Cheol-Ho Heo

Person

Busanjin-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 8,624,123
- Issue date Jan 7, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,568,861
- Issue date Oct 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,481,171
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Radiant heat substrate and method for manufacturing the radiant hea...
- Patent number 8,368,291
- Issue date Feb 5, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ho Seo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150017477
- Publication date Jan 15, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho HEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR LED MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140021851
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR...
- Publication number 20130256709
- Publication date Oct 3, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...
- Publication number 20130183479
- Publication date Jul 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun CHONG
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130160978
- Publication date Jun 27, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hyun SHIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Printed Circuit Board and Method Of Manufacturing The Same
- Publication number 20130139383
- Publication date Jun 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kye Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING SUBSTRATE
- Publication number 20120275116
- Publication date Nov 1, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120199381
- Publication date Aug 9, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Cheol Ho Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat radiating substrate and method of manufacturing the same
- Publication number 20120085574
- Publication date Apr 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEA...
- Publication number 20120043875
- Publication date Feb 23, 2012
- Samsung Electro-Mechanics CO., LTD.
- Ki Ho Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120001544
- Publication date Jan 5, 2012
- Samsung Electro-Mechanics CO., LTD.
- Tae Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110316035
- Publication date Dec 29, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hyun Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME
- Publication number 20110266038
- Publication date Nov 3, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kye Won CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting device package and method for manufacturing the same
- Publication number 20110101406
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat radiating structure and method for manufacturing the same
- Publication number 20110100616
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...
- Publication number 20100304162
- Publication date Dec 2, 2010
- Samsung Electro-Mechanics CO., LTD.
- Myung Gun CHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing PCB and PCB manufactured by the same
- Publication number 20090277679
- Publication date Nov 12, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method of the same
- Publication number 20090133920
- Publication date May 28, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Keun-Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radiant heat printed circuit board and method of fabricating the same
- Publication number 20080277146
- Publication date Nov 13, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yun Seok Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cheol-Ho Heo

Person

Patents Grantslast 30 patents

Printed circuit board

Metallic laminate and manufacturing method of light emitting diode...

Metallic laminate and manufacturing method of light emitting diode...

Radiant heat substrate and method for manufacturing the radiant hea...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SUBSTRATE FOR LED MODULE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR...

METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Printed Circuit Board and Method Of Manufacturing The Same

HEAT RADIATING SUBSTRATE

PRINTED CIRCUIT BOARD

Heat radiating substrate and method of manufacturing the same

RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEA...

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME

Light emitting device package and method for manufacturing the same

Heat radiating structure and method for manufacturing the same

METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...

Method of manufacturing PCB and PCB manufactured by the same

Printed circuit board and manufacturing method of the same

Radiant heat printed circuit board and method of fabricating the same