Eslam Abdelhamid

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Patents Grantslast 30 patents

Information Patent Grant
Pre-packaged chip, method of manufacturing a pre-packaged chip, sem...
- Patent number 12,315,835
- Issue date May 27, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level inverting buck-boost converter architecture
- Patent number 12,101,030
- Issue date Sep 24, 2024
- Infineon Technologies Austria AG
- Eslam Abdelhamid
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-level power converter architecture
- Patent number 11,962,249
- Issue date Apr 16, 2024
- Infineon Technologies Austria AG
- Eslam Abdelhamid
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
FLYING CAPACITOR BALANCING
- Publication number 20250141366
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Eslam Mohammed Mohammed ABDELHAMID
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LAMINATE CARRIER WITH EMBEDDED ELECTRONIC COMPONENT ELECTRICALLY CO...
- Publication number 20250105129
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Urban MEDIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL POWER CONVERTER ARCHITECTURE
- Publication number 20230412090
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Eslam ABDELHAMID
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-LEVEL INVERTING BUCK-BOOST CONVERTER ARCHITECTURE
- Publication number 20230216407
- Publication date Jul 6, 2023
- Infineon Technologies Austria AG
- Eslam ABDELHAMID
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRE-PACKAGED CHIP, METHOD OF MANUFACTURING A PRE-PACKAGED CHIP, SEM...
- Publication number 20220230982
- Publication date Jul 21, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS