Claims
- 1. An optical transmitter to transmit light signals over an optical fiber, the optical transmitter comprising:
an optical bench including
a mounting block having a groove, and a window frame having a plurality of openings for mounting transmitter components including a ball lens opening to mount a ball lens and a laser chip opening to mount a semiconductor laser chip, the window frame to couple to the mounting block; a semiconductor laser chip mounted to the laser chip opening of the window frame, the semiconductor laser chip to generate light signals for optical communication; and a ball lens mounted in the ball lens opening and extending into the groove, the ball lens to focus the light signals.
- 2. The optical transmitter of claim 1, wherein the groove is V-shaped.
- 3. The optical transmitter of claim 1, wherein the window frame is coupled to the mounting block using solder paste.
- 4. The optical transmitter of claim 1, wherein
the ball lens opening is a focusing ball lens opening and the ball lens is a focusing ball lens to focus light signals into a fiber optic cable.
- 5. The optical transmitter of claim 4, wherein
the window frame further includes
a collimating ball lens opening in the window frame, and the optical transmitter further includes
a collimating ball lens mounted in the collimating ball lens opening and extending into the groove, the collimating ball lens to collimate light signals from the semiconductor laser chip.
- 6. The optical transmitter of claim 5, wherein
the optical bench further includes
an optical isolator opening in the window frame and the optical transmitter further includes
an optical isolator mounted in the optical isolator opening and extending into the groove.
- 7. The optical transmitter of claim 1, wherein
the optical bench further includes
at least one submount opening in the window frame, and the optical transmitter further includes
a submount mounted in the at least one submount opening, and a monitoring photodiode coupled to the submount, the monitoring photodiode to monitor a monitoring light output from the semiconductor laser chip to provide automatic power control of the light signals.
- 8. The optical transmitter of claim 1, wherein
the mounting block is aluminum and plated with gold.
- 9. The optical transmitter of claim 1, wherein
the window frame is stainless-steel and plated with gold.
- 10. A method of manufacturing an optical transmitter including an optical bench, the method comprising:
forming a groove into a mounting block; forming a plurality of openings for mounting transmitter components including a ball lens opening to mount a ball lens and a laser chip opening to mount a laser chip in a window frame; coupling the window frame to the mounting block to form the optical bench; mounting a laser chip to the laser chip opening of the window frame, the laser chip to generate light signals for optical communication; and mounting a ball lens in the ball lens opening, the ball lens extending into the groove of the mounting block, the ball lens to focus the light signals.
- 11. The method of manufacturing of claim 10, wherein
the groove is V-shaped.
- 12. The method of manufacturing of claim 10, wherein
the window frame is coupled to the mounting block using solder paste.
- 13. The method of manufacturing of claim 10, wherein
the ball lens opening is a focusing ball lens opening and the ball lens is a focusing ball lens to focus light signals into a fiber optic cable.
- 14. The method of manufacturing of claim 13, further comprising:
forming a collimating ball lens opening in the window frame; and mounting a collimating ball lens in the collimating ball lens opening, the collimating ball lens extending into the groove, the collimating ball lens to collimate light signals from the laser chip.
- 15. The method of manufacturing of claim 14, further comprising:
forming an optical isolator opening in the window frame; and mounting an optical isolator in the optical isolator opening, the optical isolator extending into the groove.
- 16. The method of manufacturing of claim 10, further comprising:
forming submount openings in the window frame; and mounting a submount into the submount openings; and mounting a monitoring photodiode to the submount, the monitoring photodiode to monitor a light output from the laser chip to provide automatic power control.
- 17. The method of manufacturing of claim 10, further comprising:
forming the mounting block from aluminum; and plating the aluminum mounting block with gold.
- 18. The method of manufacturing of claim 10, further comprising:
forming the window frame from stainless-steel; and plating the window frame with gold.
- 19. An optical transmitter package to enclose an optical transmitter comprising:
a protective case to enclose an optical transmitter mounted with an optical bench and components of a printed circuit board, the optical transmitter mounted to the printed circuit board, the protective case mounted near the edges of the printed circuit board, the optical transmitter mounted with an optical bench including:
a mounting block having a groove; a window frame having a plurality of openings for mounting transmitter components including a ball lens opening to mount a ball lens and a laser chip openings to mount a laser chip, the window frame coupled to the mounting block to form an optical bench; a laser chip mounted to the laser opening of the window frame, the laser chip to generate light signals for optical communication; a ball lens mounted in the ball lens opening and extending into the groove, the ball lens to focus the light signals; and an optical plug mounted to an opening in a front wall of the protective case adjacent the ball lens of the optical transmitter to allow the optical transmitter to focus light signals into a fiber optic cable connected to the optical plug.
- 20. The optical transmitter package of claim 19, wherein
the protective case is a made from a metallic alloy.
- 21. The optical transmitter package of claim 20, wherein
the metallic alloy is KOVAR.
- 22. The optical transmitter package of claim 19, wherein
the protective case is secured near the edges of the printed circuit board by a solder alloy.
- 23. The optical transmitter package of claim 22, wherein
the solder alloy is a mixture of gold and tin.
- 24. The optical transmitter package of claim 19, wherein
the optical plug mounted to the opening of the front wall of the protective case includes
a fiber connector ferrule, a sleeve, and a window ring, the window ring brazed to the front wall of the protective case around the opening, and the fiber connector ferrule and the sleeve welded to the window ring.
- 25. The optical transmitter package of claim 24, wherein
a window is attached to the window ring such that it fits in the opening in the front wall of the protective case.
- 26. The optical transmitter package of claim 25, wherein
the window is a glass and operates as a lens to focus light signals into a fiber optic cable connected to the optical plug.
- 27. The optical transmitter package of claim 26, wherein
the window is sapphire.
- 28. The optical transmitter package of claim 19, wherein
the groove is V-shaped.
- 29. The optical transmitter package of claim 19, wherein
the window frame is mounted to the mounting block using solder paste.
- 30. The optical transmitter package of claim 19, wherein
the ball lens opening is a focusing ball lens opening and the ball lens is a focusing ball lens to focus light signals into a fiber optic cable.
- 31. The optical transmitter package of claim 19, wherein
the mounting block is aluminum and plated with gold.
- 32. The optical transmitter package of claim 19, wherein
the window frame is stainless-steel and plated with gold.
- 33. A method of manufacturing an optical transmitter package to enclose an optical transmitter, the method comprising:
mounting a protective case near the edges of the printed circuit board to enclose an optical transmitter mounted with an optical bench which is mounted to the printed circuit board and to enclose components of the printed circuit board; the optical transmitter mounted with an optical bench including:
a mounting block having a groove; a window frame having a plurality of openings for mounting transmitter components including a ball lens opening to mount a ball lens and a laser chip openings to mount a laser chip, the window frame mounted to the mounting block to form an optical bench; a laser chip mounted to the laser opening of the window frame, the laser chip to generate light signals for optical communication; a ball lens mounted in the ball lens opening and extending into the groove, the ball lens to focus the light signals; and mounting an optical plug to an opening in a front wall of the protective case adjacent the ball lens of the optical transmitter to allow the optical transmitter to focus light signals into a fiber optic cable connected to the optical plug.
- 34. The method of manufacturing of claim 33, wherein
the protective case is a made from a metallic alloy.
- 35. The method of manufacturing of claim 34, wherein
the metallic alloy is KOVAR.
- 36. The method of manufacturing of claim 33, wherein the protective case is secured near the edges of the printed circuit board by a solder alloy.
- 37. The method of manufacturing of claim 36, wherein
the solder alloy is a mixture of gold and tin.
- 38. The method of manufacturing of claim 33, wherein
the optical plug mounted to the opening of the front wall of the protective case is formed by:
brazing a window ring to the front wall of the protective case around the opening; and welding a fiber connector ferrule and a sleeve to the window ring.
- 39. The method of manufacturing of claim 38, further comprising:
attaching a window to the window ring such that it fits in the opening in the front wall of the protective case.
- 40. The method of manufacturing of claim 39, wherein the window is a glass and operates as a lens to focus light signals into a fiber optic cable connected to the optical plug.
- 41. The method of manufacturing of claim 40, wherein
the window is sapphire.
- 42. The method of manufacturing of claim 33, wherein
the groove is V-shaped.
- 43. The method of manufacturing of claim 33, wherein
the window frame is mounted to the mounting block using solder paste.
- 44. The method of manufacturing of claim 33, wherein
the ball lens opening is a focusing ball lens opening and the ball lens is a focusing ball lens to focus light signals into a fiber optic cable.
- 45. The method of manufacturing of claim 33, wherein
the mounting block is aluminum and plated with gold.
- 46. The method of manufacturing of claim 33, wherein
the window frame is stainless-steel and plated with gold.
- 47. A light transmitter to transmit light signals over an optical fiber, the light transmitter comprising:
a hybrid optical bench including
a mounting block having a groove, and a window frame to couple to the mounting block, the window frame having a plurality of openings to mount a plurality of components therein; a semiconductor laser coupled to the hybrid optical bench, the semiconductor laser to generate a transmit light signal; a first lens mounted in a first opening of the plurality of openings in the window frame and extending into the groove of the mounting block, the first lens to collimate the transmit light signal; an optical isolator mounted in a second opening of the plurality of openings in the window frame and extending into the groove of the mounting block, the optical isolator to deter reflection of the transmit light signal back towards the first lens and the semiconductor laser; and, a second lens mounted in a third opening of the plurality of openings in the window frame and extending into the groove of the mounting block, the second lens to focus the transmit light signal into the optical fiber.
- 48. The light transmitter of claim 47, wherein
the groove is V-shaped.
- 49. The light transmitter of claim 47, wherein
the groove is U-shaped.
- 50. The light transmitter of claim 47, wherein
the window frame is coupled to the mounting block by solder.
- 51. The light transmitter of claim 47, wherein
the semiconductor laser is coupled to the hybrid optical bench in a fourth opening of the plurality of openings in the window frame.
- 52. The light transmitter of claim 47, further comprising:
a printed circuit board to couple to the hybrid optical bench; a protective case to protect and cover the hybrid optical bench and a portion of the printed circuit board; and an optical plug coupled to a wall of the protective case and aligned with the hybrid optical bench to couple the transmit light signal into the optical fiber.
- 53. The light transmitter of claim 52, wherein
the protective case is coupled to a surface of the printed circuit board near edges thereof.
- 54. The light transmitter of claim 52, wherein
the optical plug includes
a window ring having a window aligned with the hybrid optical bench to couple the transmit light signal into the optical fiber, the window ring coupled to the wall of the protective case around an opening therein, a fiber connector ferrule coupled to the window ring, and a sleeve coupled to the window ring over the fiber connector ferrule.
- 55. The light transmitter of claim 52, wherein
the printed circuit board includes pins to couple to a host system.
- 56. The light transmitter of claim 52, wherein
the printed circuit board includes a first connector to plug into a second connector of a host system.
- 57. The light transmitter of claim 47, wherein
the semiconductor laser to generate a monitor light signal, and the light transmitter further includes
a photodiode coupled to the hybrid optical bench to receive the monitor light signal and generate an electrical signal to provide automatic power control.
- 58. The light transmitter of claim 52, wherein
the semiconductor laser is an edge emitting semiconductor laser and generates the transmit light signal from a front edge and the monitor light signal from a back edge.
- 59. The light transmitter of claim 52, wherein
the semiconductor laser is a vertical cavity surface emitting semiconductor laser and generates the transmit light signal from a surface and the monitor light signal is a portion of the transmit light signal coupled into the photodiode.
- 60. The light transmitter of claim 47, wherein
the mounting block is an aluminum block plated with gold.
- 61. The light transmitter of claim 47, wherein
the window frame is a stainless-steel frame plated with gold.
- 62. A fiber optic transmitter to transmit light signals over an optical fiber, the fiber optic transmitter comprising:
an optical bench including
a metallic mounting block having a groove, and a metallic window frame coupled to the metallic mounting block, the metallic window frame having openings in line with the groove in the metallic mounting block to allow optical components to mount to the optical bench; a semiconductor laser coupled to the optical bench, the semiconductor laser to generate a radiated light signal; a first ball lens mounted to the optical bench in a first opening in the metallic window frame and extending into the groove of the metallic mounting block, the first ball lens to collimate the radiated light signal into a collimated light signal; an optical isolator mounted to the optical bench in a second opening of the metallic window frame and extending into the groove of the metallic mounting block, the optical isolator to receive the collimated light signal and generate an isolated light signal; and a second ball lens mounted in a third opening of the metallic window frame and extending into the groove of the metallic mounting block, the second ball lens to focus the isolated light signal into a focused light signal for coupling into the optical fiber.
- 63. The fiber optic transmitter of claim 62, wherein
the optical isolator to isolate the first ball lens and the semiconductor laser from reflections of the isolated light signal off of the second ball lens.
- 64. The fiber optic transmitter of claim 62, wherein
the groove is V-shaped.
- 65. The fiber optic transmitter of claim 62, wherein
the groove is U-shaped.
- 66. The fiber optic transmitter of claim 62, further comprising:
a printed circuit board to couple to the optical bench; a protective case to protect and cover the optical bench and a portion of the printed circuit board, the protective case having an opening in a wall aligned with the groove in the optical axis of the optical bench; and an optical plug coupled around the opening in the wall of the protective case to couple the focused light signal into the optical fiber.
- 67. The fiber optic transmitter of claim 66, wherein
the optical plug includes
a window ring having a window aligned with the optical axis of the optical bench, the window ring coupled to the wall of the protective case around the opening therein, a fiber connector ferrule coupled to the window ring, and a sleeve coupled to the window ring over the fiber connector ferrule.
- 68. The fiber optic transmitter of claim 66, wherein
the printed circuit board includes pins to couple to a host system.
- 69. The fiber optic transmitter of claim 66, wherein
the printed circuit board includes a first connector to plug into a second connector of a host system.
- 70. The fiber optic transmitter of claim 62, wherein
a monitor light signal is formed responsive to the radiated light signal of the semiconductor laser, and the fiber optic transmitter further includes
a photodiode coupled to the optical bench to receive the monitor light signal and generate an electrical signal in response thereto for automatic power control.
- 71. A packaged fiber optic module to transmit photons over an optical fiber, the packaged fiber optic module comprising:
a protective case having an opening in a side and an optical plug coupled around the opening to the side, the optical plug to align and couple to the optical fiber; a printed circuit board physically coupled to the protective case without electrically coupling thereto; an optical bench coupled to the printed circuit board, the optical bench defining an optical axis with a groove and a frame having openings aligned with the optical axis; a semiconductor laser coupled to the optical bench in alignment with the optical axis, the semiconductor laser to generate photons in response to receiving a first electrical signal; a first ball lens mounted in the groove of the optical bench through a first opening in the frame, the first ball lens in alignment with the optical axis; an optical isolator mounted in the groove of the optical bench through a second opening in the frame, the optical isolator in alignment with the optical axis; and a second ball lens mounted in the groove of the optical bench through a third opening in the frame, the second ball lens in alignment with the optical axis.
- 72. The packaged fiber optic module of claim 71, wherein
a portion of the groove is substantially V-shaped.
- 73. The packaged fiber optic module of claim 71, wherein
a portion of the groove is substantially U-shaped.
- 74. The packaged fiber optic module of claim 71, wherein,
the semiconductor laser is an edge emitting semiconductor laser and emits photons out from a front edge and a back edge, and the packaged fiber optic module further includes
a semiconductor photodiode coupled to the optical bench in alignment with the optical axis, the semiconductor photodiode to generate a second electrical signal in response to receiving photons out from the back edge of the semiconductor laser.
- 75. The packaged fiber optic module of claim 71, further comprising:
a semiconductor photodiode coupled to the optical bench, the semiconductor photodiode to generate a second electrical signal in response to receiving a portion of the photons generated by the semiconductor laser.
- 76. The packaged fiber optic module of claim 71, wherein
the optical plug includes
a window ring having a window aligned with the optical axis of the optical bench, the window ring coupled to the side of the protective case around the opening therein, a fiber connector ferrule coupled to the window ring, and a sleeve coupled to the window ring over the fiber connector ferrule.
- 77. The packaged fiber optic module of claim 76, wherein
the window is sapphire.
- 78. The packaged fiber optic module of claim 71, wherein
the printed circuit board includes pins to couple to a host system.
- 79. The packaged fiber optic module of claim 71, wherein
the printed circuit board includes a first connector to plug into a second connector of a host system.
- 80. The packaged fiber optic module of claim 71, wherein
the optical bench to maintain optical axis alignment of optical and electro-optical components mounted thereto; the semiconductor laser to generate the photons as a transmit light signal; the first ball lens to collimate the transmit light signal; the optical isolator to deter back reflections of the transmit light signal off of the second ball lens; and the second ball lens to focus the transmit light signal into the optical fiber.
- 81. The packaged fiber optic module of claim 80, wherein
the protective case to seal out particulates; and the printed circuit board to provide one or more electrical connections between a host system and the packaged fiber optic module.
- 82. The packaged fiber optic module of claim 71, wherein
the optical bench includes
a mounting block having the groove, and the frame coupled to mounting block.
- 83. The packaged fiber optic module of claim 82, wherein
the mounting block is an aluminum block plated with gold.
- 84. The packaged fiber optic module of claim 83, wherein
the frame is a stainless-steel frame plated with gold.
- 85. The packaged fiber optic module of claim 71, wherein
the protective case is metallic.
- 86. The packaged fiber optic module of claim 71, wherein
the protective case is a metallic alloy of KOVAR.
- 87. A packaged fiber optic module comprising:
a protective case having an opening in a side and an optical plug coupled around the opening to the side, the optical plug to align and couple to the optical fiber; a printed circuit board physically coupled to the protective case without electrically coupling thereto; an optical bench coupled to the printed circuit board, the optical bench defining an optical axis with a groove and a frame having openings aligned with the optical axis; an opto-electronic device coupled to the optical bench in alignment with the optical axis; and a first ball lens mounted in the groove of the optical bench through a first opening in the frame, the first ball lens in alignment with the optical axis.
- 88. The packaged fiber optic module of claim 87, wherein
a portion of the groove is substantially V-shaped.
- 89. The packaged fiber optic module of claim 87, wherein
a portion of the groove is substantially U-shaped.
- 90. The packaged fiber optic module of claim 87, wherein,
the opto-electronic device is a semiconductor laser to generate photons in response to receiving a first electrical signal and the packaged fiber optic module further includes
an optical isolator mounted in the groove of the optical bench through a second opening in the frame, the optical isolator in alignment with the optical axis; and a second ball lens mounted in the groove of the optical bench through a third opening in the frame, the second ball lens in alignment with the optical axis.
- 91. The packaged fiber optic module of claim 87, wherein
the opto-electronic device is a semiconductor photodiode to generate a second electrical signal in response to receiving photons from the fiber optic cable.
- 92. The packaged fiber optic module of claim 87, wherein
the optical plug includes
a window ring having a window aligned with the optical axis of the optical bench, the window ring coupled to the side of the protective case around the opening therein, a fiber connector ferrule coupled to the window ring, and a sleeve coupled to the window ring over the fiber connector ferrule.
- 93. The packaged fiber optic module of claim 92, wherein
the window is sapphire.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This U.S. Non-Provisional Patent Application claims the benefit of U.S. Provisional Patent Application No. 60/377,345 entitled “TRANSMITTERS, RECEIVERS, AND TRANSCEIVERS INCLUDING AN OPTICAL BENCH”, filed May 1, 2002 by Liew Chuang Chiu et al.
Provisional Applications (1)
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Number |
Date |
Country |
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60377345 |
May 2002 |
US |