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E. William Bruce II
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Luenenburg, MA, US
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last 30 patents
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Patent Grant
High density memory array packaging
Patent number
5,191,404
Issue date
Mar 2, 1993
Digital Equipment Corporation
Andrew L. Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High-density double-sided multi-string memory module with resistor...
Patent number
5,164,916
Issue date
Nov 17, 1992
Digital Equipment Corporation
Andrew L. Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR