Patent Application
20250135586
The present disclosure relates to a teaching device and a teaching method of teaching an operation of a laser processing machine, and a device for and a method of generating an interference verification program.
A teaching device that teaches operation of a laser processing machine is known (e.g., Patent Literature 1).
There is known demand for a technique for effectively validating interference between a laser beam emitted from a laser processing machine and an object (e.g., a jig) existing in a work cell.
In one aspect of the present disclosure, a teaching device configured to teach an operation of a laser processing machine that performs a laser process on an object includes: a model data acquisition unit configured to acquire an object model modeling the object; an input receiving unit configured to receive an input of an interference detection condition for detecting interference between a virtual laser beam and the object model in a virtual laser process operation in which the virtual laser beam is simulatively irradiated onto a process location set in the object model; and an interference detecting unit configured to detect the interference generated in the virtual laser process operation based on the interference detection condition received by the input receiving unit, in which the interference detection condition includes a beam size of the virtual laser beam, or an invalid area to be set for the object model to invalidate detection of the interference.
In another aspect of the present disclosure, in a method of teaching an operation of a laser processing machine that performs a laser process on an object, a processor is configured to: acquire model data of an object model modeling the object; receive an input of an interference detection condition for detecting interference between a virtual laser beam and the object model in a virtual laser process operation in which the virtual laser beam is simulatively irradiated onto a process location set in the object model; and detect the interference generated in the virtual laser process operation based on the interference detection condition received, and the interference detection condition includes a beam size of the virtual laser beam, or an invalid area to be set for the object model to invalidate detection of the interference.
In still another aspect of the present disclosure, a device configured to generate an interference verification program configured to cause a laser processing machine configured to execute a laser process operation to perform a laser process on a process location set on a workpiece to execute an interference verification operation for preliminarily verifying interference between a laser beam and an environmental object includes: an input receiving unit configured to receive an input of an operation parameter for the interference verification operation; an operation speed setting unit configured to set an operation speed of the laser processing machine in the interference verification operation to a speed lower than that in the laser process operation based on the operation parameter received by the input receiving unit; and a program generating unit configured to generate the interference verification program defining a command for operating the laser processing machine at the operation speed set by the operation speed setting unit in the interference verification operation and irradiating the process location with a laser beam having an optical characteristic different from that in the laser process operation.
In still another aspect of the present disclosure, in a method of generating an interference verification program configured to cause a laser processing machine configured to execute a laser process operation to perform a laser process on a process location set on a workpiece to execute an interference verification operation for preliminarily verifying interference between a laser beam and an environmental object, a processor is configured to: receive an input of an operation parameter for the interference verification operation; set an operation speed of the laser processing machine in the interference verification operation to a speed lower than that in the laser process operation based on the operation parameter received; and generate the interference verification program defining a command for operating the laser processing machine at the set operation speed in the interference verification operation and irradiating the process location with a laser beam having an optical characteristic different from that in the laser process operation.
According to the present disclosure, it becomes possible to effectively validate interference between a laser beam that can be generated and an object.
Embodiments of the present disclosure are described in detail below with reference to the drawings. Note that in various embodiments described below, the same elements are denoted with the same reference numerals, and overlapping description is omitted. First, a laser processing system 10 according to an embodiment will be described with reference to
Under a command from the controller 14, the laser processing machine 12 irradiates a process location PL set on a workpiece 102 with a laser beam LB, and performs laser process (laser welding, laser cutting, and the like) on the process location PL with the laser beam LB. Specifically, the laser processing machine 12 includes a laser oscillator 16, a laser irradiation device 18, and a moving mechanism 20.
The laser oscillator 16 is a solid-state laser oscillator (e.g., a YAG laser oscillator or a fiber laser oscillator), a gas laser oscillator (e.g., a carbon dioxide laser oscillator), or the like and internally generates a laser beam LB by optical resonance and supplies the laser beam LB to the laser irradiation device 18 through a light guide member 22 in response to a command from the controller 14. The light guide member 22 includes, for example, at least one of an optical fiber, a light guide path made of a hollow or transparent material, a reflecting mirror, and an optical lens and guides the laser beam LB to the laser irradiation device 18.
The laser irradiation device 18, which is a laser scanner (galvano scanner), a laser process head having a nozzle that emits a laser beam and an assist gas, or the like, focuses the laser beam LB supplied from the laser oscillator 16 and irradiates the workpiece 102 with the laser beam LB.
The housing 24 is hollow and its interior defines a propagation path for the laser beam LB. The light receiving part 26 is provided at the housing 24 and receives the laser beam LB propagated through the light guide member 22. The mirror 28 is provided inside the housing 24 such that it is rotatable about an axis A1. The mirror 28 reflects the laser beam LB, which has entered the housing 24 through the light receiving part 26, toward the mirror 30. The mirror driving device 32 is, for example, a servo motor and rotates the mirror 28 about the axis A1 in response to a command from the controller 14.
On the other hand, the mirror 30 is provided inside the housing 24 such that it is rotatable about an axis A2. The axis A2 may be substantially orthogonal to the axis A1. The mirror 30 reflects the laser beam LB reflected by the mirror 28 toward the optical lens 36. The mirror driving device 34 is, for example, a servo motor and rotates the mirror 30 about the axis A2 in response to a command from the controller 14. Generally, the mirrors 28 and 30 may be referred to as galvanometer mirrors and the mirror driving devices 32 and 34 may be referred to as galvanometer motors.
The optical lens 36 includes a focus lens or the like and focuses the laser beam LB. In the present embodiment, the optical lens 36 is supported in the housing 24 such that it is movable in the direction of an optical axis O of the incident laser beam LB. The lens driving device 38, which includes a piezoelectric element, an ultrasonic vibrator, and an ultrasonic motor, displaces the optical lens 36 in the direction of the optical axis O in response to a command from the controller 14, thereby displacing, in the direction of the optical axis O, a focal point FP of the laser beam LB with which the workpiece 102 is irradiated. The laser beam emitting part 40 emits the laser beam LB focused by the optical lens 36 out of the housing 24.
With reference to
The moving mechanism coordinate system C1 is a coordinate system for automatically controlling the operation of the moving mechanism 20, and is set with respect to the moving mechanism 20. On the other hand, a tool coordinate system C2 is set in the laser irradiation device 18. The tool coordinate system C2 is a coordinate system that defines the position of the laser irradiation device 18 in the moving mechanism coordinate system C1. In the present description, “position” may indicate a position and an orientation.
In the present embodiment, the tool coordinate system C2 is set with respect to the laser irradiation device 18 so that the origin thereof is arranged at the center of the laser beam emitting part (the laser beam emitting part 40 in the example illustrated in
Each component (the robot base 42, the swivel body 44, the lower arm 46, the upper arm 48, and the wrist 49) of the moving mechanism 20 is provided with a servo motor (not illustrated), and the servo motor rotationally drives each movable component (the swivel body 44, the lower arm 46, the upper arm 48, and the wrist 49) of the moving mechanism 20 about a drive shaft in response to a command from the controller 14.
With respect to the moving mechanism 20 illustrated in
Thus, the controller 14 can arrange the laser irradiation device 18 at an arbitrary target position in the moving mechanism coordinate system C1 by the operation of the moving mechanism 20. For convenience, the following description may be made referring to the positive direction of an x-axis of the moving mechanism coordinate system C1 as rightward, the positive direction of a y-axis as frontward, and the positive direction of the z-axis as upward.
The controller 14 controls the operation of the laser processing machine 12. Specifically, the controller 14 is a computer including a processor (such as a CPU or a GPU) and a memory (such as a ROM or a RAM). The controller 14 controls an operation of generating a laser beam by the laser oscillator 16. By operating the mirror driving devices 32 and 34 of the laser irradiation device 18, the controller 14 changes the orientations of each of the mirrors 28 and 30, whereby the laser beam LB with which the workpiece 102 is irradiated can be moved at a high speed with respect to the workpiece 102.
The controller 14 also operates the lens driving device 38 of the laser irradiation device 18 to displace the optical lens 36, thereby moving the focal point FP of the laser beam LB emitted from the laser beam emitting part 40 in the direction of the optical axis O. By operating the moving mechanism 20, the controller 14 moves the laser irradiation device 18 with respect to the workpiece 102.
The teaching device 50 is for teaching the operation of the laser processing machine 12. As illustrated in
The processor 52 includes a CPU, GPU, or the like and is communicatively connected to the memory 54 and the I/O interface 56 via a bus 58. The processor 52 performs arithmetic processing for realizing teaching functions that will be described later while communicating with the memory 54 and the I/O interface 56.
The memory 54 includes a RAM, a ROM, or the like and temporarily or permanently stores various data used in arithmetic processing for teaching functions performed by the processor 52 and various data generated during the arithmetic processing. The I/O interface 56 has, for example, an Ethernet (trade name) port, a USB port, an optical fiber connector, or an HDMI (trade name) terminal and communicates data with external devices by wire or wirelessly under a command from the processor 52.
The teaching device 50 is provided with an input device 60 and a display device 62. The input device 60 includes a keyboard, a mouse, a touch panel, or the like and receives data input from an operator. The display device 62 includes a liquid crystal display, an organic EL display, or the like and displays various data.
The input device 60 and the display device 62 are communicatively connected to the I/O interface 56 by wire or wirelessly. The input device 60 and the display device 62 may be provided separately from the housing of the teaching device 50 or may be integrally incorporated into the housing of the teaching device 50.
The processor 52 is configured to send a command to each servo motor of the moving mechanism 20 via the controller 14 in response to input data to the input device 60, and to cause the moving mechanism 20 to perform a jogging operation in response to the command. By operating the input device 60, the operator controls the moving mechanism 20 via the controller 14 and teaches a laser process operation LPO by the laser processing machine 12.
Here, the work cell has various objects 100 including the above-described workpiece 102 and an environmental object 104 arranged around the workpiece 102. The environmental object 104 includes, for example, a jig used to install the workpiece 102 in the work cell, a structure such as a pillar arranged in the work cell, and peripheral equipment arranged around the workpiece 102.
When the controller 14 causes the laser processing machine 12 to operate to execute the laser process operation LPO to perform a laser process on the process location PL of the workpiece 102, it is necessary to avoid interference between the laser beam LB emitted from the laser irradiation device 18 and the environmental object 104. The teaching device 50 teaches the laser process operation LPO of the laser processing machine 12 in consideration of such interference between the laser beam LB and the environmental object 104.
Hereinafter, a method of teaching the laser process operation LPO using the teaching device 50 will be described. First, the operator prepares drawing data of a laser processing machine model 12M modeling the laser processing machine 12 and drawing data of an object model 100M modeling the object 100. The drawing data of the laser processing machine model 12M and the object model 100M are, for example, three-dimensional CAD data.
In the following description, when the name of a member in a real space is “XX”, a model of the member will be referred to as “XX model”. Therefore, the laser processing machine model 12M includes a laser oscillator model 16M modeling the laser oscillator 16, a laser irradiation device model 18M modeling the laser irradiation device 18, and a moving mechanism model 20M (a robot base model 42M, a swivel body model 44M, a lower arm model 46M, an upper arm model 48M, and a wrist model 49M in the example illustrated in
As an example, the operator may create the laser processing machine model 12M and the object model 100M using a design support device (CAD/CAM device) that is a computer other than the teaching device 50, and download the drawing data of the laser processing machine model 12M and the object model 100M to the teaching device 50 through the I/O interface 56.
As another example, the function of the design support device may be implemented in the teaching device 50 as software, for example, and the operator may create the laser processing machine model 12M and the object model 100M in the teaching device 50 by operating the input device 60 while visually recognizing the display device 62 provided in the teaching device 50.
The processor 52 acquires and stores, in the memory 54 of the teaching device 50, the drawing data of the laser processing machine model 12M and the object model 100M having been downloaded or created. As described above, in the present embodiment, the processor 52 functions as a model data acquisition unit 64 (
When the operator operates the input device 60 to input a teaching start command CMt, the processor 52 reads the laser processing machine model 12M and the object model 100M from the memory 54 and arranges them in a virtual space VS. The processor 52 may arrange only the laser irradiation device model 18M and the moving mechanism model 20M among the laser processing machine models 12M in the virtual space VS.
The processor 52 sets the moving mechanism coordinate system C1 and the tool coordinate system C2 in a positional relationship illustrated in
The processor 52 acquires position data PDn of a process location PLn to be set in the workpiece model 102M.
A process path PT having a predetermined shape is set in each of the plurality of process locations PLn (n=1 to 6).
As an example, the operator operates the input device 60 to set the process location PLn (specifically, the process path PT) in the moving mechanism coordinate system C1 as data in a form (e.g., another format) different from the drawing data of the workpiece model 102M, thereby creating the position data PDn of the process location PLn.
Alternatively, the operator may create the workpiece model 102M using a design support device (CAD/CAM device) that is a computer different from the teaching device 50, and set the process location PLn in the workpiece model 102M, thereby creating the position data PDn of the process location PLn as data of the same form (or another form) as the workpiece model 102M. The processor 52 acquires, as coordinates in the moving mechanism coordinate system C1, the position data PDn of each process location PLn (process path PT) set in the moving mechanism coordinate system C1.
Next, the processor 52 receives an input of an operation parameter PRv for executing a virtual laser process operation VLP (i.e., simulation of the laser process operation LPO) in which the virtual laser beam LBv is simulatively irradiated onto the process location PLn set in the workpiece model 102M in the virtual space VS.
The operation parameter PRv includes at least one of, for example, the number of times Nv of laser scanning of the process path PT set in each process location PLn in the virtual laser process operation VLP, a time tv of laser scanning once the process path PT, a scanning frequency fv (i.e., the number of times of laser scanning of the process path PT in one second), a scan speed Vv of moving the virtual laser beam LBv along the process path PT, an order ORv of laser scanning of the plurality of process locations PLn, and a movement speed Uv at which the moving mechanism model 20M moves the laser irradiation device model 18M.
For example, the processor 52 generates input image data ID1 for inputting the operation parameter PRv, and displays it on the display device 62. The operator operates the input device 60 to input the operation parameter PRv (i.e., the number of times Nv, the time tv, the scanning frequency fr, the scan speed Vv, the order ORv, or the movement speed Uv) while visually recognizing the input image data ID1 displayed on the display device 62.
Then, based on the object model 100M (specifically, the workpiece model 102M and the environmental object model 104M) arranged in the virtual space VS, the laser processing machine model 12M (e.g., the laser irradiation device model 18M and the moving mechanism model 20M), the above-described position data PDn, and the operation parameter PRv, the processor 52 simulatively operates the laser processing machine model 12M in the virtual space VS to generate the virtual laser process operation VLP of irradiating the process location PLn with a virtual laser beam LBv.
Assume that, for example, the processor 52 receives, as the operation parameter PRv, inputs of the number of times Nv=10, the scan speed Vv=100 [mm/sec], and the order ORv of the process locations PL1→PL2→PL3→PL4→PL5→PL6 for each process location PLn. In this case, the processor 52 generates the virtual laser process operation VLP so as to simulatively perform the following series of operations in the virtual space VS.
Specifically, the processor 52 simulatively operates the moving mechanism model 20M in the virtual space VS to move the laser irradiation device model 18M rightward along a predetermined moving path MPv in the moving mechanism coordinate system C1, and simulatively operates the laser irradiation device model 18M to simulatively emit the virtual laser beam LBv from the laser irradiation device model 18M in the order ORv of the process locations PL1→PL2→PL3→PL4→PL5→PL6.
At this time, the processor 52 moves the virtual laser beam LBv from the laser irradiation device model 18M along the process path PT at the scan speed Vv=100 [mm/sec] at each process location PLn, and performs the laser scanning the number of times Nv=10 on each process location PLn.
The processor 52 automatically generates the virtual laser process operation VLP including such a series of operations based on the object model 100M, the laser processing machine model 12M, the position data PDn, and the operation parameter PRv. More specifically, the processor 52 automatically determines the moving path MPv.
Note that the moving path MPv is defined by a plurality of teaching points TP1, TP2, . . . , TPm (m is a positive integer), and the processor 52 may determine the moving path MPv by automatically determining the teaching point TPm. The moving path MPv (or, the teaching point TPm) is determined as coordinates of the moving mechanism coordinate system C1.
The processor 52 automatically determines radiation timing RTv (e.g., irradiation start time and irradiation end time) at which each process location PLn is irradiated with the virtual laser beam LBv in the virtual laser process operation VLP and the direction (or, irradiation position on the workpiece model 102M) in which the virtual laser beam LBv is emitted from the laser irradiation device model 18M at the radiation timing RTv.
As described above, in the present embodiment, the processor 52 functions as an operation generating unit 66 (
The processor 52 receives an input of an interference detection condition CDn for detecting interference between the virtual laser beam LBv and the object model 100M in the virtual laser process operation VLP. The interference detection condition CDn includes, for example, a beam size BSn of the virtual laser beam LBv or an invalid area IAn to be set with respect to the object model 100M to invalidate the detection of interference.
The processor 52 generates and displays, on the display device 62, input image data ID2 for inputting the interference detection condition CDn. As described above, in the present embodiment, the processor 52 functions as an image generating unit 68 (
The input image data ID2 is a graphical user interface (GUI) for enabling the operator to input the interference detection condition CDn, and includes a process location selection image area 110 and a condition setting image area 112. In the process location selection image area 110, the process locations PLn (n=1 to 6) for which the processor 52 has acquired the position data PDn are enumerated in a list format.
The process location selection image area 110 displays a scroll bar image 114, and the operator can change the process location PLn to display by operating the input device 60 to slide the scroll bar image 114 up and down on the image. The operator operates the input device 60 to select one of the plurality of process locations PLn displayed in the process location selection image area 110 by clicking it on the image. Note that the example illustrated in
The condition setting image area 112 is for setting the interference detection condition CDn (specifically, the beam size BSn and the invalid area IAn) for the process location PLn selected in the process location selection image area 110. Specifically, the condition setting image area 112 includes a numerical value input image 116 for setting the beam size BSn and a numerical value input image 118 for setting the invalid area IAn.
The numerical value input image 116 is for inputting the beam size BSn of the virtual laser beam LBv with which the process path PT of the process location PLn (the process location PL2 in the example illustrated in
The operator can operate the input device 60 to input the beam size BSn to the numerical value input image 116. For example, in a case where a diameter R2=0.400 [mm] is input as a beam size BS2 to the numerical value input image 116 when the process location PL2 is selected as illustrated in
On the other hand, the numerical value input image 118 is for inputting a distance dn (unit: [mm]) from the irradiation position on the workpiece model 102M in order to set an area within a range of the distance dn as the invalid area IAn when simulatively irradiating the process location PLn selected in the process location selection image area 110 with the virtual laser beam LBv. The operator can operate the input device 60 to input the distance dn defining the invalid area IAn to the numerical value input image 118.
For example, in a case where the distance d2=1.000 [mm] is input to the numerical value input image 118 when the process location PL2 is selected as illustrated in
Here, depending on the form of the drawing data of the object model 100M, there is a case in which the processor 52 cannot distinguish the workpiece model 102M from the environmental object model 104M. In this case, when recognizing the workpiece model 102M and the environmental object model 104M as one object model 100M and executing the virtual laser process operation VLP, the processor 52 cannot distinguish whether the virtual laser beam LBv interferes with the workpiece model 102M or interferes with the environmental object model 104M.
In such a case, when laser scanning is performed on the process location PLn with the virtual laser beam LBv in the virtual laser process operation VLP, the virtual laser beam LBv and the workpiece model 102M interfere with each other in terms of calculation, and the processor 52 detects such interference. According to the present embodiment, by setting the invalid area IAn with respect to the workpiece model 102M as described above, it is possible to invalidate and not to detect the interference between the virtual laser beam LBv and the workpiece model 102M.
As described above, the processor 52 receives the input of the interference detection condition CDn (specifically, the beam size BSn and the distance dn defining the invalid area IAn) for each of the plurality of process locations PLn through the input image data ID2. Therefore, in the present embodiment, the processor 52 functions as an input receiving unit 70 (
Thereafter, the operator operates the input device 60 to input a command CM1 for starting the virtual laser process operation VLP. For example, the processor 52 may generate start button image data (not illustrated) for starting the virtual laser process operation VLP and display it on the display device 62. Upon receiving the command CM1 through the input device 60, the processor 52 executes the virtual laser process operation VLP described above in the virtual space VS.
During the execution of this virtual laser process operation VLP, the processor 52 detects the interference between the virtual laser beam LBv and the object model 100M based on the interference detection condition CDn with which the input has been received through the input image data ID2. Specifically, in the virtual laser process operation VLP, the processor 52 calculates the propagation area of the virtual laser beam LBv when the process location PLn is simulatively irradiated with the virtual laser beam LBv having the beam size BSn set as the interference detection condition CDn, and detects the presence or absence of the interference between the virtual laser beam LBv and the object model 100M.
At this time, since the invalid area IAn has been set with respect to the process location PLn as the interference detection condition CDn, the processor 52 does not detect the interference between the virtual laser beam LBv and the workpiece model 102M, but detects the interference between the virtual laser beam LBv and the environmental object model 104M. As described above, in the present embodiment, the processor 52 functions as an interference detecting unit 72 (
Upon detecting the interference between the virtual laser beam LBv and the environmental object model 104M in the virtual laser process operation VLP, the processor 52 generates a notification signal NS for notifying that. This notification signal NS includes, for example, information (e.g., image data for highlighting the interference position on the environmental object model 104M) indicating a position at which the virtual laser beam LBv interferes with the environmental object model 104M.
Upon recognizing, by the notification signal NS, that the interference between the virtual laser beam LBv and the environmental object model 104M has occurred, the operator corrects the virtual laser process operation VLP generated by the operation generating unit 66. Specifically, the operator operates the input device 60 to input a command CM2 for changing a parameter such as the moving path MPv (or, the teaching point TPm), the movement speed Uv, or the radiation timing RTv described above. In response to the command CM2, the processor 52 functions as the operation generating unit 66, and corrects the virtual laser process operation VLP by changing a parameter such as the moving path MPv (or, the teaching point TPm) having been set, the movement speed Uv, or the radiation timing RTv.
In this manner, the operator tries the virtual laser process operation VLP, and when the interference between the virtual laser beam LBv and the environmental object model 104M occurs in the virtual laser process operation VLP having been tried, the operator repeats the work of correcting the virtual laser process operation VLP. As a result, the processor 52 (the operation generating unit 66) can generate a virtual laser process operation VLP0 in which the interference between the virtual laser beam LBv and the environmental object model 104M does not occur.
Next, the operator operates the input device 60 to input a command CM3 for generating a process program PPG for the laser process operation LPO executed by the laser processing machine 12 in the real space. At this time, the processor 52 may generate button image data (not illustrated) for generating the process program PPG and display it on the display device 62.
Upon receiving the command CM3 through the input device 60, the processor 52 generates the process program PPG based on the virtual laser process operation VLP0 generated as described above. Specifically, the processor 52 automatically generates the process program PPG in which the position data PDn of the process location PLn, the moving path MPv (or, the teaching point TPm), the radiation timing RTv, and the operation parameter PRv (the number of times of scanning Nv, a scan time tv, the scanning frequency fr, the scan speed Vv, the order ORv, or the movement speed Uv), which define the operation of the virtual laser process operation VLP0, are defined as a command CMv (e.g., a code). As described above, in the present embodiment, the processor 52 functions as a program generating unit 74 (
As described above, in the present embodiment, the input receiving unit 70 receives the input of the beam size BSn and the invalid area IAn as the interference detection condition CDn, and the interference detecting unit 72 detects the interference generated in the virtual laser process operation VLP based on the received interference detection condition CDn.
Herein, in a known manner, the virtual laser process operation VLP is executed with the virtual laser beam LBv defined as a line having a cross-sectional area of zero, and the presence or absence of the interference between the virtual laser beam LBv and the object model 100M is detected. In this case, an error cannot exist in the interference detection between the virtual laser beam LBv and the object model 100M.
When the laser process operation is executed in accordance with the process program created as a result of the virtual laser process operation VLP based on such interference detection, if there is a slight error in the radiation timing of the laser processing machine 12, the position of the process location PLn, or the arrangement of the workpiece 102 and the environmental object 104, there is a possibility that the actual laser beam LB interferes with the environmental object 104.
In the present embodiment, when the input of the beam size BSn is received as the interference detection condition CDn, the virtual laser process operation VLP is executed with the virtual laser beam LBv defined as an area having a cross-sectional area corresponding to the beam size BSn, and the interference between the virtual laser beam LBv and the object model 100M is detected.
According to this configuration, even if there is a slight error in the radiation timing of the laser processing machine 12, the position of the process location PLn, the arrangement of the workpiece 102 and the environmental object 104, or the like, the laser beam LB can be prevented from interfering with the environmental object 104 in the actual laser process operation LPO.
As described above, there has been a known case in which the workpiece model 102M and the environmental object model 104M cannot be distinguished from each other depending on the form of the drawing data of the object model 100M. In the present embodiment, when the input of the invalid area IAn is received as the interference detection condition CDn, it is possible to avoid the interference between the virtual laser beam LBv and the workpiece model 102M from being detected in the virtual laser process operation VLP. As described above, by receiving the beam size BSn or the invalid area IAn as the interference detection condition CDn, it is possible to effectively validate the interference that can occur.
In the present embodiment, the input receiving unit 70 receives an input of the distance dn as the interference detection condition CDn for setting the invalid area IAn. According to this configuration, the operator can easily set the invalid area IAn as an area having a desired size, and can intuitively recognize the range of the invalid area IAn in the virtual space VS.
In the present embodiment, the input receiving unit 70 receives the input of the interference detection condition CDn for each of the plurality of process locations PLn. According to this configuration, the operator can set the interference detection condition CDn in detail for each process location PLn. For example, in the virtual laser process operation VLP, there is a case where the laser irradiation device model 18M is moved at a relatively high movement speed Uv1 when laser scanning is performed on the process locations PL1 and PL2, and the laser irradiation device model 18M is moved at a relatively low movement speed Uv2 (<Uv1) when laser scanning is performed on the process locations PL3 and PL4.
Here, when the laser irradiation device model 18M is moved at the lower movement speed Uv2, a deviation between the result of interference detection between the virtual laser beam LBv and the object model 100M (specifically, the environmental object model 104M) and the interference state between the laser beam LB and the object 100 (specifically, the environmental object 104) in the actual laser process operation LPO is unlikely to occur, and therefore, it may be desirable to set a small clearance for interference detection in the virtual laser process operation VLP.
On the other hand, when the laser irradiation device model 18M is moved at the faster movement speed Uv1, a deviation between the result of interference detection between the virtual laser beam LBv and the object model 100M and the interference state between the laser beam LB and the object 100 in the actual laser process operation LPO is likely to occur, and therefore, it may be desirable to set a large clearance for interference detection in the virtual laser process operation VLP.
According to the present embodiment, the relatively large beam sizes BS1 and BS2 are set with respect to the process locations PL1 and PL2 in which the laser irradiation device model 18M is moved at the high movement speed Uv1 to perform laser scanning, and the relatively small beam sizes BS3 and BS4 can be set with respect to the process locations PL3 and PL4 in which the laser irradiation device model 18M is moved at the low movement speed Uv1 to perform laser scanning. This enables the operator to set the optimum beam size BSn for each process location PLn.
There is a case in which the operator desires to adjust the range of the invalid area IAn to be set in the workpiece model 102M in response to the positional relationship between the workpiece model 102M and the environmental object model 104M. According to the present embodiment, the range of the invalid area IAn can be appropriately set for each process location PLn. As described above, by receiving the input of the interference detection condition CDn for each process location PLn, it is possible to optimize the interference detection condition CDn for each process location PLn.
In the present embodiment, the image generating unit 68 generates the input image data ID2 (
In the present embodiment, the operation generating unit 66 generates the virtual laser process operation VLP based on the object model 100M, the laser processing machine model 12M, and the position data PDn of the process location PLn. According to this configuration, it is possible to cause the processor 52 to automatically generate the virtual laser process operation VLP, and the operator can verify and validate the virtual laser process operation VLP. This can simplify the work related to teaching of the laser process operation LPO.
In the present embodiment, the program generating unit 74 generates the process program PPG for the laser process operation LPO based on the virtual laser process operation VLP0 generated by the operation generating unit 66. According to this configuration, since it is possible to automatically generate the virtual laser process operation VLP0 and the process program PPG, it is possible to further simplify the operation related to teaching of the laser process operation LPO.
The processor 52 may automatically set the beam size BSn in response to the movement speed Uv at which the moving mechanism model 20M moves the laser irradiation device model 18M. In this case, a data table in which the movement speed Uv and the beam size BSn are stored in association with each other is stored in advance in the memory 54, and the processor 52 may set the beam size BSn by applying, to the data table, the movement speed Uv received as the operation parameter PRv. In this case, the input receiving unit 70 may receive only the input of the invalid area IAn without receiving the input of the beam size BSn.
For example, when the workpiece model 102M and the environmental object model 104M can be distinguished by the form of the drawing data of the object model 100M, the interference detecting unit 72 can be configured to invalidate the interference between the virtual laser beam LBv and the workpiece model 102M and detect only the interference between the virtual laser beam LBv and the environmental object model 104M. In this case, the input receiving unit 70 may receive only the input of the beam size BSn without receiving the input of the invalid area IAn.
In the virtual laser process operation VLP, the processor 52 may emit, from the laser irradiation device model 18M, the virtual laser beam LBv having a conical shape whose cross-sectional area decreases from the laser irradiation device model 18M toward the process location PLn. In this case, the input receiving unit 70 may further receive, as the interference detection condition CDn, an input of a reduction ratio In (or, a taper rate) at which the cross-sectional area decreases, in addition to the beam size BSn.
Assume that, for example, the input receiving unit 70 receives an input of beam size BS2=diameter R2=0.400 [mm] and a reduction ratio λ as the interference detection condition CD2 related to the process location PL2. In this case, in the virtual laser process operation VLP, the processor 52 simulatively emits the virtual laser beam LBv having a conical shape in which the diameter R2 in a laser beam emitting part model 40M of the laser irradiation device model 18M is 0.400 [mm], and the cross-sectional area decreases at a reduction ratio λ2 from the laser beam emitting part model 40M toward the process location PL2.
Alternatively, in the virtual laser process operation VLP, the processor 52 simulatively emits the virtual laser beam LBv having a conical shape in which the cross-sectional area decreases at a reduction ratio λ2 from the laser beam emitting part model 40M toward the position of the process location PL2 and the diameter R2 becomes 0.400 [mm] at the position of the process location PL2. By generating such the virtual laser beam LBv having a conical shape, it is possible to execute the virtual laser process operation VLP with the virtual laser beam LBv similar to the laser beam LB in the actual laser process operation LPO.
Note that the input receiving unit 70 may receive, as the interference detection condition CDn for the invalid area IAn, an input that designates the surface models 106M, 108M, and 110M that are references when the invalid area IAn is set together with the above-described distance dn. Assume that, for example, when selecting the process location PL2 as illustrated in
In this case, the processor 52 functions as the input receiving unit 70, receives the input that designates the surface model 106M as a reference of the invalid area IA2, and sets, as the invalid area IA2, a range of the input distance d2 (e.g., 1.000 [mm]) from the irradiation position on the surface model 106M.
At this time, the processor 52 may function as the image generating unit 68 and display an image of the workpiece model 102M in the input image data ID2 so that the operator can visually recognize it. Note that the distance dn may be stored in advance in the memory 54 as a predetermined set value (e.g., dn=1.000 [mm]). In this case, the processor 52 sets the invalid area IAn without receiving the input of the distance dn.
In the present embodiment, the case in which the operation generating unit 66 automatically generates the virtual laser process operation VLP has been described. However, no such limitation is intended, and the operator may manually generate the virtual laser process operation VLP by operating the input device 60. In this case, the operation generating unit 66 can be omitted from the teaching device 50.
In the present embodiment, the case in which the program generating unit 74 automatically generates the process program PPG has been described. However, no such limitation is intended, and the operator may manually generate the process program PPG by operating the input device 60. In this case, the program generating unit 74 can be omitted from the teaching device 50.
In the present embodiment, the case in which the operator inputs the command CM2 for changing the moving path MPv (the teaching point TPm), the movement speed Uv, or the radiation timing RTv when the interference between the virtual laser beam LBv and the environmental object model 104M occurs in the virtual laser process operation VLP has been described.
However, no such limitation is intended, and the processor 52 may function as the operation generating unit 66 to automatically correct the virtual laser process operation VLP by automatically changing the moving path MPv (the teaching point TPm), the movement speed Uv, or the radiation timing RTv so as to avoid the interference based on the position of the generated interference.
The process program PPG described above may include a first process program PPG1 for operating the moving mechanism 20 and a second process program PPG2 for operating the laser irradiation device 18. In this case, the program generating unit 74 may generate the first process program PPG1 and the second process program PPG2 as separate data (e.g., in different data forms or formats).
Note that the model data acquisition unit 64, the operation generating unit 66, the image generating unit 68, the input receiving unit 70, the interference detecting unit 72, and the program generating unit 74 described above are functional modules realized by a computer program executed by the processor 52, for example. At least one function of the model data acquisition unit 64, the operation generating unit 66, the image generating unit 68, the input receiving unit 70, the interference detecting unit 72, and the program generating unit 74 may be implemented in the controller 14. In this case, the processor of the controller 14 has the function of the teaching device 50.
Next, other functions of the laser processing system 10 will be described with reference to
In this laser process operation LPO, the laser processing machine 12 operates the moving mechanism 20 to move the laser irradiation device 18 rightward along the moving path MPv (i.e., the teaching points TP1, TP2, . . . , TPm) and operates the laser irradiation device 18 to emit the laser beam LB, thereby performing laser scanning on the plurality of process locations PLn in the order ORv.
During such the operation, interference between the laser beam LB and the environmental object 104 may occur in the real space, but since the movement speed Uv of the moving mechanism 20 and the scan speed Vv of the laser irradiation device 18 in the laser process operation LPO are high, it is difficult for the operator to visually verify the interference between the laser beam LB and the environmental object 104 during the actual laser process operation LPO.
Therefore, in the present embodiment, the teaching device 50 generates an interference verification program IPG for executing an interference verification operation IVO for preliminarily verifying the interference between the laser beam LB and the environmental object 104. Here, the interference verification operation IVO is an operation different from the actual laser process operation LPO, and is an operation of operating the laser processing machine 12 at an operation speed v lower than that of the laser process operation LPO to verify the interference and experimentally irradiating the process location PLn with a laser beam LBg having optical characteristics different from those of the laser process operation LPO.
The operation speed v of the laser processing machine 12 has a movement speed U at which the moving mechanism 20 moves the laser irradiation device 18 and a scan speed V at which the laser irradiation device 18 moves the laser beam LBg along the process path PL. The laser beam LBg is visible light (so-called guide laser) having a wavelength different from that of the laser beam LB emitted in the laser process operation LPO, and has laser power lower than that of the laser beam LB. In the present description, the laser beam LBg emitted in the interference verification operation IVO is referred to as guide laser LBg.
Hereinafter, a method of generating the interference verification program IPG will be described. When the operator operates the input device 60 to input a command CM4 for generating the interference verification program IPG, the processor 52 acquires the position data PDn of the process location PLn. For example, the position data PDn may be stored in the memory 54 or may be defined in the process program PPG.
The processor 52 acquires the position data PDTP of the teaching points TPm and TPm+1 from the process program PPG. As described above, in the present embodiment, the processor 52 functions as a position data acquisition unit 80 (
Next, the processor 52 receives an input of an operation parameter PRin for the interference verification operation IVO. The operation parameter PRin includes, for example, a scan speed Vi_n for moving the guide laser LBg along the process path PL in the interference verification operation IVO, a scan time tn for moving the guide laser LBg from the start point P1 to the end point P2 of the process path PL, and an allowable time In of the scan time tn.
The processor 52 generates input image data ID3 for inputting the operation parameter PRin, and displays it on the display device 62. As described above, in the present embodiment, the processor 52 functions as an image generating unit 82 (
The input image data ID3 is a GUI for enabling the operator to input the operation parameter PRin, and includes the process location selection image area 110 including the above-described scroll bar image 114 and a parameter setting image area 120. The parameter setting image area 120 is for setting the operation parameter PRin for the process location PLn selected in the process location selection image area 110.
Specifically, the parameter setting image area 120 includes a numerical value input image 122 for setting the scan speed Vi_n, a numerical value input image 124 for setting the scan time tn, and a numerical value input image 126 for setting the allowable time In. The numerical value input images 122, 124, and 126 are for inputting the scan speed Vi_n, the scan time tn, and the allowable time In (a scan speed Vi_2, scan time t2, and allowable time τ2 in the example illustrated in
As described above, the operator can select the process location PLn that is desired in the process location selection image area 110 and input the scan speed Vi_n, the scan time tn, and the allowable time In as the operation parameters PRin through the numerical value input images 122, 124, and 126 for each process location PLn. Therefore, in the present embodiment, the processor 52 functions as an input receiving unit 84 (
Next, the processor 52 determines an operation speed vn of the laser processing machine 12 in the interference verification operation IVO based on the received operation parameter PRin. Assume that, for example, the operator inputs, as operation parameters PRi2, the scan speed Vi_2=1 [mm/sec], the scan time t2=1 [sec], and the allowable time τ2=5 [sec] in the parameter setting image area 120 when selecting the process location PL2 in the process location selection image area 110 as illustrated in
In this case, the processor 52 first acquires a path length L2 from the start point P1 to the end point P2 of the process path PT set at the process location PL2 from position data PD2 of the process location PL2. Then, scan speeds Vt2 and Vτ2 corresponding to the scan time t2 and the allowable time τ2 input as the operation parameters PRi2 are obtained using the path length L2.
Assume that, for example, the path length L2=40 [mm]. In this case, regarding the scan time t2, the processor 52 obtains, as Vt2=L2/t2=40 [mm/sec], the scan speed Vt2 when performing laser scanning on the path length L2 at the scan time t2. Similarly, regarding the allowable time t2, the processor 52 obtains, as Vτ2=L2/τ2=8 [mm/sec], the scan speed Vτ2 when performing laser scanning on the path length L2 at the allowable time τ2.
Then, the processor 52 applies the scan speed Vi_2 input as the operation parameter PRi2 and the scan speed Vt2 and the scan speed Vτ2 obtained by calculation to a conditional expression (I) of MAX (MIN (Vi_2, Vt2), Vt2). In this conditional expression (I), MIN (Vi_2, Vt2) indicates selecting the smaller one of Vi_2 and Vt2. That is, in the case of the present embodiment, MIN (Vi_2, V2)=Vi_2 (=1 [mm/sec]), and hence MAX (MIN (Vi_2, Vt2), Vτ2)=MAX (Vi_2, Vτ2).
On the other hand, MAX (Vi_2, Vτ2) indicates selecting the larger one of Vi_2 and Vτ2. That is, in the case of the present embodiment, MAX (Vi_2, Vτ2)=Vt2 (=8 [mm/sec]). Thus, the processor 52 determines, as V2=Vτ2=8 [mm/sec], the scan speed V2 when performing the laser scanning on the process location PL2 in the interference verification operation IVO from the scan speed Vi_2, the scan time t2, and the allowable time τ2 input as the operation parameters PRi2, and the conditional expression (I).
Technical significance of the use of the conditional expression (I) will be described below. Assume that the operator inputs the scan speed Vi_2 as the operation parameter PRi2, as a relatively low speed, from the viewpoint of making visual interference verification easy. In this case, a scan time tV2 required for performing laser scanning on the path length L2 at the scan speed Vi_2 input is a relatively long scan time tv2=L2/Vi_2.
On the other hand, assume that the operator inputs the scan time t2 as the operation parameter PRi2 in a relatively short time from the viewpoint of cycle time reduction of the interference verification operation IVO. In this case, the scan speed Vt2 corresponding to the scan time t2 input becomes relatively high, and as a result, visual interference verification can become difficult. In the above-described conditional expression (I), by selecting the smaller one of the speed Vi_2 and the speed Vt2 by MIN (Vi_2, Vt2), the speed Vt2 at which visual interference verification can become difficult is excluded.
However, at the speed Vi_2 selected by MIN (Vi_2, Vt2), the scan time tV2 becomes long as described above, and in this case, produces the possibility that the cycle time of the interference verification operation IVO excessively increases. Therefore, in the conditional expression (I), by selecting the larger one of the speed Vi_2 and the speed Vτ2 corresponding to the allowable time τ2 by MAX (Vi_2, Vτ2), the speed Vi_2 at which the cycle time can be excessively redundant is excluded, and the speed Vt2 corresponding to the allowable time τ2 is set as the scan speed V2 when performing the laser scanning on the process location PL2 in the interference verification operation IVO.
As described above, in the present embodiment, the allowable time t2 is input as the operation parameter PRi2 in order to put the scan time t2 required to perform laser scanning on the process path PT of the process location PL2 in the interference verification operation IVO within an allowable range in which the cycle time of the interference verification operation IVO does not become excessively redundant, and according to the conditional expression (I), even if any of the speeds Vi_2, Vt2, and Vτ2 is selected, the scan time t2 does no longer exceed the allowable time τ2.
When the operator inputs the appropriate scan speed Vi_2 or the scan time t2 (e.g., inputs the scan speed Vi_2=10 [mm/sec], the scan time t2=5 [sec], and the allowable time τ2=10 [sec]), the processor 52 determines the scan speed V2 when performing the laser scanning on the process location PL2 in the interference verification operation IVO as the scan speed Vt2 (=8 [mm/sec]) corresponding to the scan time t2 (=5 [sec]) from the conditional expression (I). The scan speed V2 determined to enable visual interference verification as described above is set to a value lower than the scan speed Vv (e.g., 100 [mm/sec]) in the laser process operation LPO.
As described above, based on the operation parameter PRin, the processor 52 determines, as a speed (Vn<Vv) lower than that of the laser process operation LPO, the operation speed vn (specifically, the scan speed Vn) when performing the laser scanning on the process location PLn in the interference verification operation IVO. Therefore, in the present embodiment, the processor 52 functions as an operation speed setting unit 86 (
When the operation speed Vn determined based on the operation parameter PRin is equal to or greater than a predetermined threshold vth, the processor 52 may generate an alert signal AS “operation speed in the interference verification operation is high, so visual interference verification can be difficult” in a data form of image or voice, and output it through the display device 62 or a speaker (not illustrated). In this case, for example, the threshold vth may be determined in advance as vth=αvv (α is a positive coefficient) with reference to an operation speed vv (e.g., the scan speed Vv or the movement speed Uv defined in the process program PPG) of the laser process operation LPO.
Next, the processor 52 generates the interference verification program IPG defining a command CMi that causes the laser processing machine 12 to execute the following series of operations as the interference verification operation IVO. That is, in the interference verification operation IVO, while operating the laser oscillator 16 to generate the guide laser LBg and operating the moving mechanism 20 to move the laser irradiation device 18, the laser processing machine 12 operates the laser irradiation device 18 to perform laser scanning on the plurality of process locations PLn in the order ORv with the guide laser LBg.
When performing laser scanning on one process location PLn, the laser processing machine 12 first operates the moving mechanism 20 to position the laser irradiation device 18 at the teaching point TPm (
Next, upon receiving an interference verification command CM5 from the operator, the laser processing machine 12 stops irradiation of the guide laser LBg, and then operates the moving mechanism 20 to position the laser irradiation device 18 at the teaching point TPm+1. Next, the laser processing machine 12 irradiates the process location PLn with the guide laser LBg again in a state where the laser irradiation device 18 is kept still at the teaching point TPm+1, and repeatedly performs laser scanning on the process path PT of the process location PLn at the scan speed Vn. Thus, the laser processing machine 12 executes laser scanning each time the laser irradiation device 18 is sequentially positioned at the teaching points TPm and TPm+1.
Next, upon receiving an interference verification command CM6 from the operator, the laser processing machine 12 stops irradiation of the guide laser LBg, and then operates the moving mechanism 20 to move the laser irradiation device 18 to the teaching point TPm set at a next process location PLn+1, and executes the above-described series of laser scanning on the next process location PLn+1.
The laser processing machine 12 executes the interference verification operation IVO by repeatedly performing the series of laser scanning in the order ORv on the plurality of process locations PLn. The processor 52 automatically generates the interference verification program IPG defining the command CMi for causing the laser processing machine 12 to execute the above-described series of interference verification operation IVO based on the position data PDn of the process location PLn and the position data PDTP of the teaching point TPm defined in the process program PPG, and the scan speed Vn determined by the operation speed setting unit 86. As described above, in the present embodiment, the processor 52 functions as a program generating unit 88 (
In step S1, the processor 52 sets the number “n” for specifying the n-th process location PLn to “1”. In step S2, the processor 52 performs laser scanning on the n-th process location PLn. This step S2 will be described with reference to
In step S12, the processor 52 starts laser scanning. Specifically, as described above, the processor 52 operates the laser oscillator 16 to generate the guide laser LBg, irradiates the nth process location PLn with the guide laser LBg in a state where the laser irradiation device 18 is kept still at the first teaching point TPm, and repeatedly performs laser scanning on the process path PT of the nth process location PLn at the scan speed Vn by the guide laser LBg.
The operator can visually verify the presence or absence of interference between the guide laser LBg and the environmental object 104 while the laser scanning is performed on the n-th process location PLn in this step S12. Upon completing the interference verification, the operator operates the input device 60 to input the interference verification command CM5.
In step S13, the processor 52 determines whether or not the interference verification command CM5 has been received. Upon determining to have received the interference verification command CM5 (i.e., YES), the processor 52 ends the laser scanning started in step S12 (i.e., stops the emission of the guide laser LBg), and proceeds to step S15, and on the other hand, upon determining NO, the processor 52 proceeds to step S14.
In step S14, the processor 52 generates a verification signal RS. For example, the processor 52 generates the verification signal RS of “Verify interference between the guide laser and the environmental object. Proceed to the next step if there is no interference.” in a data form of image or voice. The processor 52 outputs the generated verification signal RS through the display device 62 or a speaker (not illustrated), and returns to step S13.
In this manner, the processor 52 loops steps S13 and S14 until determining YES in step S13. In step S15, the processor 52 operates the moving mechanism 20 to position the laser irradiation device 18 at the second teaching point TPm+1 set at the n-th process location PLn.
In step S16, the processor 52 starts laser scanning. Specifically, as described above, the processor 52 irradiates the n-th process location PLn with the guide laser LBg again in a state where the laser irradiation device 18 is kept still at the second teaching point TPm+1, and repeatedly performs laser scanning on the process path PT of the n-th process location PLn at the scan speed Vn by the guide laser LBg.
The operator visually verifies again the presence or absence of interference between the guide laser LBg and the environmental object 104 while the laser scanning is performed on the n-th process location PLn in this step S16. Upon completing the interference verification, the operator operates the input device 60 to input the interference verification command CM6.
In step S17, the processor 52 determines whether or not the interference verification command CM6 has been received. Upon determining YES, the processor 52 ends the laser scanning started in step S16, and proceeds to step S3 in
With reference to
Upon determining that n>6 (i.e., YES), the processor 52 ends the flow of the interference verification operation IVO shown in
As described above, in the present embodiment, the processor 52 functions as the position data acquisition unit 80, the image generating unit 82, the input receiving unit 84, the operation speed setting unit 86, and the program generating unit 88, and generates the interference verification program IPG. Therefore, the position data acquisition unit 80, the image generating unit 82, the input receiving unit 84, the operation speed setting unit 86, and the program generating unit 88 constitute a device 90 (
In this device 90, the operation speed setting unit 86 sets the operation speed vn (the scan speed Vn) in the interference verification operation IVO to a speed lower than that in the laser process operation LPO based on the operation parameter PRin received by the input receiving unit 84. Then, the program generating unit 88 generates the interference verification program IPG defining the command CMi for operating the laser processing machine 12 at the operation speed vn (the scan speed Vn) in the interference verification operation IVO and causing the process location PLn to be irradiated with the guide laser LBg (steps S12 and S16 in
According to this device 90, in the interference verification operation IVO, by operating the laser processing machine 12 at the operation speed vn lower than that of the laser process operation LPO, the operator can visually verify the interference between the laser beam LBg and the environmental object 104 before performing the actual laser process operation LPO. As a result, the presence or absence of the interference can be effectively validated in advance, and when the interference occurs, measures such as correcting the process program PPG so as to avoid the interference can be taken.
In the device 90, the input receiving unit 84 receives inputs of the scan speed Vi_n, the scan time tn, and the allowable time τn as the operation parameters PRin, and the operation speed setting unit 86 determines the scan speed Vn in the interference verification operation IVO based on the scan speed Vi_n, the scan time tn, and the allowable time τn. According to this configuration, the scan speed Vn in the interference verification operation IVO can be automatically determined as a speed at which the operator can perform visual interference verification.
In the device 90, the position data acquisition unit 80 acquires the position data PDTP of the teaching points TPm and TPm+1 for positioning the laser irradiation device 18 in the laser process operation LPO, and the program generating unit 88 generates the interference verification program IPG defining the command CMi for positioning (steps S11 and S15 in
According to this configuration, the interference verification operation IVO can be executed using the teaching points TPm and TPm+1 in the laser process operation LPO (more specifically, defined in the process program PPG). Therefore, interference that can occur in the actual laser process operation LPO can be validated with high accuracy by the interference verification operation IVO performed in advance.
In the device 90, the program generating unit 88 generates the interference verification program IPG defining the command CMi for executing laser scanning (steps S11, S12, S15, and S16 in
According to this configuration, in the interference verification operation IVO, the laser scanning by the guide laser LBg is executed at the start point (the first teaching point TPm) and the end point (the second teaching point TPm+1) of the movement of the laser irradiation device 18 when performing the laser scanning on the process location PLn in the actual laser process operation LPO. This makes it possible to more efficiently validate interference that can occur when laser scanning is performed on the process location PLn in the actual laser process operation LPO.
In the device 90, the input receiving unit 84 receives the inputs of the operation parameters PRin (the scan speed Vi_2, the scan time t2, allowable time τ2) for each of the plurality of process locations PLn, and the operation speed setting unit 86 determines the operation speed bn (the scan speed Vn) in the interference verification operation IVO for each of the plurality of process locations PLn.
According to this configuration, the operator can set the operation speed vn in the interference verification operation IVO in detail for each process location PLn in consideration of the positional relationship between the workpiece 102 and the environmental object 104. Therefore, it is possible to make visual interference verification in the interference verification operation IVO easy.
In the device 90, the image generating unit 82 generates the input image data ID3 for inputting the operation parameter PRin. According to this configuration, since the operator can input the operation parameter PRin while visually recognizing the input image data ID3, the work of setting the operation parameter PRin can be simplified.
In the present embodiment, the case in which the operation speed setting unit 86 sets the scan speed Vn as the operation speed vn has been described. However, no such limitation is intended, and the operation speed setting unit 86 may set, as the operation speed vn, the movement speed Un at which the moving mechanism 20 moves the laser irradiation device 18, instead of the scan speed Vn (or, in addition to the scan speed Vn). In this case, the input receiving unit 84 may receive the input of the movement speed Un as the operation parameter PRin for each of the plurality of process locations PLn.
The input receiving unit 84 may receive a scanning frequency fi_n (=1/tn) as the operation parameter PRin instead of (or, in addition to) the above-described scan time tn. In this case, the operation speed setting unit 86 may determine the scan speed Vn in the interference verification operation IVO by obtaining a scan speed Vfn corresponding to the input scanning frequency fi_n from an expression of Vfn=fi_n×Ln (where Ln is the path length of the process path PT of the process location PLn) and applying the scan speed Vin to the conditional expression (I) of MAX (MIN (Vi_n, Vfn), Vτn).
The above-described conditional expression (I) is not limited to the logical expression of MAX (MIN (Vi_n, Vtn), Vτn). The operator may use any logical expression as the conditional expression (I). For example, a logical expression of MIN (MAX (Vi_n, Vtn), Vτn) may be used as the conditional expression (I).
In the present embodiment, the case in which the input receiving unit 70 receives the inputs of the scan speed Vi_n, the scan time tn, and the allowable time In as the operation parameters PRin has been described. However, no such limitation is intended, and the input receiving unit 70 may receive only one (or two) of the scan speed Vi_n, the scan time tn, and the allowable time τn. In this case, the operation speed setting unit 86 determines the operation speed vn based on the one (or the two).
In the present embodiment, the case in which the position data acquisition unit 80 acquires the position data PDTP of the teaching point TPm, and the program generating unit 88 generates the interference verification program IPG defining the command CMi for positioning the laser irradiation device 18 at the teaching point TPm in the interference verification operation IVO has been described.
However, no such limitation is intended, and the program generating unit 88 may generate the interference verification program IPG defining the command CMi for positioning the laser irradiation device 18 at an arbitrary position in the interference verification operation IVO without using the position data PDTP. The arbitrary position may be determined by the operator in response to the interference verification operation IVO to be executed. That is, in this case, the position data acquisition unit 80 can be omitted from the device 90.
In the present embodiment, the case in which the program generating unit 88 generates the interference verification program IPG so as to perform laser scanning in the state where the laser irradiation device 18 is kept still at the teaching points TPm and TPm+1 in steps S12 and S16 in
Steps S13, S14, S17, and S18 may be omitted from the flow of the interference verification operation IVO shown in
After start of step S16, the processor 52 may repeatedly perform laser scanning on the n-th process location PLn the predetermined number of times Ni, and then end step S2. In this case, the input receiving unit 84 may further receive the input of the number of times Ni for each process location PLn as the operation parameter PRin.
The functions of the device 90 (i.e., the position data acquisition unit 80, the image generating unit 82, the input receiving unit 84, the operation speed setting unit 86, and the program generating unit 88) can also be implemented in the controller 14. In this case, the processor of the controller 14 functions as the device 90.
In the embodiment illustrated in
In the embodiment described above, the case in which the six process locations PLn are set in the workpiece 102 and the workpiece model 102M has been described. However, no such limitation is intended, and only one process location PL1 may be set in the workpiece 102 and the workpiece model 102M, or any number of process locations PLn may be set. Alternatively, the process path PT is not limited to a quadrilateral as illustrated in
The controller 14 described above may include a first controller 14A configured to control the operations of the laser oscillator 16 and the laser irradiation device 18, and a second controller 14B configured to control the operation of the moving mechanism 20. The above-mentioned aspect is illustrated in
The first controller 14A and the second controller 14B execute the laser process operation LPO or the interference verification operation IVO while communicating with each other and while synchronizing the operations of the laser oscillator 16 and the laser irradiation device 18 with the operation of the moving mechanism 20. Although the present disclosure has been described through embodiments above, the embodiments described above do not limit the scope of the invention claimed in the claims.
This is the U.S. National Phase application of PCT/JP2021/036157, filed Sep. 30, 2021, the disclosures of this application being incorporated herein by reference in their entireties for all purposes.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2021/036157 | 9/30/2021 | WO |
