Chun Ho Fan

Person

Hong Kong, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wafer-level semiconductor packages
- Patent number 10,115,579
- Issue date Oct 30, 2018
- ASM Technology Singapore Pte. Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with pre-molded substrate
- Patent number 10,014,187
- Issue date Jul 3, 2018
- Ubotic Company Limited
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated circuit (IC) package having a p...
- Patent number 9,520,306
- Issue date Dec 13, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for holding multiple semiconductor devices during thermocomp...
- Patent number 9,484,241
- Issue date Nov 1, 2016
- ASM Technology Singapore Pte. Ltd.
- Man Chung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
- Patent number 8,330,270
- Issue date Dec 11, 2012
- UTAC Hong Kong Limited
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with contact standoff
- Patent number 7,595,225
- Issue date Sep 29, 2009
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components such as thin array plastic packages and proce...
- Patent number 7,482,690
- Issue date Jan 27, 2009
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple leadframe laminated IC package
- Patent number 7,449,771
- Issue date Nov 11, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin ball grid array package
- Patent number 7,439,099
- Issue date Oct 21, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with partially exposed contact pads and...
- Patent number 7,411,289
- Issue date Aug 12, 2008
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier and method of fabricating same
- Patent number 7,410,830
- Issue date Aug 12, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package and process for manufacturing same
- Patent number 7,372,151
- Issue date May 13, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an integrated circuit package with reduced...
- Patent number 7,371,610
- Issue date May 13, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package that includes a collapsible spacer for sepa...
- Patent number 7,315,080
- Issue date Jan 1, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 7,271,032
- Issue date Sep 18, 2007
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier
- Patent number 7,270,867
- Issue date Sep 18, 2007
- ASAT Ltd.
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an integrated circuit package
- Patent number 7,247,526
- Issue date Jul 24, 2007
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating pad frame and integrated circuit package
- Patent number 7,232,755
- Issue date Jun 19, 2007
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a leadless plastic chip carrier
- Patent number 7,226,811
- Issue date Jun 5, 2007
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and process for fabricating the same
- Patent number 7,091,581
- Issue date Aug 15, 2006
- ASAT Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin leadless plastic chip carrier
- Patent number 7,081,403
- Issue date Jul 25, 2006
- ASAT Ltd.
- Mohan Kirloskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with standoff contacts and die attach...
- Patent number 7,049,177
- Issue date May 23, 2006
- Asat LTD
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a leadless plastic chip carrier
- Patent number 7,033,517
- Issue date Apr 25, 2006
- Asat LTD
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an enhanced thermal dissipation integrated...
- Patent number 7,015,072
- Issue date Mar 21, 2006
- ASAT Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin leadless plastic chip carrier
- Patent number 7,009,286
- Issue date Mar 7, 2006
- ASAT Ltd.
- Mohan Kirloskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 6,995,460
- Issue date Feb 7, 2006
- ASAT Ltd.
- Neil McLellan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless plastic chip carrier with etch back pad singulation
- Patent number 6,989,294
- Issue date Jan 24, 2006
- Asat, Ltd.
- Neil McLellan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package and process for manufacturing same
- Patent number 6,987,032
- Issue date Jan 17, 2006
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor semiconductor package and method of manufacturing the same
- Patent number 6,982,491
- Issue date Jan 3, 2006
- ASAT Ltd.
- Chun Ho Fan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing ball grid array package
- Patent number 6,979,594
- Issue date Dec 27, 2005
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD O...
- Publication number 20190164875
- Publication date May 30, 2019
- ASM Technology Singapore Pte Ltd
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190006339
- Publication date Jan 3, 2019
- ASM Technology Singapore Pte Ltd
- Hon Shing, John LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WAFER-LEVEL SEMICONDUCTOR PACKAGES
- Publication number 20180151342
- Publication date May 31, 2018
- ASM Technology Singapore Pte Ltd
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE
- Publication number 20170221726
- Publication date Aug 3, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20160013075
- Publication date Jan 14, 2016
- Geraldine Tsui Yee LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR HOLDING MULTIPLE SEMICONDUCTOR DEVICES DURING THERMOCOMP...
- Publication number 20150027616
- Publication date Jan 29, 2015
- Man Chung CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slicer circuit capable of judging input signal correctly
- Publication number 20080107209
- Publication date May 8, 2008
- Yu Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Super-regenerative receiver with damping resistor
- Publication number 20060264196
- Publication date Nov 23, 2006
- Chun-Wah Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Ball grid array package and process for manufacturing same
- Publication number 20060223229
- Publication date Oct 5, 2006
- ASAT Ltd.
- Mohan Kirloskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package
- Publication number 20050077613
- Publication date Apr 14, 2005
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an enhanced thermal dissipation integrated...
- Publication number 20050003585
- Publication date Jan 6, 2005
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
- Publication number 20040046241
- Publication date Mar 11, 2004
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced thermal dissipation integrated circuit package and method...
- Publication number 20030178719
- Publication date Sep 25, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an encapsulated integrated circuit package
- Publication number 20030143776
- Publication date Jul 31, 2003
- Serafin Pedron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated integrated circuit package and method of manufacturing...
- Publication number 20030143781
- Publication date Jul 31, 2003
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced thermal dissipation integrated circuit package and method...
- Publication number 20030011064
- Publication date Jan 16, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL LAMINATED IC PACKAGE
- Publication number 20020068378
- Publication date Jun 6, 2002
- ASAT Ltd.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless plastic chip carrier with etch back pad singulation and di...
- Publication number 20010014538
- Publication date Aug 16, 2001
- ASAT Ltd.
- Kin Pui Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Chun Ho Fan

