Bum Sik Jang

Person

Suwon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,161,479
- Issue date Oct 13, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Bum Sik Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power package module with low and high power chips and method for f...
- Patent number 8,575,756
- Issue date Nov 5, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Bum Sik Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method of manufacturing the same
- Patent number 8,309,399
- Issue date Nov 13, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method of manufacturing the same
- Patent number 8,058,722
- Issue date Nov 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 8,017,437
- Issue date Sep 13, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 7,875,497
- Issue date Jan 25, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,875,983
- Issue date Jan 25, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150173246
- Publication date Jun 18, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Bum Sik Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND POWER MODU...
- Publication number 20150146382
- Publication date May 28, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Bum Sik Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EJECTOR AND CHIP REMOVAL METHOD USING THE SAME
- Publication number 20140027049
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yong Hui JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120273116
- Publication date Nov 1, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ho SOHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120104621
- Publication date May 3, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bum Sik Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120015484
- Publication date Jan 19, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110031608
- Publication date Feb 10, 2011
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110012252
- Publication date Jan 20, 2011
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100294543
- Publication date Nov 25, 2010
- Young Ho Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20100295172
- Publication date Nov 25, 2010
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor package
- Publication number 20100087035
- Publication date Apr 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semicondictor package
- Publication number 20100087034
- Publication date Apr 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20100084754
- Publication date Apr 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Bum Sik Jang

Person

Patents Grantslast 30 patents

Power module package and method for manufacturing the same

Power package module with low and high power chips and method for f...

Power semiconductor module and method of manufacturing the same

Power semiconductor module and method of manufacturing the same

Method for manufacturing a semiconductor package

Method of manufacturing a semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND POWER MODU...

CHIP EJECTOR AND CHIP REMOVAL METHOD USING THE SAME

HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

Method for manufacturing a semiconductor package

Method of manufacturing a semicondictor package

Semiconductor package