Hideko ANDOU

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with step portion having shear surfaces
- Patent number 9,355,941
- Issue date May 31, 2016
- Renesas Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with step portion having shear surfaces
- Patent number 9,111,922
- Issue date Aug 18, 2015
- Renesas Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having lead free solders between semiconductor...
- Patent number 8,310,049
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH STEP PORTION HAVING SHEAR SURFACES
- Publication number 20150325502
- Publication date Nov 12, 2015
- RENESAS ELECTRONICS CORPORATION
- Hideko ANDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140103510
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Hideko ANDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having lead free solders between semiconductor...
- Publication number 20100181666
- Publication date Jul 22, 2010
- NEC Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FLAT PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20100078803
- Publication date Apr 1, 2010
- NEC ELECTRONICS CORPORATION
- HIDEKO ANDOU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...