Chong Yee Tong

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device having an encapsulated semiconductor...
- Patent number 9,852,961
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple chips and substrate in metal cap
- Patent number 8,916,958
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Double sided cooling chip package and method of manufacturing the same
- Publication number 20160005675
- Publication date Jan 7, 2016
- INFINEON TECHNOLOGIES AG
- Chong Yee TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device
- Publication number 20150061108
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP
- Publication number 20100270667
- Publication date Oct 28, 2010
- INFINEON TECHNOLOGIES AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS