Chin Nguk Lai

Person

Bayan Lepas, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Tape chip on lead using paste die attach material
- Patent number 9,679,831
- Issue date Jun 13, 2017
- Cypress Semiconductor Corporation
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip positioning for multi-chip packaging
- Patent number 9,196,608
- Issue date Nov 24, 2015
- Cypress Semiconductor Corporation
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip positioning in multi-chip package
- Patent number 8,901,756
- Issue date Dec 2, 2014
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thin multi chip stack package with film on wi...
- Patent number 8,680,686
- Issue date Mar 25, 2014
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitch bump stacking design for overall package size reduction for...
- Patent number 8,357,563
- Issue date Jan 22, 2013
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of package height in a stacked die configuration
- Patent number 7,932,131
- Issue date Apr 26, 2011
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL
- Publication number 20170047272
- Publication date Feb 16, 2017
- CYPRESS SEMICONDUCTOR CORPORATION
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP POSITIONING IN MULTI-CHIP PACKAGE
- Publication number 20150056726
- Publication date Feb 26, 2015
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package Assembly with Improved Bond Wire Separation
- Publication number 20140191417
- Publication date Jul 10, 2014
- SPANSION LLC
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Positioning in Multi-Chip Package
- Publication number 20140175613
- Publication date Jun 26, 2014
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...
- Publication number 20120038059
- Publication date Feb 16, 2012
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...
- Publication number 20110316158
- Publication date Dec 29, 2011
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of package height in a stacked die configuration
- Publication number 20090115033
- Publication date May 7, 2009
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS

Chin Nguk Lai

Person

Patents Grantslast 30 patents

Tape chip on lead using paste die attach material

Multi-chip package assembly with improved bond wire separation

Method of chip positioning for multi-chip packaging

Chip positioning in multi-chip package

Method and system for thin multi chip stack package with film on wi...

Stitch bump stacking design for overall package size reduction for...

Reduction of package height in a stacked die configuration

Patents Applicationslast 30 patents

TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL

CHIP POSITIONING IN MULTI-CHIP PACKAGE

Multi-Chip Package Assembly with Improved Bond Wire Separation

Chip Positioning in Multi-Chip Package

STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...

METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...

Reduction of package height in a stacked die configuration