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Akira SAITO
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Minami-Alps, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Die bonding apparatus, cleaning head and manufacturing method for s...
Patent number
12,053,806
Issue date
Aug 6, 2024
FASFORD TECHNOLOGY CO., LTD.
Itsuki Ikarashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus and manufacturing method for...
Patent number
11,569,118
Issue date
Jan 31, 2023
FASFORD TECHNOLOGY CO., LTD.
Tsuyoshi Yokomori
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Manufacturing Device, Push-up Unit, and Method of Man...
Publication number
20240312825
Publication date
Sep 19, 2024
Fasford Technology Co., Ltd.
Akira Saito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
Publication number
20230120615
Publication date
Apr 20, 2023
Fasford Technology Co., Ltd.
Tsuyoshi YOKOMORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
Publication number
20220238357
Publication date
Jul 28, 2022
Fasford Technology Co., Ltd.
Akira SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonding Apparatus, Cleaning Head and Manufacturing Method for S...
Publication number
20220055077
Publication date
Feb 24, 2022
Fasford Technology Co., Ltd.
Itsuki IKARASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
Publication number
20200312699
Publication date
Oct 1, 2020
Fasford Technology Co., Ltd.
Tsuyoshi YOKOMORI
H01 - BASIC ELECTRIC ELEMENTS