SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

Abstract

A substrate treatment apparatus of the present invention includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface intersecting a parallel direction along one surface of the substrate held by the substrate holding mechanism, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, a control unit for controlling the brush moving mechanism so that the cleaning surface is made to contact with the peripheral end face of the substrate held by the substrate holding mechanism, and a pushing pressure holding mechanism for holding the pushing pressure of the brush to the peripheral end face of the substrate in the parallel direction at a preset pushing pressure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the schematic configuration of a substrate treatment apparatus according to an embodiment of the present invention;

FIG. 2 is an illustrative side view showing the interior of the substrate treatment apparatus;

FIG. 3 is a sectional view showing the configuration of a brush;

FIG. 4 is a sectional view showing the configuration of a swinging arm;

FIG. 5 is a block diagram illustrating the electrical configuration of the substrate treatment apparatus;

FIG. 6 is a process chart for explaining wafer treatment in the substrate treatment apparatus;

FIG. 7 is a side view showing a state of the brush during the wafer treatment;

FIG. 8 is an illustrative side view showing the interior of a substrate treatment apparatus according to another embodiment of the present invention;

FIG. 9 is a side view showing another configuration (a configuration in which grooves are formed in the cleaning surface) of the brush; and

FIG. 10 is a side view showing a still another configuration (a configuration in which the cleaning surface is a generally cylindrical surface) of the brush.

Claims

1. A substrate treatment apparatus comprising: a substrate holding mechanism for holding a substrate,a brush made of an elastically deformable material and having a cleaning surface intersecting a parallel direction along one surface of the substrate held by the substrate holding mechanism;a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism;a control unit for controlling the brush moving mechanism so that the cleaning surface is made to contact with a peripheral end face of the substrate held by the substrate holding mechanism; anda pushing pressure holding mechanism for holding a pushing pressure of the brush in the parallel direction to the peripheral end face of the substrate at a preset pushing pressure.

2. A substrate treatment apparatus according to claim 1, wherein the cleaning surface is a conical surface having a central axis extending in a direction orthogonal to the parallel direction.

3. A substrate treatment apparatus according to claim 1, wherein the cleaning surface is a cylindrical surface having a central axis extending in a direction orthogonal to the parallel direction.

4. A substrate treatment apparatus according to claim 1, wherein a groove is formed in the cleaning surface.

5. A substrate treatment apparatus according to claim 1, wherein the brush has a rotationally symmetrical shape, andthe substrate treatment apparatus comprises a brush rotation mechanism for rotating the brush around a central axis thereof.

6. A substrate treatment apparatus according to claim 1, comprising: a brush relative movement mechanism for relatively moving the substrate held by the substrate holding mechanism and the brush so that the brush is moved in a circumferential direction of the substrate.

7. A substrate treatment apparatus according to claim 1, comprising: a treatment liquid supply mechanism for supplying a treatment liquid to an area located more inward than a peripheral area on at least the one surface of the substrate held by the substrate holding mechanism.

8. A substrate treatment method comprising: a substrate holding step for holding a substrate by a substrate holding mechanism;a brush contact step for moving a brush made of an elastically deformable material and having a cleaning surface intersecting a parallel direction along one surface of the substrate held by the substrate holding mechanism to make the cleaning surface of the brush in contact with a peripheral end face of the substrate held by the substrate holding mechanism; anda pushing pressure holding step for holding a pushing pressure of the brush in the parallel direction to the peripheral end face of the substrate at a preset pushing pressure in the brush contact step.