Chiu Wen Lee

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Linyuan Hsiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Test assembly for integrated circuit package
- Patent number 6,788,092
- Issue date Sep 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Test assembly for integrated circuit package
- Publication number 20040155241
- Publication date Aug 12, 2004
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING
Information Patent Application
Test assembly for integrated circuit package
- Publication number 20030193344
- Publication date Oct 16, 2003
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING