Hidehisa UMINO

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,742,278
- Issue date Aug 29, 2023
- Kyocera Corporation
- Kazushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,024,572
- Issue date Jun 1, 2021
- Kyocera Corporation
- Hidehisa Umino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 9,848,491
- Issue date Dec 19, 2017
- Kyocera Corporation
- Nobuhiro Ueki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220077049
- Publication date Mar 10, 2022
- KYOCERA CORPORATION
- Kazushi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20200075472
- Publication date Mar 5, 2020
- KYOCERA CORPORATION
- Hidehisa UMINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20170071058
- Publication date Mar 9, 2017
- KYOCERA CORPORATION
- Nobuhiro UEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR