Bruno Geoffrion

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method to divide fluid flow in a predetermined ratio
- Patent number 9,405,298
- Issue date Aug 2, 2016
- Applied Materials, Inc.
- Bruno Geoffrion
- G05 - CONTROLLING REGULATING
Information Patent Grant
Plasma reactor apparatus with multiple gas injection zones having t...
- Patent number 8,231,799
- Issue date Jul 31, 2012
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling gas flow to a processing chamber
- Patent number 8,074,677
- Issue date Dec 13, 2011
- Applied Materials, Inc.
- Ezra Robert Gold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for controlling gas flow to a processing chamber
- Patent number 7,846,497
- Issue date Dec 7, 2010
- Applied Materials, Inc.
- Ezra Robert Gold
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for controlling gas flow to a processing chamber
- Patent number 7,775,236
- Issue date Aug 17, 2010
- Applied Materials, Inc.
- Ezra Robert Gold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas distribution system for improved transient phase deposition
- Patent number 7,722,737
- Issue date May 25, 2010
- Applied Materials, Inc.
- Sudhir Gondhalekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etch process with separately fed carbon-lean and carbon-rich...
- Patent number 7,541,292
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process using polymerizing etch gases across a wafer su...
- Patent number 7,540,971
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process using polymerizing etch gases with different et...
- Patent number 7,431,859
- Issue date Oct 7, 2008
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide...
- Patent number 7,189,639
- Issue date Mar 13, 2007
- Applied Materials, Inc.
- Padmanabhan Krishnaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high aspect ratio HDP CVD gapfill
- Patent number 7,064,077
- Issue date Jun 20, 2006
- Applied Materials
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
HDP-CVD uniformity control
- Patent number 6,890,597
- Issue date May 10, 2005
- Applied Materials, Inc.
- Padmanabhan Krishnaraj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for high aspect ratio HDP CVD gapfill
- Patent number 6,812,153
- Issue date Nov 2, 2004
- Applied Materials Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER
- Publication number 20080202588
- Publication date Aug 28, 2008
- Ezra Robert Gold
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER
- Publication number 20080202609
- Publication date Aug 28, 2008
- EZRA ROBERT GOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER
- Publication number 20080202610
- Publication date Aug 28, 2008
- EZRA ROBERT GOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO DIVIDE FLUID FLOW IN A PREDETERMINED RATIO
- Publication number 20080115834
- Publication date May 22, 2008
- Applied Materials, Inc.
- Bruno Geoffrion
- G05 - CONTROLLING REGULATING
Information Patent Application
Gas Distribution System for Improved Transient Phase Deposition
- Publication number 20080041821
- Publication date Feb 21, 2008
- Applied Materials, Inc.
- Sudhir Gondhalekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma etch process using polymerizing etch gases across a wafer su...
- Publication number 20070251917
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using polymerizing etch gases and an inert dilu...
- Publication number 20070254483
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma reactor apparatus with multiple gas injection zones having t...
- Publication number 20070251642
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using polymerizing etch gases with different et...
- Publication number 20070251918
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process with separately fed carbon-lean and carbon-rich...
- Publication number 20070254486
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide...
- Publication number 20060178003
- Publication date Aug 10, 2006
- Applied Materials, Inc.
- Padmanabhan Krishnaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas distribution system for improved transient phase deposition
- Publication number 20060113038
- Publication date Jun 1, 2006
- Applied Materials, Inc.
- Sudhir Gondhalekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for high aspect ratio HDP CVD gapfill
- Publication number 20050079715
- Publication date Apr 14, 2005
- Applied Materials, Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HDP-CVD uniformity control
- Publication number 20040224090
- Publication date Nov 11, 2004
- Applied Materials, Inc.
- Padmanabhan Krishnaraj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for high aspect ratio HDP CVD gapfill
- Publication number 20030203637
- Publication date Oct 30, 2003
- Applied Materials, Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Bruno Geoffrion

Person

Patents Grantslast 30 patents

System and method to divide fluid flow in a predetermined ratio

Plasma reactor apparatus with multiple gas injection zones having t...

Method and apparatus for controlling gas flow to a processing chamber

Method and apparatus for controlling gas flow to a processing chamber

Method and apparatus for controlling gas flow to a processing chamber

Gas distribution system for improved transient phase deposition

Plasma etch process with separately fed carbon-lean and carbon-rich...

Plasma etch process using polymerizing etch gases across a wafer su...

Plasma etch process using polymerizing etch gases with different et...

Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide...

Method for high aspect ratio HDP CVD gapfill

HDP-CVD uniformity control

Method for high aspect ratio HDP CVD gapfill

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER

METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER

METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER

SYSTEM AND METHOD TO DIVIDE FLUID FLOW IN A PREDETERMINED RATIO

Gas Distribution System for Improved Transient Phase Deposition

Plasma etch process using polymerizing etch gases across a wafer su...

Plasma etch process using polymerizing etch gases and an inert dilu...

Plasma reactor apparatus with multiple gas injection zones having t...

Plasma etch process using polymerizing etch gases with different et...

Plasma etch process with separately fed carbon-lean and carbon-rich...

Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide...

Gas distribution system for improved transient phase deposition

Method for high aspect ratio HDP CVD gapfill

HDP-CVD uniformity control

Method for high aspect ratio HDP CVD gapfill