Duk Ho Hong

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming integrated circuit devices having metal intercon...
- Patent number 7,435,673
- Issue date Oct 14, 2008
- Samsung Electronics Co., Ltd.
- Kyoung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit devices having metal intercon...
- Patent number 7,282,451
- Issue date Oct 16, 2007
- Samsung Electronics Co., Ltd.
- Duk Ho Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of forming integrated circuit devices having metal intercon...
- Publication number 20070072406
- Publication date Mar 29, 2007
- Kyoung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming integrated circuit devices having metal intercon...
- Publication number 20070045123
- Publication date Mar 1, 2007
- Duk Ho Hong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR