David Chong Sook Lim

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Penang, MY

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Patents Applicationslast 30 patents

Information Patent Application
Packaging system for die-up connection of a die-down oriented integ...
- Publication number 20020140070
- Publication date Oct 3, 2002
- Fairchild Semiconductor Corp.
- David Chong Sook Lim
- H01 - BASIC ELECTRIC ELEMENTS