Axel Preusse

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for forming a copper interconnect
- Patent number 6,362,100
- Issue date Mar 26, 2002
- Advanced Micro Devices, Inc.
- Takeshi Nogami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for forming a copper interconnect
- Patent number 6,106,680
- Issue date Aug 22, 2000
- AMD
- Takeshi Nogami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming reliable copper interconnects with improved hole...
- Patent number 6,103,086
- Issue date Aug 15, 2000
- Advanced Micro Devices, Inc.
- Christy Woo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR