A1 |
| 20050264891 | Uken et al. | Dec 2005 | A1 |
| 20050270766 | Kung et al. | Dec 2005 | A1 |
| 20050270798 | Lee et al. | Dec 2005 | A1 |
| 20060007550 | Tonar et al. | Jan 2006 | A1 |
| 20060028730 | Varaprasad et al. | Feb 2006 | A1 |
| 20060038668 | DeWard et al. | Feb 2006 | A1 |
| 20060050018 | Hutzel et al. | Mar 2006 | A1 |
| 20060050356 | Varaprasad et al. | Mar 2006 | A1 |
| 20060061008 | Karner et al. | Mar 2006 | A1 |
| 20060126150 | Tonar et al. | Jun 2006 | A1 |
| 20060139953 | Chou et al. | Jun 2006 | A1 |
| 20060164230 | DeWind et al. | Jul 2006 | A1 |
| 20060164725 | Horsten et al. | Jul 2006 | A1 |
| 20060202111 | Heslin et al. | Sep 2006 | A1 |
| 20060255960 | Uken et al. | Nov 2006 | A1 |
| 20060274218 | Xue | Dec 2006 | A1 |
| 20070041096 | Nieuwkerk et al. | Feb 2007 | A1 |
| 20070058257 | Lynam | Mar 2007 | A1 |
| 20070080585 | Lyu | Apr 2007 | A1 |
| 20070118287 | Taylor et al. | May 2007 | A1 |
| 20070120043 | Heslin et al. | May 2007 | A1 |
| 20070132567 | Schofield et al. | Jun 2007 | A1 |
| 20070162229 | McCarthy et al. | Jul 2007 | A1 |
| 20070171037 | Schofield et al. | Jul 2007 | A1 |
| 20070183066 | Varaprasad et al. | Aug 2007 | A1 |
| 20070184284 | Varaprasad et al. | Aug 2007 | A1 |
| 20070201122 | Dozeman et al. | Aug 2007 | A1 |
| 20070206263 | Neuman et al. | Sep 2007 | A1 |
| 20080002106 | Van De Witte et al. | Jan 2008 | A1 |
| 20080013153 | McCabe et al. | Jan 2008 | A1 |
| 20080030836 | Tonar et al. | Feb 2008 | A1 |
| 20080068520 | Minikey, Jr. et al. | Mar 2008 | A1 |
| 20080094684 | Varaprasad et al. | Apr 2008 | A1 |
| 20080094685 | Varaprasad et al. | Apr 2008 | A1 |
| 20080180529 | Taylor et al. | Jul 2008 | A1 |
| 20080180781 | Varaprasad et al. | Jul 2008 | A1 |
| 20080183355 | Taylor et al. | Jul 2008 | A1 |
| 20080201075 | Taylor et al. | Aug 2008 | A1 |
| 20080212189 | Baur et al. | Sep 2008 | A1 |
| 20080212215 | Schofield et al. | Sep 2008 | A1 |
| 20080225538 | Lynam et al. | Sep 2008 | A1 |
| 20080266389 | DeWind et al. | Oct 2008 | A1 |
| 20080291522 | Varaprasad et al. | Nov 2008 | A1 |
| 20080302657 | Luten et al. | Dec 2008 | A1 |
| 20080308219 | Lynam | Dec 2008 | A1 |
| 20080310005 | Tonar et al. | Dec 2008 | A1 |
| 20090015736 | Weller et al. | Jan 2009 | A1 |
| 20090033837 | Molsen et al. | Feb 2009 | A1 |
| 20090040465 | Conner et al. | Feb 2009 | A1 |
| 20090040588 | Tonar et al. | Feb 2009 | A1 |
| 20090040778 | Takayanagi et al. | Feb 2009 | A1 |
| 20090052003 | Schofield et al. | Feb 2009 | A1 |
| 20090080055 | Baur et al. | Mar 2009 | A1 |
| 20090141331 | Skiver et al. | Jun 2009 | A1 |
| 20090174776 | Taylor et al. | Jul 2009 | A1 |
| 20090201137 | Weller et al. | Aug 2009 | A1 |
| 20090207513 | Luten et al. | Aug 2009 | A1 |
| 20090207514 | Mccabe et al. | Aug 2009 | A1 |
| 20090219394 | Heslin et al. | Sep 2009 | A1 |
| 20090231741 | Weller et al. | Sep 2009 | A1 |
| 20090243824 | Hook et al. | Oct 2009 | A1 |
| 20090262422 | Cross et al. | Oct 2009 | A1 |
| 20100085645 | Skiver et al. | Apr 2010 | A1 |
| 20100091509 | DeLine et al. | Apr 2010 | A1 |
| Number | Date | Country |
|---|---|---|
| A-4031795 | Feb 1995 | AU |
| 2028461 | Nov 1994 | CA |
| 941408 | Apr 1956 | DE |
| 944531 | Jul 1956 | DE |
| 7323996 | Nov 1973 | DE |
| 2631713 | Feb 1977 | DE |
| 3248511 | Jul 1984 | DE |
| 3301945 | Jul 1984 | DE |
| 3614882 | Nov 1987 | DE |
| 9306989.8 | Jul 1993 | DE |
| 4329983 | Aug 1995 | DE |
| 4415885 | Nov 1995 | DE |
| 4444443 | Jun 1996 | DE |
| 9321263 | Jan 1997 | DE |
| 29703084 | Jun 1997 | DE |
| 29805142 | May 1998 | DE |
| 19755008 | Jul 1999 | DE |
| 29902344 | Jul 1999 | DE |
| 0165817 | Dec 1985 | EP |
| 0202460 | Nov 1986 | EP |
| 0240226 | Oct 1987 | EP |
| 0254435 | Jan 1988 | EP |
| 0299509 | Jan 1989 | EP |
| 0356099 | Feb 1990 | EP |
| 0450162 | Dec 1990 | EP |
| 0450553 | Oct 1991 | EP |
| 0513476 | Nov 1992 | EP |
| 0531143 | Mar 1993 | EP |
| 0605045 | Jul 1994 | EP |
| 0615882 | Sep 1994 | EP |
| 0667254 | Aug 1995 | EP |
| 0729864 | Dec 1995 | EP |
| 0728618 | Aug 1996 | EP |
| 0769419 | Apr 1997 | EP |
| 0788947 | Aug 1997 | EP |
| 0830267 | Mar 1998 | EP |
| 937601 | Aug 1999 | EP |
| 1097848 | May 2001 | EP |
| 1152285 | Nov 2001 | EP |
| 1376207 | Jan 2004 | EP |
| 0899157 | Oct 2004 | EP |
| 2008869 | Dec 2008 | EP |
| 1021987 | Feb 1953 | FR |
| 1461419 | Dec 1966 | FR |
| 2585991 | Feb 1987 | FR |
| 2672857 | Aug 1992 | FR |
| 2673499 | Sep 1992 | FR |
| 2759045 | Aug 1998 | FR |
| 810010 | Mar 1959 | GB |
| 934037 | Aug 1963 | GB |
| 1008411 | Oct 1965 | GB |
| 1136134 | Dec 1968 | GB |
| 1553376 | Sep 1979 | GB |
| 1566451 | Apr 1980 | GB |
| 2137573 | Oct 1984 | GB |
| 2161440 | Jan 1986 | GB |
| 2192370 | Jan 1988 | GB |
| 2 210 836 | Jun 1989 | GB |
| 2222991 | Mar 1990 | GB |
| 2255539 | Nov 1992 | GB |
| 2292857 | Mar 1996 | GB |
| 2297632 | Aug 1996 | GB |
| 2351055 | Dec 2000 | GB |
| 970014 | Jul 1998 | IE |
| 50000638 | Jan 1975 | JP |
| 55039843 | Mar 1980 | JP |
| 5730639 | Feb 1982 | JP |
| 57208530 | Dec 1982 | JP |
| 5830729 | Feb 1983 | JP |
| 58110334 | Jun 1983 | JP |
| 58180347 | Oct 1983 | JP |
| 58209635 | Dec 1983 | JP |
| 59114139 | Jul 1984 | JP |
| 60212730 | Oct 1985 | JP |
| 60261275 | Dec 1985 | JP |
| 61260217 | Nov 1986 | JP |
| 6243543 | Feb 1987 | JP |
| 362075619 | Apr 1987 | JP |
| 62122487 | Jun 1987 | JP |
| 63106730 | May 1988 | JP |
| 63106731 | May 1988 | JP |
| 64-14700 | Jan 1989 | JP |
| 01123587 | May 1989 | JP |
| 2122844 | Oct 1990 | JP |
| 3061192 | Mar 1991 | JP |
| 03243914 | Oct 1991 | JP |
| 4-114587 | Apr 1992 | JP |
| 40245886 | Sep 1992 | JP |
| 5-213113 | Aug 1993 | JP |
| 6080953 | Mar 1994 | JP |
| 6107035 | Apr 1994 | JP |
| 6227318 | Aug 1994 | JP |
| 7277072 | Oct 1995 | JP |
| 0577657 | Jul 1997 | JP |
| 11078693 | Mar 1999 | JP |
| 2000255321 | Sep 2000 | JP |
| 2002352611 | Dec 2002 | JP |
| 2002352611 | Dec 2002 | JP |
| 2003267129 | Sep 2003 | JP |
| 2004037944 | Feb 2004 | JP |
| 2005148119 | Jun 2005 | JP |
| 2005316509 | Nov 2005 | JP |
| 2005327600 | Nov 2005 | JP |
| WO 8202448 | Jul 1982 | WO |
| 8902135 | Mar 1989 | WO |
| WO 9412368 | Jun 1994 | WO |
| WO 9419212 | Sep 1994 | WO |
| WO 9427262 | Nov 1994 | WO |
| WO 9530495 | Nov 1995 | WO |
| WO 9603475 | Feb 1996 | WO |
| WO 9621581 | Jul 1996 | WO |
| WO 9734186 | Sep 1997 | WO |
| WO 9748134 | Dec 1997 | WO |
| WO 9814974 | Apr 1998 | WO |
| WO 9830415 | Jul 1998 | WO |
| WO 9838547 | Sep 1998 | WO |
| WO 9842796 | Oct 1998 | WO |
| WO 9844384 | Oct 1998 | WO |
| WO 9844385 | Oct 1998 | WO |
| WO 9844386 | Oct 1998 | WO |
| WO 9914088 | Mar 1999 | WO |
| WO 9914943 | Mar 1999 | WO |
| WO 9923828 | May 1999 | WO |
| 9940039 | Aug 1999 | WO |
| WO 9945081 | Sep 1999 | WO |
| WO 0011723 | Mar 2000 | WO |
| WO 0015462 | Mar 2000 | WO |
| WO 0017009 | Mar 2000 | WO |
| WO 0017702 | Mar 2000 | WO |
| WO 0018612 | Apr 2000 | WO |
| WO 0022471 | Apr 2000 | WO |
| WO 0023826 | Apr 2000 | WO |
| 0030893 | Jun 2000 | WO |
| WO 0033134 | Jun 2000 | WO |
| WO 0055685 | Sep 2000 | WO |
| WO 0052661 | Sep 2000 | WO |
| WO 0066679 | Nov 2000 | WO |
| WO 0164462 | Sep 2001 | WO |
| WO 0164481 | Sep 2001 | WO |
| WO 02062623 | Aug 2002 | WO |
| WO 03065084 | Aug 2003 | WO |
| WO 03079318 | Sep 2003 | WO |
| 03103338 | Dec 2003 | WO |
| WO 2004026633 | Apr 2004 | WO |
| WO 2004058540 | Jul 2004 | WO |
| WO 2004103772 | Dec 2004 | WO |
| WO 2005024500 | Mar 2005 | WO |
| WO 2005045481 | May 2005 | WO |
| WO 2005050267 | Jun 2005 | WO |
| WO 2005071646 | Aug 2005 | WO |
| WO 2005082015 | Sep 2005 | WO |
| 2007100921 | Sep 2007 | WO |
| 2007103265 | Sep 2007 | WO |
| 2007103342 | Sep 2007 | WO |
| WO 2007103573 | Sep 2007 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 20100172008 A1 | Jul 2010 | US |
| Number | Date | Country | |
|---|---|---|---|
| 60490111 | Jul 2003 | US | |
| 60423903 | Nov 2002 | US | |
| 60412275 | Sep 2002 | US | |
| 60424116 | Nov 2002 | US | |
| 60489816 | Jul 2003 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12429620 | Apr 2009 | US |
| Child | 12727691 | US | |
| Parent | 11956893 | Dec 2007 | US |
| Child | 12429620 | US | |
| Parent | 11709625 | Feb 2007 | US |
| Child | 11956893 | US | |
| Parent | 10533762 | US | |
| Child | 11709625 | US | |
| Parent | 10528269 | US | |
| Child | 10533762 | US |
