Chae-Sung LEE

Person

Icheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stack packages and methods of manufacturing the same
- Patent number 11,804,474
- Issue date Oct 31, 2023
- SK hynix Inc.
- Ki Jun Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including vertical interconnector
- Patent number 11,784,162
- Issue date Oct 10, 2023
- SK hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a wire and a method of fabricating...
- Patent number 11,502,028
- Issue date Nov 15, 2022
- SK hynix Inc.
- Chae Sung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including vertical interconnector
- Patent number 11,444,063
- Issue date Sep 13, 2022
- SK hynix Inc.
- Ki Jun Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,222,872
- Issue date Jan 11, 2022
- SK hynix Inc.
- Chae-Sung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240234379
- Publication date Jul 11, 2024
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240030192
- Publication date Jan 25, 2024
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220293564
- Publication date Sep 15, 2022
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING VERTICAL INTERCONNECTOR
- Publication number 20220230994
- Publication date Jul 21, 2022
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING...
- Publication number 20220108942
- Publication date Apr 7, 2022
- SK HYNIX INC.
- Chae Sung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING VERTICAL INTERCONNECTOR
- Publication number 20220059503
- Publication date Feb 24, 2022
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210074679
- Publication date Mar 11, 2021
- SK HYNIX INC.
- Chae-Sung LEE
- H01 - BASIC ELECTRIC ELEMENTS

Chae-Sung LEE

Person

Patents Grantslast 30 patents

Stack packages and methods of manufacturing the same

Semiconductor package including vertical interconnector

Semiconductor package including a wire and a method of fabricating...

Semiconductor package including vertical interconnector

Semiconductor package including stacked semiconductor chips

Patents Applicationslast 30 patents

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING VERTICAL INTERCONNECTOR

SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING...

SEMICONDUCTOR PACKAGE INCLUDING VERTICAL INTERCONNECTOR

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS