Chender Huang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of package structure with simplified encapsulati...
- Patent number 8,685,834
- Issue date Apr 1, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 7,638,887
- Issue date Dec 29, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matrix form semiconductor package substrate having an electrode of...
- Patent number 7,443,010
- Issue date Oct 28, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 7,390,697
- Issue date Jun 24, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and package structure utilizing the same
- Patent number 7,378,731
- Issue date May 27, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor wafer with r...
- Patent number 7,294,937
- Issue date Nov 13, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and package structure utilizing the same
- Patent number 7,190,066
- Issue date Mar 13, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bond pad structures and methods of manufacturing thereof
- Patent number 7,157,734
- Issue date Jan 2, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor wafer with r...
- Patent number 7,126,225
- Issue date Oct 24, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dispensing enhancement for high performance flip chip BGA (...
- Patent number 7,026,711
- Issue date Apr 11, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Daniel Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stress reduction in flip chip bump during flip chip moun...
- Patent number 7,015,066
- Issue date Mar 21, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buildup substrate pad pre-solder bump manufacturing
- Patent number 6,960,518
- Issue date Nov 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 6,884,662
- Issue date Apr 26, 2005
- Taiwan Semiconductor Manufacturing Company
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of protecting a passivation layer during solder bump formation
- Patent number 6,782,897
- Issue date Aug 31, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for low-stress concentration solder bumps
- Patent number 6,774,026
- Issue date Aug 10, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallization structure
- Patent number 6,770,958
- Issue date Aug 3, 2004
- Taiwan Semiconductor Manufacturing Company
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical performance enhanced wafer level chip scale package with...
- Patent number 6,656,827
- Issue date Dec 2, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting the front side of semiconductor wafers
- Patent number 6,638,837
- Issue date Oct 28, 2003
- Taiwan Semiconductor Manufacturing Company
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an under bump metallization structure
- Patent number 6,596,619
- Issue date Jul 22, 2003
- Taiwan Semiconductor Manufacturing Company
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal patterned structure for SiN surface adhesion enhancement
- Patent number 6,528,417
- Issue date Mar 4, 2003
- Taiwan Semiconductor Manufacturing Company
- Chung-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wafer level chip scale package with discrete...
- Patent number 6,372,619
- Issue date Apr 16, 2002
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package structure and fabrication method thereof
- Publication number 20100068846
- Publication date Mar 18, 2010
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
- Publication number 20070238283
- Publication date Oct 11, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and package structure utilizing the same
- Publication number 20070138627
- Publication date Jun 21, 2007
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package with thermally-enhanced heat spreader
- Publication number 20060278975
- Publication date Dec 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BOND PAD STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20060267008
- Publication date Nov 30, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing a semiconductor wafer with r...
- Publication number 20060261490
- Publication date Nov 23, 2006
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-cavity semiconductor packages
- Publication number 20060231960
- Publication date Oct 19, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and package structure utilizing the same
- Publication number 20060202326
- Publication date Sep 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and fabrication method thereof
- Publication number 20060163714
- Publication date Jul 27, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test pad and probe card for wafer acceptance testing and other appl...
- Publication number 20060109014
- Publication date May 25, 2006
- Te-Tsung Chao
- G01 - MEASURING TESTING
Information Patent Application
Fine pitch bonding pad layout and method of manufacturing same
- Publication number 20060091535
- Publication date May 4, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE FOR FLIP CHIP PACKAGING
- Publication number 20060076681
- Publication date Apr 13, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three dimensional package type stacking for thinner package applica...
- Publication number 20060073635
- Publication date Apr 6, 2006
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional package and packaging method for integrated circuits
- Publication number 20060065958
- Publication date Mar 30, 2006
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE HAVING GROUND IC CHIP AND METHOD OF MANUFACTURING SAME
- Publication number 20060060980
- Publication date Mar 23, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked packaging methods and structures
- Publication number 20060043556
- Publication date Mar 2, 2006
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced adhesion strength between mold resin and polyimide
- Publication number 20050167807
- Publication date Aug 4, 2005
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal dispensing enhancement for high performance flip chip BGA (...
- Publication number 20050127502
- Publication date Jun 16, 2005
- Taiwan Semiconductor Manufacturing Co., LTD
- Daniel Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for low-stress concentration solder bumps
- Publication number 20040217482
- Publication date Nov 4, 2004
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing a semiconductor wafer with r...
- Publication number 20040207078
- Publication date Oct 21, 2004
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of protecting a passivation layer during solder bump formation
- Publication number 20030219987
- Publication date Nov 27, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE
- Publication number 20030216039
- Publication date Nov 20, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of wafer level chip scale packaging
- Publication number 20030211720
- Publication date Nov 13, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stress reduction in flip chip bump during flip chip moun...
- Publication number 20030045028
- Publication date Mar 6, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Matrix form semiconductor package substrate having an electrode of...
- Publication number 20020145178
- Publication date Oct 10, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Chender Huang

Person

Patents Grantslast 30 patents

Fabrication method of package structure with simplified encapsulati...

Package structure and fabrication method thereof

Matrix form semiconductor package substrate having an electrode of...

Enhanced adhesion strength between mold resin and polyimide

Heat spreader and package structure utilizing the same

Apparatus and method for manufacturing a semiconductor wafer with r...

Heat spreader and package structure utilizing the same

Semiconductor bond pad structures and methods of manufacturing thereof

Apparatus and method for manufacturing a semiconductor wafer with r...

Thermal dispensing enhancement for high performance flip chip BGA (...

Method for stress reduction in flip chip bump during flip chip moun...

Buildup substrate pad pre-solder bump manufacturing

Enhanced adhesion strength between mold resin and polyimide

Method of protecting a passivation layer during solder bump formation

Structure and method for low-stress concentration solder bumps

Under bump metallization structure

Electrical performance enhanced wafer level chip scale package with...

Method for protecting the front side of semiconductor wafers

Method for fabricating an under bump metallization structure

Metal patterned structure for SiN surface adhesion enhancement

Method for fabricating wafer level chip scale package with discrete...

Patents Applicationslast 30 patents

Package structure and fabrication method thereof

NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING

Heat spreader and package structure utilizing the same

Ball grid array package with thermally-enhanced heat spreader

SEMICONDUCTOR BOND PAD STRUCTURES AND METHODS OF MANUFACTURING THEREOF

Apparatus and method for manufacturing a semiconductor wafer with r...

Non-cavity semiconductor packages

Heat spreader and package structure utilizing the same

Package structure and fabrication method thereof

Test pad and probe card for wafer acceptance testing and other appl...

Fine pitch bonding pad layout and method of manufacturing same

SEMICONDUCTOR PACKAGE SUBSTRATE FOR FLIP CHIP PACKAGING

Three dimensional package type stacking for thinner package applica...

Three dimensional package and packaging method for integrated circuits

IC PACKAGE HAVING GROUND IC CHIP AND METHOD OF MANUFACTURING SAME

Stacked packaging methods and structures

Enhanced adhesion strength between mold resin and polyimide

Thermal dispensing enhancement for high performance flip chip BGA (...

Structure and method for low-stress concentration solder bumps

Apparatus and method for manufacturing a semiconductor wafer with r...

Method of protecting a passivation layer during solder bump formation

METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE

Method of wafer level chip scale packaging

Method for stress reduction in flip chip bump during flip chip moun...

Matrix form semiconductor package substrate having an electrode of...