Chao Feng Yeh

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Patents Grantslast 30 patents

Information Patent Grant
Vertical transistors with sidewall gate air gaps and methods therefor
- Patent number 10,355,129
- Issue date Jul 16, 2019
- SanDisk Technologies LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of hole-type surround gate vertical field effect transistors...
- Patent number 10,290,681
- Issue date May 14, 2019
- SanDisk Technologies LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistors with sidewall gate air gaps and methods therefor
- Patent number 10,115,820
- Issue date Oct 30, 2018
- SanDisk Technologies LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device containing wrap gate vertical select transistors and...
- Patent number 10,079,267
- Issue date Sep 18, 2018
- SanDisk Technologies LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming crack free gap fill
- Patent number 8,937,011
- Issue date Jan 20, 2015
- Sandisk 3D LLC
- Hiroaki Iuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of inhibiting wire collapse
- Patent number 8,802,561
- Issue date Aug 12, 2014
- Sandisk 3D LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARRAY OF HOLE-TYPE SURROUND GATE VERTICAL FIELD EFFECT TRANSISTORS...
- Publication number 20190088717
- Publication date Mar 21, 2019
- SanDisk Technologies LLC
- Chao Feng YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS WITH SIDEWALL GATE AIR GAPS AND METHODS THEREFOR
- Publication number 20180301556
- Publication date Oct 18, 2018
- SANDISK TECHNOLOGIES LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS WITH SIDEWALL GATE AIR GAPS AND METHODS THEREFOR
- Publication number 20180158947
- Publication date Jun 7, 2018
- SanDisk Technologies LLC
- Chao Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CRACK FREE GAP FILL
- Publication number 20140170847
- Publication date Jun 19, 2014
- SanDisk 3D LLC
- Hiroaki Iuchi
- H01 - BASIC ELECTRIC ELEMENTS