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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for molding semiconductor, molding film and...
- Patent number 11,702,520
- Issue date Jul 18, 2023
- LG Chem, Ltd.
- Minsu Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND...
- Publication number 20230295388
- Publication date Sep 21, 2023
- LG CHEM, LTD.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INSULATING LAYER FOR SEMICONDUCTOR PACKAGE...
- Publication number 20200395288
- Publication date Dec 17, 2020
- LG CHEM, LTD.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND...
- Publication number 20200347194
- Publication date Nov 5, 2020
- LG CHEM, LTD.
- Minsu JEONG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...