Alfred Yeo

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional stack of leaded package and electronic member
- Patent number 9,698,083
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Alfred Swain Hong Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with core region and bond pad a...
- Patent number 8,603,909
- Issue date Dec 10, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method for crack stop structure enhancement of integrat...
- Patent number 8,048,761
- Issue date Nov 1, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system and method of manufacture thereof
- Patent number 7,892,963
- Issue date Feb 22, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-dimensional stack of leaded package and electronic member
- Publication number 20150348882
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Alfred Swain Hong YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK STOP STRUCTURE ENHANCEMENT OF THE INTEGRATED CIRCUIT SEAL RING
- Publication number 20120074519
- Publication date Mar 29, 2012
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND PAD AND METHOD OF MAN...
- Publication number 20110101545
- Publication date May 5, 2011
- Chartered Semiconductor Manufacturing LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100270670
- Publication date Oct 28, 2010
- Chartered Semiconductor Manufacturing LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS