Gun-Ig Jeung

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Polishing pad of CMP equipment for polishing a semiconductor wafer
- Patent number 7,160,181
- Issue date Jan 9, 2007
- Samsung Electronics Co., Ltd.
- Gun-Ig Jeung
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
BRUSH AND METHOD FOR CLEANING A SUBSTRATE AND SCRUBBER EMPLOYING TH...
- Publication number 20120247508
- Publication date Oct 4, 2012
- Samsung Electronics Co., Ltd.
- Gun-Ig Jeung
- B08 - CLEANING
Information Patent Application
Polishing pad of CMP equipment for polishing a semiconductor wafer
- Publication number 20040255521
- Publication date Dec 23, 2004
- Gun-Ig Jeung
- B24 - GRINDING POLISHING