Person

Patents Grantslast 30 patents

Method for manufacturing wafer-level semiconductor packages

Cavity package with pre-molded substrate

Method of fabricating an integrated circuit (IC) package having a p...

Device for holding multiple semiconductor devices during thermocomp...

Integrated circuit package having a plurality of spaced apart pad p...

Leadless plastic chip carrier with contact standoff

Electronic components such as thin array plastic packages and proce...

Multiple leadframe laminated IC package

Thin ball grid array package

Integrated circuit package with partially exposed contact pads and...

Leadless plastic chip carrier and method of fabricating same

Ball grid array package and process for manufacturing same

Process for fabricating an integrated circuit package with reduced...

Ball grid array package that includes a collapsible spacer for sepa...

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier

Process for fabricating an integrated circuit package

Process for fabricating pad frame and integrated circuit package

Process for fabricating a leadless plastic chip carrier

Integrated circuit package and process for fabricating the same

Thin leadless plastic chip carrier

Leadless plastic chip carrier with standoff contacts and die attach...

Method of fabricating a leadless plastic chip carrier

Method of manufacturing an enhanced thermal dissipation integrated...

Thin leadless plastic chip carrier

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier with etch back pad singulation

Ball grid array package and process for manufacturing same

Sensor semiconductor package and method of manufacturing the same

Process for manufacturing ball grid array package

Patents Applicationslast 30 patents

PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD O...

THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE

METHOD FOR MANUFACTURING WAFER-LEVEL SEMICONDUCTOR PACKAGES

CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE

INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME

DEVICE FOR HOLDING MULTIPLE SEMICONDUCTOR DEVICES DURING THERMOCOMP...

Slicer circuit capable of judging input signal correctly

Super-regenerative receiver with damping resistor

Ball grid array package and process for manufacturing same

Integrated circuit package

Method of manufacturing an enhanced thermal dissipation integrated...

Method of manufacturing enhanced thermal dissipation integrated cir...

Enhanced thermal dissipation integrated circuit package and method...

Method of manufacturing an encapsulated integrated circuit package

Encapsulated integrated circuit package and method of manufacturing...

Enhanced thermal dissipation integrated circuit package and method...

METAL FOIL LAMINATED IC PACKAGE

Leadless plastic chip carrier with etch back pad singulation and di...