Dexter Reynoso

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,817,407
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded lead frames for semiconductor packages
- Patent number 11,699,647
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,355,460
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-clip structure for die bonding
- Patent number 11,189,592
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground land for singulated ball grid array
- Patent number 6,597,188
- Issue date Jul 22, 2003
- ST Assembly Test Service Ltd.
- Dexter Reynoso
- G01 - MEASURING TESTING
Information Patent Grant
Ground pin concept for singulated ball grid array
- Patent number 6,525,553
- Issue date Feb 25, 2003
- ST Assembly Test Services Ltd.
- Dexter Reynoso
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20240030148
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Kok Kiat KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230307328
- Publication date Sep 28, 2023
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20220336340
- Publication date Oct 20, 2022
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220278060
- Publication date Sep 1, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220181280
- Publication date Jun 9, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Clip Structure for Die Bonding
- Publication number 20200105707
- Publication date Apr 2, 2020
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP
- Publication number 20100181675
- Publication date Jul 22, 2010
- INFINEON TECHNOLOGIES AG
- Dexter Reynoso
- H01 - BASIC ELECTRIC ELEMENTS

Dexter Reynoso

Person

Patents Grantslast 30 patents

Molded semiconductor package with high voltage isolation

Pre-molded lead frames for semiconductor packages

Molded semiconductor package with high voltage isolation

Multi-clip structure for die bonding

Ground land for singulated ball grid array

Ground pin concept for singulated ball grid array

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION

MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION

Multi-Clip Structure for Die Bonding

SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP