Daisuke Furukawa

Follow

Person

Chikuma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Double-side polishing method
- Patent number 9,987,721
- Issue date Jun 5, 2018
- Masanao Sasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing apparatus
- Patent number 9,108,289
- Issue date Aug 18, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and double-side polishing apparatus
- Patent number 8,834,230
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDE POLISHING METHOD
- Publication number 20150217425
- Publication date Aug 6, 2015
- Shin-Etsu Handotai Co., Ltd.
- Masanao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20150031271
- Publication date Jan 29, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20110130073
- Publication date Jun 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING