Christoph Liebl

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Munich, DE

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated leadless package having an at least partially exposed...
- Patent number 10,978,378
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Leadless Package Having an at Least Partially Exposed...
- Publication number 20190189542
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS